CN201590981U - Electronic equipment hot-swapping mechanism with cooling system - Google Patents

Abstract

The utility model provides an electronic equipment hot plug mechanism with a heat removal system, which comprises a heat radiation cold plate (1) with heat radiation components arranged therein, as well as an electronic device substrate box (5) used for mounting electronic equipment, wherein a socket (3) is arranged on the heat radiation cold plate (1), a plug (4) corresponding to the socket (3) is arranged on the electronic device substrate box (5), and the heat radiation cold plate (1) and the electronic device substrate box (5) are connected together via a clamping structure which enables the contact surfaces of the heat radiation cold plate (1) and the electronic device substrate box (5) to be clung to each other. During the plugging, the utility model avoids damage or deformation, difficult insertion and loose contact of the plug and the socket due to rough collision and rough contact therebetween, ensures tight contact of the inserted heat radiation cold plate and the electronic device substrate box for good heat-transfer property guarantee, and realizes small insertion and extraction force and easy push-pull during the whole plugging process.

Description

Electronic equipment hot-swapping mechanism with cooling system

technical field

The utility model belongs to the technical field of hot plugging and unplugging of electronic equipment, in particular to a hot plugging mechanism for electronic equipment with a cooling system

Background technique

Hot-swapping refers to plugging and unplugging circuit boards safely under power without affecting the operation of the system. This is mainly to facilitate maintenance or reconfiguration of the system. Hot-swap technology has a wide range of applications, such as: base stations, redundant array of disks (RAID), remote access servers, network routers, network switches, and ISDN systems.

The development trend of electronic equipment is that the feature size of electronic devices is getting smaller and smaller, but this also makes the heat flux of electronic devices larger and larger, and electronic devices are prone to overheating. According to statistics, the main cause of electronic equipment failure is overheating damage. Therefore, designing a safe and reliable heat dissipation system is an important basis for ensuring the performance and reliability of electronic equipment. The design of the heat dissipation mechanism is one of the key factors affecting the heat dissipation efficiency of the heat dissipation system.

At present, there are many researches on the heat dissipation technology of electronic equipment, such as the Chinese patent "a two-phase loop heat dissipation system driven by waste heat" (patent publication No. 101346058), the Chinese patent "radiation system for computing and processing equipment and the use of the heat dissipation system Devices" (Patent Publication No. 101308398), etc., and other electronic devices that need to have a heat dissipation system.

Therefore, the application of heat dissipation technology in the hot swapping of electronic equipment will have a high value research prospect.

Utility model content

The purpose of the utility model is to provide a hot-swappable structure of electronic equipment with a heat dissipation system with good heat transfer performance, safety and reliability.

In order to achieve the above purpose, the technical scheme adopted is as follows:

A hot-swapping mechanism for electronic equipment with a heat dissipation system, comprising a heat dissipation cold plate with heat dissipation components inside, and an electronic device substrate box for installing electronic equipment, a socket is arranged on the heat dissipation cold plate, and an electronic device substrate box is provided There is a plug corresponding to the socket, and the heat dissipation cold plate and the electronic device substrate box are connected together by a clamping structure, and the clamping structure makes the contact surfaces of the heat dissipation cold plate and the electronic device substrate box close to each other.

The utility model adopts the clamping structure, which can conveniently and quickly connect the heat dissipation cold plate and the electronic device substrate box, so that the electronic equipment installed on the electronic device substrate box can dissipate heat through the heat dissipation cold plate.

In the above technical solution, the clamping structure is that a dovetail groove is provided on the heat dissipation cold plate, and a dovetail matching the dovetail groove is provided on the electronic device substrate box.

Further, the front section between the dovetail groove and the dovetail is clearance fit, while the rear section is transition fit or elastic interference fit. Through the gap fit, the installation between the heat dissipation cold plate and the electronic device substrate box can be facilitated, and the transition fit or elastic interference fit at the rear section can effectively ensure the tightness of the connection between the heat dissipation cold plate and the electronic device substrate box , and the tightness of the contact surface.

