CN201599666U - An ultra-thin medium-sized LED backlight - Google Patents
An ultra-thin medium-sized LED backlight Download PDFInfo
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- CN201599666U CN201599666U CN2010201047106U CN201020104710U CN201599666U CN 201599666 U CN201599666 U CN 201599666U CN 2010201047106 U CN2010201047106 U CN 2010201047106U CN 201020104710 U CN201020104710 U CN 201020104710U CN 201599666 U CN201599666 U CN 201599666U
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Abstract
本实用新型涉及显示器技术领域,尤其涉及一种超薄中尺寸LED背光源,包括胶框,所述胶框中设有导光板、LED电路板和光学膜片,所述LED电路板的一面上设有LED灯,所述胶框内壁设置有条状胶托,所述导光板、LED电路板和光学膜片设置于该条状胶托之上。本实用新型的通过在胶框内壁设置条状胶托的方式,将其他背光组件撑托在胶框中,这样即可将下铁框取消,将原下铁框的功能交由胶框的底部条状胶托来撑托,从而减薄背光源。本实用新型省略了现有背光源中的下铁框,从而使得本实用新型更薄,成本更低。
The utility model relates to the technical field of displays, in particular to an ultra-thin and medium-sized LED backlight source, comprising a plastic frame in which a light guide plate, an LED circuit board and an optical film are arranged, and one side of the LED circuit board is An LED lamp is provided, and a strip-shaped plastic holder is provided on the inner wall of the plastic frame, and the light guide plate, the LED circuit board and the optical film are arranged on the strip-shaped rubber holder. In the utility model, other backlight components are supported in the plastic frame by arranging a strip-shaped rubber holder on the inner wall of the plastic frame, so that the lower iron frame can be canceled, and the function of the original lower iron frame is handed over to the bottom of the rubber frame The strip-shaped rubber support is used to support it, thereby reducing the thickness of the backlight. The utility model omits the lower iron frame in the existing backlight source, thereby making the utility model thinner and lower in cost.
Description
技术领域technical field
本实用新型涉及显示器技术领域,尤其涉及一种超薄中尺寸LED背光源。The utility model relates to the technical field of displays, in particular to an ultra-thin and medium-sized LED backlight source.
背景技术Background technique
如图1所示,现有的背光源模组由上铁框1、胶框3、下铁框9和其他背光组件构成,所述胶框3紧贴在下铁框9边缘,其他背光组件置于该胶框3中,所述上铁框1与下铁框9扣合在一起将其他背光组件锁缚在其中,所述背光组件包括玻璃2、增光膜4、扩散膜5、导光板6、LED电路板7和反射膜8。As shown in Figure 1, the existing backlight module consists of an upper iron frame 1, a
目前,由于导光板成型技术与设备的限制,通常所述导光板的厚度通常设计在2mm-3mm之间。同时,所述LED采用的是厚度更厚的顶部发光的封装形式。因此,目前中尺寸背光源因技术和材料的受限,通常将背光模组的整个厚度设计在5mm以上,其中导光板的厚度通常是2mm以上,加上胶框的内壁及档墙厚度和上下铁框及光学膜片的厚度,又因TFTLCD玻璃的厚度基本上是固定的,所以最终整个模组的厚度累计起来就达到5mm以上。At present, due to the limitation of light guide plate molding technology and equipment, the thickness of the light guide plate is generally designed to be between 2 mm and 3 mm. At the same time, the LED adopts a thicker top-emission packaging form. Therefore, the current medium-sized backlight is limited by technology and materials. The overall thickness of the backlight module is usually designed to be more than 5mm, and the thickness of the light guide plate is usually more than 2mm. The thickness of the iron frame and optical film, and because the thickness of the TFTLCD glass is basically fixed, so the cumulative thickness of the entire module finally reaches more than 5mm.
实用新型内容Utility model content
为解决上述问题,本实用新型提供了一种厚度更薄、成本更低的超薄中尺寸LED背光源。In order to solve the above problems, the utility model provides an ultra-thin medium-sized LED backlight source with thinner thickness and lower cost.
为实现上述目的,本实用新型采用的技术方案是:For realizing above-mentioned object, the technical scheme that the utility model adopts is:
一种超薄中尺寸LED背光源,包括胶框,所述胶框中设有导光板、LED电路板和光学膜片,所述LED电路板的一面上设有LED灯,所述胶框内壁设置有条状胶托,所述导光板、LED电路板和光学膜片设置于该条状胶托之上。An ultra-thin medium-sized LED backlight source, comprising a plastic frame, a light guide plate, an LED circuit board and an optical film are arranged in the plastic frame, an LED lamp is arranged on one side of the LED circuit board, and the inner wall of the plastic frame A strip-shaped rubber holder is provided, and the light guide plate, LED circuit board and optical film are arranged on the strip-shaped rubber holder.
