CN201599666U

CN201599666U - Ultra-thin medium-sized LED backlight source

Info

Publication number: CN201599666U
Application number: CN2010201047106U
Authority: CN
Inventors: 曹俊威; 冯超; 郑湛金; 彭国兴; 罗勇
Original assignee: Shenzhen Hadbest Electronics Co ltd
Current assignee: Shenzhen Hadbest Electronics Co ltd
Priority date: 2010-01-26
Filing date: 2010-01-26
Publication date: 2010-10-06
Anticipated expiration: 2020-01-26

Abstract

The utility model relates to the technical field of a display device, in particular to an ultra-thin medium-sized LED backlight source which comprises a rubber frame. A light guide plate, an LED circuit board and an optical diaphragm are arranged in the rubber frame; an LED lamp is arranged on one face of the LED circuit board, and a strip-shaped rubber support is arranged on the inner wall of the rubber frame; and the light guide plate, the LED circuit board and the optical diaphragm are arranged on the strip-shaped rubber support. As the strip-shaped rubber support is arranged on the inner wall of the rubber frame, other backlight assemblies can be supported in the rubber frame; therefore, a lower iron frame can be cancelled, and the function of the original lower iron frame can be replaced by the strip-shaped rubber support at the bottom part of the rubber frame, thereby reducing the thickness of the backlight source. As the lower iron frame in the present backlight source is saved, the ultra-thin medium-sized LED backlight source is thinner and is lower in cost.

Description

A kind of ultra-thin middle size LED-backlit source

Technical field

The utility model relates to the display technology field, relates in particular to a kind of ultra-thin middle size LED-backlit source.

Background technology

As shown in Figure 1, existing backlight source module is made of last chase 1, glue frame 3, following chase 9 and other backlight assemblies, described glue frame 3 is close to down chase 9 edges, other backlight assemblies place this glue frame 3, described upward chase 1 snaps together with following chase 9 other backlight assembly locks is tied up therein, and described backlight assembly comprises glass 2, bright enhancement film 4, diffusion barrier 5, LGP 6, led circuit plate 7 and reflectance coating 8.

At present, because the restriction of LGP forming technique and equipment, the thickness of common described LGP designs between 2mm-3mm usually.What simultaneously, described LED adopted is the packing forms of the thicker top light emitting of thickness.Therefore, at present middle size backlight is limited because of technology and material, usually with the whole Thickness Design of module backlight more than 5mm, wherein the thickness of LGP is normally more than the 2mm, add the inwall of gluing frame and shelves wall thickness degree and the thickness of chase and blooming piece up and down, basically fix because of the thickness of TFTLCD glass again, reach more than the 5mm so the thickness of final entire module just adds up.

The utility model content

For addressing the above problem, the utility model provides size LED-backlit source in ultra-thin that a kind of thickness is thinner, cost is lower.

For achieving the above object, the technical solution adopted in the utility model is:

A kind of ultra-thin middle size LED-backlit source, comprise the glue frame, be provided with LGP, led circuit plate and blooming piece in the described glue frame, the one side of described led circuit plate is provided with the LED lamp, described glue frame inwall is provided with the holder of strip glue, and described LGP, led circuit plate and blooming piece are arranged on this strip glue holder.

For the backlight that makes production is thinner, described light guide plate is smaller or equal to 1 millimeter.

For the backlight that makes production is thinner, described LED lamp is the luminous paster LED lamp of side, and described led circuit plate is the FPC FPC.

More firm for the backlight assembling that makes production, described glue frame inwall and LGP outward flange all are provided with the firm grab that cooperatively interacts.

Of the present utility model by the mode of strip glue holder is set at glue frame inwall, other backlight assembly bracketings in the glue frame, can will be descended the chase cancellation like this, the bottom strip glue holder that the former function of chase is down transferred to the glue frame comes bracketing, thus the attenuate backlight.

As from the foregoing, the utility model has omitted the following chase in the existing backlight, thereby makes the utility model thinner, and cost is lower.