Further, the upper and lower sides of the heat dissipation cold plate are provided with dovetail grooves, wherein the dovetail grooves on one side are linear, and the dovetail grooves on the other side are stepped, and the upper and lower sides of the electronic device substrate box are provided with corresponding dovetails, The dovetail on one side is straight and the dovetail on the other side is reverse stepped. The linear dovetail groove plays the role of slide rail and guide, and the stepped dovetail groove plays the role of pressing and guiding.

The front end of the step-shaped dovetail groove of the heat dissipation cold plate is provided with a small gap for easy insertion of the electronic device substrate box. A small notch is provided at the front end of the stepped dovetail groove to facilitate the easy insertion of the electronic device substrate box.

Elastic grooves are provided at both ends of the reverse stepped dovetail of the electronic device substrate box. It is convenient for installation when interference fit is used and fastening after installation.

Further, the end of the heat dissipation cold plate is provided with a slider groove, a slider is placed in the slider groove, the socket is fixedly installed on the slider, and there is a gap between the slider and the slider groove, the gap Make the slider slide properly in the chute.

The up, down, left, and right displacements of the sliding block sliding in the chute are smaller than the fillet radius of the edge of the socket of the plug socket or the dimension of the chamfered right-angled side of the front end of the plug.

The structure of the slider and the chute is used because when the dovetail of the electronic device substrate box with the plug is inserted into the socket along the dovetail groove slide rail on the heat dissipation cold plate, the axial position of the plug and the socket will inevitably deviate. However, because the slider can slide properly in all directions in space and the front edge of the plug is rounded or beveled, the socket can adjust its position by itself with the help of insertion force, thus avoiding damage or deformation of the plug and socket due to hard collision and hard contact, and difficult insertion and poor contact etc. After the plug is inserted into the socket, the slider is in a suspended position, so that the slider can still slide properly when the heat dissipation contact surface is pressed, so as to prevent it from hindering the pressing action of the heat dissipation contact surface.

The utility model is also provided with a slider cover for covering the slider, and the slider cover is fixed on the outer surface of the slider groove by screws.

The utility model is also provided with a box cover for covering the electronic device substrate box.

The utility model mainly starts from the heat dissipation of the electronic equipment in the mobile communication base station cabinet, and is designed according to the structural characteristics and heat dissipation requirements of the electronic equipment in the mobile communication base station cabinet, so that the hard collision and hard collision between the plug and the socket can be avoided when plugging and unplugging. Contact will cause damage or deformation of the plug and socket, difficult insertion and poor contact, etc., and it can ensure that the heat dissipation cold plate is in close contact with the electronic device substrate box after insertion to ensure good heat transfer performance, and realize small insertion force and the entire insertion process. Easy to plug and unplug.

Description of drawings

Fig. 1 is a structural exploded view of the utility model;

Fig. 2 is the heat dissipation cold plate in Fig. 1;

Figure 3 shows the stepped structure of the dovetail groove and the edge of the notch structure of the heat dissipation cold plate;

Fig. 4 is the chute structure on the heat dissipation cold plate;

Fig. 5 is the electronic device substrate box in Fig. 1;

Fig. 6 is the side of the ladder structure of the electronic device substrate box;

Fig. 7 is the gap section where the dovetail of the electronic device substrate box is put into the dovetail groove of the heat dissipation cold plate;

Fig. 8 is the insertion section of the electronic device substrate box in the gap;

Figure 9 shows that the plug starts to be inserted;

Fig. 10 is that the stepped compression structure begins to compress the electronic device substrate box and the heat dissipation cold plate;

Figure 11 The process of inserting the plug into the socket is completed;

Fig. 12 is the elastic interference dovetail ladder structure of the electronic device substrate box according to the second embodiment.

Detailed ways

Below in conjunction with accompanying drawing, the utility model is described further.