为了使生产的背光源更薄,所述导光板厚度小于等于1毫米。In order to make the produced backlight source thinner, the thickness of the light guide plate is less than or equal to 1 mm.
为了使生产的背光源更薄,所述LED灯为侧发光贴片LED灯,所述LED电路板为FPC柔性线路板。In order to make the produced backlight source thinner, the LED lamp is a side-emitting SMD LED lamp, and the LED circuit board is an FPC flexible circuit board.
为了使生产的背光源组装更加牢固,所述胶框内壁与导光板外边缘都设置有相互配合的稳固卡钩。In order to make the assembly of the produced backlight more firm, the inner wall of the plastic frame and the outer edge of the light guide plate are provided with stable hooks that cooperate with each other.
本实用新型的通过在胶框内壁设置条状胶托的方式,将其他背光组件撑托在胶框中,这样即可将下铁框取消,将原下铁框的功能交由胶框的底部条状胶托来撑托,从而减薄背光源。In the utility model, other backlight components are supported in the plastic frame by arranging a strip-shaped rubber holder on the inner wall of the plastic frame, so that the lower iron frame can be canceled, and the function of the original lower iron frame is handed over to the bottom of the rubber frame The strip-shaped rubber support is used to support it, thereby reducing the thickness of the backlight.
由上可知,本实用新型省略了现有背光源中的下铁框,从而使得本实用新型更薄,成本更低。It can be known from the above that the utility model omits the lower iron frame in the existing backlight source, thus making the utility model thinner and lower in cost.
而且,将本实用新型运用到相应的终端上,如数码像框,P-DVD,PMP等,可以为其带来更薄的设计,使终端产品更有创意和特点,可以使终端产品提升价值从而可以提升背光模组的自身价值,并满足了现代产品超薄化设计的趋势和需求。Moreover, applying the utility model to corresponding terminals, such as digital photo frame, P-DVD, PMP, etc., can bring a thinner design to it, make the terminal products more creative and characteristic, and can increase the value of the terminal products so that The self-value of the backlight module can be enhanced, and the trend and demand of ultra-thin design of modern products can be met.
附图说明Description of drawings
此处所说明的附图用来提供对本实用新型的进一步理解,构成本申请的一部分,并不构成对本实用新型的不当限定,在附图中:The accompanying drawings described here are used to provide a further understanding of the utility model, constitute a part of the application, and do not constitute an improper limitation of the utility model. In the accompanying drawings:
图1为现有背光源结构爆炸图;Figure 1 is an exploded view of the existing backlight structure;
图2为本实用新型的胶框结构示意图;Fig. 2 is the structural representation of the plastic frame of the present utility model;
图3为本实用新型的LED电路板;Fig. 3 is the LED circuit board of the present utility model;
图4为本实用新型背光源结构爆炸图。Fig. 4 is an exploded diagram of the structure of the backlight source of the present invention.
图中标号:Labels in the figure:
1、上铁框 2、玻璃1.
3、胶框 4、增光膜3.
5、扩散膜 6、导光板5.
7、LED电路板 8、反射膜7.
9、下铁框 10、LED灯9.
11、条状胶托 12、遮光条11.
具体实施方式Detailed ways
下面将结合附图以及具体实施例来详细说明本实用新型,在此本实用新型的示意性实施例以及说明用来解释本实用新型,但并不作为对本实用新型的限定。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments. The schematic embodiments and descriptions of the utility model are used to explain the utility model, but not as a limitation to the utility model.
