CN201608989U - Surface cladding structure for shell of electronic device - Google Patents
Surface cladding structure for shell of electronic device Download PDFInfo
- Publication number
- CN201608989U CN201608989U CN2009200942799U CN200920094279U CN201608989U CN 201608989 U CN201608989 U CN 201608989U CN 2009200942799 U CN2009200942799 U CN 2009200942799U CN 200920094279 U CN200920094279 U CN 200920094279U CN 201608989 U CN201608989 U CN 201608989U
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- electronic device
- device housing
- ground
- shell
- metal
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Abstract
The utility model relates to a surface cladding structure for a shell of an electronic device, which belongs to the electric field. The shell is a substrate, a decorative zone which is formed through laser engraving or etching is arranged on the surface of the substrate in a tying manner, and a cladding layer is arranged on the substrate in a tying manner. Electrified coating, anodizing, paint spraying or electroplating can be further carried out on the cladding layer. As the surface cladding structure is adopted, the shell of the electronic device is beautified in appearance and has a texture of high compact metal; moreover, the purpose of obtaining needed colors and patterns can be achieved.
Description
Technical field
The utility model relates to electric information, and particularly a kind of surperficial coating structure of electronic device housing refers to a kind of surperficial coating structure that makes the electronic device housing that body surface has the high compaction metal-like especially.
Background technology
The shell of general electronic installation all is to be basic material with plastics mostly, but plastic material in visually with texture on relatively poor, for the electronic installation plastic casing is produced metal-like is arranged, and in the plastic electroplating mode at this plastic casing surface deposition layer of metal layer, as the 6045866th invention of United States Patent (USP).Only can be more inactive metals such as copper, nickel in the metal level that employed plastic electroplating mode is plated, and as desire when using on the plastic electroplating mode as more active metal such as aluminium, its degree of difficulty is higher, again and this plastic electroplating mode itself the step of process comparatively complicated, loaded down with trivial details, to such an extent as to the low and spent cost height of production efficiency.So the dealer is just arranged in order to promote the texture of electronic device housing, it is electronic product shell that Bing has abandoned with plastics, researched and developed with metal materials such as aluminium matter, magnesia or almags as electronic device housing, electronic device housing by metal material, to promote the texture of product, had very widely in all kinds of electronic devices at present and used, for example phone housing or PDA shell or the like.
Above-mentioned electronic device housing exists following point and disappearance to wait to improve when using:
During metal materials such as electronic device housing material selection aluminium matter, magnesia or almag, though the texture of product promotes, but because the metal material characteristic makes so, the ice-cold sense of touch of people is given on its surface, the surface does not have pattern, and color too dullness is not attractive in appearance, and the surface metal material is easily because ingress of air causes oxidation.
The utility model content
Main purpose of the present utility model is: a kind of surperficial coating structure of electronic device housing is provided, and too dullness is attractive in appearance inadequately to solve the prior art color of shell, and the metal surface material is because ingress of air causes the problem of oxidation.
This electronic device housing also can reach by following coating structure and have high compaction metal-like effect, this coating structure system is a metal substrate with the electronic device housing, this surface of bottom material system is provided with one with laser engraving is handled or the etch processes mode forms decorative zones, and be to be provided with one coating on this ground with electricity, anode treatment, spray paint and handle or electroplating processes one coating layer wherein, wherein this ground can be steel, iron, stainless steel, red metal, brass, titanium alloy, carbon fiber, magnesium alloy, aluminium alloy, almag, wherein a kind of of metal materials such as tinplate or conductive material.
Advantage of the present utility model is, by laser engraving handle to be handled or the etch processes mode forms decorative zones and electricity coating processing, anode treatment, spray paint and handle or wherein a kind of coating layer of electroplating processes is constituted and has the enhancement aesthetic appearance, and the high compaction metal-like, and can obtain to have simultaneously the purpose of required color and pattern.
Description of drawings
Fig. 1 is the stereogram of the utility model preferred embodiment.
Fig. 2 is the cutaway view of the utility model preferred embodiment.
Fig. 3 is the flow chart of the utility model preferred embodiment.
Fig. 4 is the schematic flow sheet of the utility model preferred embodiment.
Embodiment
Shown in accompanying drawing 1 and accompanying drawing 2, be the stereogram and the cutaway view of the utility model preferred embodiment, find out that by knowing among the figure the utility model electronic device housing is a ground 10, this ground 10 can be steel, iron, stainless steel, red metal, brass, titanium alloy, carbon fiber, magnesium alloy, aluminium alloy, almag, metal materials such as tinplate or conductive material wherein one, and be provided with a decorative zones 11 in these ground 10 surface systems, this decorative zones 11 is to form with laser engraving processing or etch processes mode, and be to be provided with one the coating layer 12 of coating way on this ground 10 with electricity, by this, promoted aesthetic appearance, and have the high compaction metal-like, and can obtain to have simultaneously the purpose of required color and pattern.
Wherein, this coating layer 12 be also can be in order to anode treatment, spray paint and handle or electroplating processes carrying out coating and handle wherein.
Form design by said structure, be described as follows with regard to use situation of the present utility model, shown in accompanying drawing 3 and accompanying drawing 4, be the flow chart and the schematic flow sheet of the utility model preferred embodiment, find out that by knowing among the figure surperficial coating structure of the present utility model is to carry out according to the following step:
(a) carrying out laser engraving on ground 10 surfaces handles or etch processes;
(b) on ground 10 surfaces, be formed with decorative zones 11;
(c) on ground 10 surfaces, carry out electricity coating, anode treatment, spray paint handle or electroplating processes wherein one; And
(d) on ground 10 surfaces, be formed with coating layer 12.