The structure of the first embodiment of the utility model is shown in the accompanying drawings 1-11, which is an exploded view of the structure of the hot-swapping mechanism of the electronic equipment with the heat dissipation system of the utility model, including a stepped dovetail groove, a chute and a heat dissipation pipe The heat dissipation cold plate 1, the slider 2, the socket 3, the plug 4, the electronic device substrate box 5 with a stepped dovetail structure, the substrate box cover 6 and the slider cover plate 7, etc. Metal pipes or heat pipes are cast into the inside of the heat dissipation cold plate 1, and the purpose is to take away the heat generated by electronic devices through them, and the heat dissipation cold plate 1 is fixedly installed in the cabinet. The rear end of the heat dissipation cold plate 1 is designed with a step, and a chute is processed on the step for placing the slider 2. The slider 2 is placed in the slider groove, and the slider 2 is placed in the chute and can be placed in the chute. Sliding properly inside, the sliding displacement up, down, left, and right is smaller than the fillet radius of the edge of the socket of the plug socket or the dimension of the chamfered right-angled side of the front end of the plug. The socket 3 is fixedly mounted on the slider 2 . The electronic equipment is installed in the electronic device substrate box 5 with a dovetail, and the plug 4 is installed and fixed on the front plug seat of the electronic device substrate box 5 .

The heat dissipation cold plate 1 and the electronic device substrate box 5 are connected together by a clamping structure, and the clamping structure in this embodiment is as follows:

For the dovetail grooves on the cooling plate 1, one side of the dovetail grooves is linear, and the other side of the dovetail grooves is stepped. The side of the linear dovetail groove acts as a slide rail and a guide, and is placed below. The stepped dovetail groove acts as a pressing and guiding function, and the edge is placed above. There is a short notch at the front end of the stepped dovetail groove, so that the electronic device substrate box 5 can be easily put in. The dovetail structure on the electronic device substrate box 5 corresponds to the structure of the heat dissipation cold plate 1. One side of the dovetail is linear, and the other side is reversely stepped. Both the circuit board and the electronic device are installed on the electronic device substrate box 5, and the part for installing the electronic device is designed as a box type, and is covered with a box cover 6. The characteristic of the compression structure of the heat dissipation contact surface is that one side of the dovetail groove is designed as a small step shape, and one side of the dovetail plate is designed as a small reverse step shape, so that the front part of the dovetail inserted into the dovetail groove, the dovetail groove and the dovetail It is a gap fit, and the step contact in the last small section is a transition fit. In this way, the contact surface between the heat dissipation cold plate 1 and the electronic device substrate box 5 can be pressed tightly by the contact force of the dovetail groove and the inclined surface of the dovetail, so as to ensure that they have good thermal conductivity, and the plugging force is small and easy to plug in and out.

Accompanying drawing 2 is the schematic structural diagram of the heat dissipation cold plate 1 in accompanying drawing 1; Accompanying drawing 3 is the structural diagram of the dovetail ladder structure and the notch structure side of the heat dissipation cold plate 1; Accompanying drawing 4 is the chute on the heat dissipation cold plate 1 The structural representation of structure; Accompanying drawing 5 is the structural representation of electronic device substrate box 5 in accompanying drawing 1; Accompanying drawing 6 is the structural representation of the stepped structure side of electronic device substrate case 5; In order to make the dovetail of electronic device substrate case 5 can Easily put it into the dovetail groove of the heat dissipation cold plate 1, deliberately opened a gap at the front end of the dovetail groove of the heat dissipation cold plate 1 shown in accompanying drawing 3, and accompanying drawing 7 shows that the dovetail of the electronic device substrate box 5 is put into the heat dissipation cold plate 1 Schematic diagram of the structure of the notch section of the dovetail groove; in order to make the electronic device substrate box 5 easy to insert, the dovetail of the middle section and the dovetail groove are matched by a clearance fit, and Fig. 8 is a structural schematic diagram of the electronic device substrate box in the gap insertion section; in order to make the plug 4 When plugged into the socket 3, there will be no hard collision and hard contact. When the plug 4 is inserted, the slider 2 on which the socket 3 is installed can slide properly in the chute. FIG. The contact surface of the electronic device substrate box 5 and the heat dissipation cold plate 1 is in close contact, and the last section of insertion begins to contact with the stepped structure that acts as a pressing force. Figure 10 shows that the stepped pressing structure uses the contact force of the dovetail slope to start pressing the electronic device substrate Schematic diagram of the structure of the box 5 and the heat dissipation cold plate 1. At this time, the slider 2 can still slide properly in the chute so as not to affect the pressing effect; The insertion force of the compression section minimizes the displacement of the transition fit section. FIG. 11 is a schematic diagram of the completed process of inserting the plug 4 into the socket 3 .