如图2所示,为了减薄背光源厚度,本实用新型的胶框3内壁设置有条状胶托11,所述条状胶托11可将其他背光组件撑托住,这样即可将下铁框9取消,将原下铁框9的功能交由胶框3的底部条状胶托11来撑托。As shown in Figure 2, in order to reduce the thickness of the backlight source, the inner wall of the
如图3所示,由于侧发光贴片LED比现有顶发光封装LED厚度更薄,为了进一步减薄背光源厚度,本实用新型采用的LED灯10为侧发光贴片LED灯,为了配合侧发光贴片LED灯所述LED电路板7为FPC柔性线路板。As shown in Figure 3, since the side-emitting SMD LED is thinner than the existing top-emitting packaged LED, in order to further reduce the thickness of the backlight source, the
为了做得更薄,本实用新型采用的导光板6厚度小于1毫米,所述导光板6采用吨位在100吨以上的高速机台注塑机制成,即可克服现有技术导光板减薄之后成型和光学均应性困难的问题。In order to make it thinner, the thickness of the
为了装配得更稳固,所述胶框3内壁与导光板6外边缘都设置有相互配合的稳固卡钩。In order to assemble more stably, the inner wall of the
如图4所示,本实用新型一种超薄中尺寸LED背光源,主要材料则由导光板6、胶框3、上铁框1、扩散膜5、增光膜4、反射膜8、遮光条12、LED电路板7组成。As shown in Figure 4, the utility model is an ultra-thin medium-sized LED backlight source, the main materials are
本实施例公开的超薄中尺寸LED背光源,是通过超薄导光板、薄型胶框与FPC柔性线路板及侧发光贴片LED改进而成的超薄背光源,导光板和光学膜片装配在有底部胶托的胶框中,下铁框因此而省掉,通过实施例所介绍的技术方案可以将背光模组的厚度做到4mm以下。The ultra-thin medium-sized LED backlight disclosed in this embodiment is an ultra-thin backlight improved by an ultra-thin light guide plate, a thin plastic frame, an FPC flexible circuit board, and a side-emitting patch LED. The light guide plate and the optical film are assembled In the plastic frame with the bottom rubber support, the lower iron frame is therefore omitted, and the thickness of the backlight module can be reduced to less than 4 mm through the technical solution introduced in the embodiment.
以上对本实用新型实施例所提供的技术方案进行了详细介绍,本文中应用了具体个例对本实用新型实施例的原理以及实施方式进行了阐述,以上实施例的说明只适用于帮助理解本实用新型实施例的原理;同时,对于本领域的一般技术人员,依据本实用新型实施例,在具体实施方式以及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本实用新型的限制。The technical solutions provided by the embodiments of the present invention have been introduced in detail above. In this paper, specific examples have been used to illustrate the principles and implementation methods of the embodiments of the present invention. The descriptions of the above embodiments are only applicable to help understand the present invention. The principle of the embodiment; at the same time, for those of ordinary skill in the art, according to the embodiment of the present invention, there will be changes in the specific implementation and the scope of application. Utility model restrictions.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201047106U CN201599666U (en) | 2010-01-26 | 2010-01-26 | An ultra-thin medium-sized LED backlight |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010201047106U CN201599666U (en) | 2010-01-26 | 2010-01-26 | An ultra-thin medium-sized LED backlight |
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| CN201599666U true CN201599666U (en) | 2010-10-06 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478185A (en) * | 2010-11-23 | 2012-05-30 | 深圳市瀚达美电子有限公司 | LED backlight module with ultrathin inductive touch function |
| CN102954395A (en) * | 2011-08-30 | 2013-03-06 | 昆山顺景光电有限公司 | LED (Light-Emitting Diode) backlight source |
| CN103792727A (en) * | 2012-10-31 | 2014-05-14 | 苹果公司 | Light guide plate with integrated reflector for display backlight |
| CN104392670A (en) * | 2014-12-10 | 2015-03-04 | 京东方科技集团股份有限公司 | Unit display screen, spliced display screen and display device |
| CN108538199A (en) * | 2018-05-24 | 2018-09-14 | 蚌埠国显科技有限公司 | A kind of ultra-thin screen structure |
-
2010
- 2010-01-26 CN CN2010201047106U patent/CN201599666U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478185A (en) * | 2010-11-23 | 2012-05-30 | 深圳市瀚达美电子有限公司 | LED backlight module with ultrathin inductive touch function |
| CN102954395A (en) * | 2011-08-30 | 2013-03-06 | 昆山顺景光电有限公司 | LED (Light-Emitting Diode) backlight source |
| CN103792727A (en) * | 2012-10-31 | 2014-05-14 | 苹果公司 | Light guide plate with integrated reflector for display backlight |
| US10061158B2 (en) | 2012-10-31 | 2018-08-28 | Apple Inc. | Light guide plate with integrated reflector for display backlight |
| CN104392670A (en) * | 2014-12-10 | 2015-03-04 | 京东方科技集团股份有限公司 | Unit display screen, spliced display screen and display device |
| CN108538199A (en) * | 2018-05-24 | 2018-09-14 | 蚌埠国显科技有限公司 | A kind of ultra-thin screen structure |
| CN108538199B (en) * | 2018-05-24 | 2024-04-26 | 蚌埠国显科技有限公司 | Ultrathin screen structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101006 Termination date: 20150126 |
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| EXPY | Termination of patent right or utility model |