It can be handled these ground 10 surfaces or etch processes with laser engraving, go up formation decorative zones 11 in ground 10 surfaces, can further impose electricity coating processing, anode treatment, spray paint and handle or the setting of electroplating processes, make these ground 10 surfaces then be formed with coating layer 12, and then be accomplished to form on the ground 10 that laser engraving is handled or etched decoration zone 11 and carried out that electricity coating, anode treatment, spray paint processing or electroplating processes are formed with coating layer 12, make it have the purpose of high compaction metal-like.
Its above-mentioned laser engraving processing claims laser carved again, promptly is the taper light beam that is emitted by radium-shine rifle, has assembled lot of energy in the place that light beam is concentrated, and can make material melts, causes and cuts off or the effect of engraving.And electricity be to allow powder pigment evenly be attached to the surface with energising, but the surface can be as powder do not struck off by sharp object and just drops, and can provide anti-corrosion, a kind of processing of pigmentable on ground 10 again.
Its above-mentioned anode treatment is a kind of electrolytic process, and the sheet metal effect that coated metal is provided is just like anode, and electrolyte is generally the solion that is plating metal, and the plated body effect is then just like negative electrode.Behind the input voltage, attract the metal ion in the electrolyte to swim between anode and negative electrode, promptly plating on it after the reduction to negative electrode.
Claims (4)
1. the surperficial coating structure of an electronic device housing, it is characterized in that: this electronic device housing is a ground, and this surface of bottom material is provided with a decorative zones, this decorative zones system handles processing mode with laser engraving and forms, and is provided with a coating layer in this ground.
2. the surperficial coating structure of a kind of electronic device housing according to claim 1 is characterized in that: wherein this ground can be wherein a kind of of metal materials such as steel, iron, stainless steel, red metal, brass, titanium alloy, carbon fiber, magnesium alloy, aluminium alloy, almag, tinplate or conductive material.
3. the surperficial coating structure of a kind of electronic device housing according to claim 1 is characterized in that: wherein these coating series of strata can be further coating, anode treatment, are sprayed paint and handle or wherein a kind of of electroplating processes with electricity.
4. the surperficial coating structure of a kind of electronic device housing according to claim 1, it is characterized in that: wherein this decorative zones can be further with etch processes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200942799U CN201608989U (en) | 2009-08-28 | 2009-08-28 | Surface cladding structure for shell of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200942799U CN201608989U (en) | 2009-08-28 | 2009-08-28 | Surface cladding structure for shell of electronic device |
Publications (1)
Publication Number | Publication Date |
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CN201608989U true CN201608989U (en) | 2010-10-13 |
Family
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Family Applications (1)
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CN2009200942799U Expired - Fee Related CN201608989U (en) | 2009-08-28 | 2009-08-28 | Surface cladding structure for shell of electronic device |
Country Status (1)
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CN (1) | CN201608989U (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104275977A (en) * | 2013-07-08 | 2015-01-14 | 深圳市联懋塑胶有限公司 | Mosaic pattern manufacturing process |
CN106476511A (en) * | 2016-12-07 | 2017-03-08 | 吴庆言 | A kind of metal earphone shell embossment forming method |
CN107683047A (en) * | 2017-10-30 | 2018-02-09 | 广东欧珀移动通信有限公司 | Method for producing shell, casing substrate, housing and electronic equipment |
CN108882604A (en) * | 2018-08-01 | 2018-11-23 | Oppo广东移动通信有限公司 | metal composite semi-finished product and its manufacturing method, shell and electronic device |
CN109514174A (en) * | 2011-09-30 | 2019-03-26 | 苹果公司 | Laser-graining and anodized surface processing |
CN110722845A (en) * | 2019-10-23 | 2020-01-24 | 苏州欧邦塑胶有限公司 | Alloy stainless steel film and production method thereof |
CN111954408A (en) * | 2017-09-29 | 2020-11-17 | Oppo广东移动通信有限公司 | Shell manufacturing method, shell and electronic equipment |
-
2009
- 2009-08-28 CN CN2009200942799U patent/CN201608989U/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109514174A (en) * | 2011-09-30 | 2019-03-26 | 苹果公司 | Laser-graining and anodized surface processing |
CN104275977A (en) * | 2013-07-08 | 2015-01-14 | 深圳市联懋塑胶有限公司 | Mosaic pattern manufacturing process |
CN106476511A (en) * | 2016-12-07 | 2017-03-08 | 吴庆言 | A kind of metal earphone shell embossment forming method |
CN111954408A (en) * | 2017-09-29 | 2020-11-17 | Oppo广东移动通信有限公司 | Shell manufacturing method, shell and electronic equipment |
CN111954408B (en) * | 2017-09-29 | 2022-02-22 | Oppo广东移动通信有限公司 | Shell manufacturing method, shell and electronic equipment |
CN107683047A (en) * | 2017-10-30 | 2018-02-09 | 广东欧珀移动通信有限公司 | Method for producing shell, casing substrate, housing and electronic equipment |
CN108882604A (en) * | 2018-08-01 | 2018-11-23 | Oppo广东移动通信有限公司 | metal composite semi-finished product and its manufacturing method, shell and electronic device |
CN108882604B (en) * | 2018-08-01 | 2020-07-24 | Oppo广东移动通信有限公司 | Method for manufacturing metal composite semi-finished product |
CN110722845A (en) * | 2019-10-23 | 2020-01-24 | 苏州欧邦塑胶有限公司 | Alloy stainless steel film and production method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101013 Termination date: 20170828 |
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CF01 | Termination of patent right due to non-payment of annual fee |