And, the utility model is applied on the relevant terminal, as digital frame, P-DVD, PMP etc. can bring thinner design for it, make the more creative and characteristics of end product, thereby can make end product promote value and can promote the self-value of module backlight, and satisfy the trend and the demand of the design of ultra-thinization of modern product.

Description of drawings

Accompanying drawing described herein is used to provide further understanding of the present utility model, constitutes the application's a part, does not constitute to improper qualification of the present utility model, in the accompanying drawings:

Fig. 1 is existing back light source structure explosive view;

Fig. 2 is an adhesive frame structure schematic diagram of the present utility model;

Fig. 3 is a led circuit plate of the present utility model;

Fig. 4 is the utility model back light source structure explosive view.

Number in the figure:

1, goes up chase 2, glass

3, glue frame 4, bright enhancement film

5, diffusion barrier 6, LGP

7, led circuit plate 8, reflectance coating

9, following chase 10, LED lamp

11, strip glue holder 12, shading strip

The specific embodiment

Describe the utility model in detail below in conjunction with accompanying drawing and specific embodiment, be used for explaining the utility model in this illustrative examples of the present utility model and explanation, but not as to qualification of the present utility model.

As shown in Figure 2, for attenuate backlight thickness, glue frame 3 inwalls of the present utility model are provided with strip glue holder 11, and described strip glue holder 11 can be lived other backlight assembly bracketings, can will descend chase 9 cancellations like this, the bottom strip glue holder 11 that the former function of chase 9 is down transferred to glue frame 3 comes bracketing.

As shown in Figure 3, because the luminous paster LED of side is thinner than the luminous packaged LED thickness in existing top, for further attenuate backlight thickness, the LED lamp 10 that the utility model adopts is the luminous paster LED lamp of side, is the FPC FPC in order to cooperate the described led circuit plate 7 of the luminous paster LED lamp of side.

In order to do thinlyyer, LGP 6 thickness that the utility model adopts are less than 1 millimeter, and described LGP 6 adopts tonnages to make at the high speed board injection machine more than 100 tons, can overcome the problem that moulding and optics after the prior art LGP attenuate all should the property difficulties.

In order to assemble more firmly, described glue frame 3 inwalls and LGP 6 outward flanges all are provided with the firm grab that cooperatively interacts.

As shown in Figure 4, a kind of ultra-thin middle size LED-backlit source of the utility model, main material then is made up of LGP 6, glue frame 3, last chase 1, diffusion barrier 5, bright enhancement film 4, reflectance coating 8, shading strip 12, led circuit plate 7.

The disclosed ultra-thin middle size LED-backlit source of present embodiment, be to improve the super-thin backlight that forms by ultra-thin light guide board, slim glue frame and FPC FPC and the luminous paster LED of side, LGP and blooming piece are assemblied in the glue frame of bottom glue holder, therefore following chase saves, and the thickness of module backlight can be accomplished below the 4mm by the technical scheme that embodiment introduced.

More than technical scheme that the utility model embodiment is provided be described in detail, used specific case herein principle and the embodiment of the utility model embodiment are set forth, the explanation of above embodiment only is applicable to the principle that helps to understand the utility model embodiment; Simultaneously, for one of ordinary skill in the art, according to the utility model embodiment, the part that on the specific embodiment and range of application, all can change, in sum, this description should not be construed as restriction of the present utility model.

Claims

One kind ultra-thin in size LED-backlit source, comprise the glue frame, be provided with LGP, led circuit plate and blooming piece in the described glue frame, the one side of described led circuit plate is provided with the LED lamp, it is characterized in that: described glue frame inwall is provided with the holder of strip glue, and described LGP, led circuit plate and blooming piece are arranged on this strip glue holder.
2. ultra-thin middle size LED-backlit source according to claim 1, it is characterized in that: described light guide plate is smaller or equal to 1 millimeter.
3. ultra-thin middle size LED-backlit source according to claim 1, it is characterized in that: described LED lamp is the luminous paster LED lamp of side, and described led circuit plate is the FPC FPC.
4. ultra-thin middle size LED-backlit source according to claim 1, it is characterized in that: described glue frame inwall and LGP outward flange all are provided with the firm grab that cooperatively interacts.