As another embodiment, its structure is basically the same as that of the first embodiment, except that the fit of the contact between the dovetail of the compression section and the two ends of the dovetail groove is changed from transition fit to elastic interference fit. Fig. 12 is an embodiment of the elastic interference fit, in which an elastic groove is processed at the position where both ends of the stepped dovetail of the electronic device substrate box are pressed and contacted.

Claims (10)

1. A hot-swapping mechanism for electronic equipment with a heat dissipation system, characterized in that it includes a heat dissipation cold plate (1) that is provided with a heat dissipation component inside, and an electronic device substrate box (5) for installing electronic equipment, and the heat dissipation cold plate (1) is provided with a socket (3), and the electronic device substrate box (5) is provided with a plug (4) corresponding to the socket (3), and the heat dissipation cold plate (1) and the electronic device substrate box (5) adopt The clamping structure is connected together, and the clamping structure makes the contact surfaces of the heat dissipation cold plate (1) and the electronic device substrate box (5) close to each other. 2. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 1, characterized in that the snap-in structure is provided with a dovetail groove on the heat dissipation cold plate (1), and on the electronic device substrate box (5) Set the dovetail matching with the dovetail groove on the top. 3. The hot-swappable mechanism for electronic equipment with heat dissipation system according to claim 2, characterized in that the front section between the matched dovetail groove and the dovetail is clearance fit, and the rear section is transition fit or elastic interference fit. 4. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 2 or 3, characterized in that the upper and lower sides of the heat dissipation cold plate (1) are provided with dovetail grooves, wherein the dovetail grooves on one side are linear, and the other The dovetail groove on one side is stepped, and the upper and lower sides of the electronic device substrate box (5) are provided with corresponding dovetails, wherein the dovetail on one side is linear, and the dovetail on the other side is reverse stepped. 5. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 4, characterized in that the front end of the stepped dovetail groove of the heat dissipation cold plate (1) is provided with a small section to facilitate the easy placement of the electronic device substrate box (5). entry gap. 6. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 4, characterized in that elastic grooves are provided at both ends of the reverse stepped dovetail of the electronic device substrate box (5). 7. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 1, characterized in that the end of the heat dissipation cold plate (1) is provided with a slider groove, and a slider (2) is placed in the slider groove ), the socket (3) is fixedly installed on the slide block (2), and there is a gap between the slide block (2) and the slide block groove, which enables the slide block (2) to slide properly in the slide groove. 8. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 7, characterized in that the up, down, left, and right displacements of the slider (2) sliding in the chute are smaller than the fillet radius of the edge of the plug socket socket or the plug Front chamfer square edge dimension. 9. The electronic equipment hot-swappable mechanism with cooling system according to claim 7 or 8, characterized in that it is also provided with a slider cover (7) for covering the slider (2), the slider cover ( 7) It is fixed on the outer surface of the slider groove by screws. 10. The hot-swapping mechanism for electronic equipment with a heat dissipation system according to claim 1, characterized in that a box cover (6) for covering the electronic device substrate box (5) is also provided.

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