CN201590981U - Electronic equipment hot plug mechanism with heat removal system - Google Patents
Electronic equipment hot plug mechanism with heat removal system Download PDFInfo
- Publication number
- CN201590981U CN201590981U CN2009202652216U CN200920265221U CN201590981U CN 201590981 U CN201590981 U CN 201590981U CN 2009202652216 U CN2009202652216 U CN 2009202652216U CN 200920265221 U CN200920265221 U CN 200920265221U CN 201590981 U CN201590981 U CN 201590981U
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- China
- Prior art keywords
- electronic device
- device substrate
- substrate box
- cold plate
- slide block
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 claims description 45
- 238000001816 cooling Methods 0.000 claims description 22
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 abstract description 8
- 230000037431 insertion Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 230000006378 damage Effects 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000000605 extraction Methods 0.000 abstract 1
- 238000013461 design Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an electronic equipment hot plug mechanism with a heat removal system, which comprises a heat radiation cold plate (1) with heat radiation components arranged therein, as well as an electronic device substrate box (5) used for mounting electronic equipment, wherein a socket (3) is arranged on the heat radiation cold plate (1), a plug (4) corresponding to the socket (3) is arranged on the electronic device substrate box (5), and the heat radiation cold plate (1) and the electronic device substrate box (5) are connected together via a clamping structure which enables the contact surfaces of the heat radiation cold plate (1) and the electronic device substrate box (5) to be clung to each other. During the plugging, the utility model avoids damage or deformation, difficult insertion and loose contact of the plug and the socket due to rough collision and rough contact therebetween, ensures tight contact of the inserted heat radiation cold plate and the electronic device substrate box for good heat-transfer property guarantee, and realizes small insertion and extraction force and easy push-pull during the whole plugging process.
Description
Technical field
The utility model belongs to electronic equipment hot plug technology field, particularly relates to a kind of electronic equipment hot swap structure with cooling system
Background technology
Hot plug is meant under the condition of not influence system operation, charged and plug circuit board safely.This mainly is the maintenance of system for convenience or reconfigures.Hot plug technology has a wide range of applications, for example: base station, redundant arrays of inexpensive disks (RAID), remote access server, network router, network switch and ISDN system etc.
The trend of electronic equipment development is that the characteristic size of electronic device is more and more littler, but this makes that also the density of heat flow rate of electronic device is increasing, and electronic device is overheated easily.According to statistics, the main cause of electronic equipment inefficacy was a cause thermal damage.Therefore, the reliable cooling system of design safety is the important foundation that guarantees the electronic equipment performance reliability.The design of cooling mechanism is to influence one of key factor of cooling system radiating efficiency.
At present more for the research of the heat dissipation technology of electronic equipment, " be used for the cooling system of calculating treatmenting equipment and adopt the equipment of this cooling system " described kind equipments such as (patent publication No. 101308398) as Chinese patent " a kind of used heat drive two-phase loop cooling system " (patent publication No. 101346058), Chinese patent, and other need have the electronic equipment of cooling system.
So heat dissipation technology is applied in the electronic equipment hot plug, will has the research prospect of higher-value.
The utility model content
The purpose of this utility model is to provide a kind of good heat-transfer, the safe and reliable electronic equipment hot plug structure with cooling system.
To achieve these goals, the technical scheme of employing is as follows:
A kind of electronic equipment hot swap structure with cooling system, comprise that inside is provided with the heat dissipation cold plate of thermal component, and the electronic device substrate box that is used to install electronic equipment, heat dissipation cold plate is provided with socket, the electronic device substrate box is provided with the plug corresponding with socket, described heat dissipation cold plate and electronic device substrate box adopt interface arrangment to link together, and this interface arrangment is close to the contact-making surface of heat dissipation cold plate and electronic device substrate box mutually.
The utility model adopts interface arrangment quickly and easily heat dissipation cold plate and electronic device substrate box to be linked together, thereby the electronic equipment that is installed on the electronic device substrate box just can dispel the heat by heat dissipation cold plate.
In the technique scheme, described interface arrangment is for to be provided with dovetail groove on heat dissipation cold plate, and the dovetail that setting matches with dovetail groove on the electronic device substrate box.
Further, the leading portion between dovetail groove and the dovetail is a matched in clearance, and back segment then is interference fits or elasticity interference fit.Pass through matched in clearance, can make things convenient for the installation between heat dissipation cold plate and the electronic device substrate box, and interference fits or elasticity interference fit by back segment are then guaranteed the compactness that is connected between heat dissipation cold plate and the electronic device substrate box and the close property of contact-making surface effectively.
Further, the both sides up and down of described heat dissipation cold plate are provided with dovetail groove, wherein Yi Bian dovetail groove is a linear, the dovetail groove of another side is a stairstepping, the both sides up and down of described electronic device substrate box are provided with corresponding dovetail, wherein Yi Bian dovetail is a linear, and the dovetail of another side is reverse stairstepping.The linear dovetail groove plays slide rail and guide effect, and the stairstepping dovetail groove rises and compresses and guide effect.
The stairstepping dovetail groove front end of described heat dissipation cold plate is provided with a bit of breach that the electronic device substrate box is put into easily of being convenient to.The a bit of breach that the front end of stairstepping dovetail groove is provided with is convenient to the electronic device substrate box and is put into easily.
The reverse stairstepping dovetail two ends of described electronic device substrate box are provided with elastic groove.Be convenient to the installation when adopting interference fit and install after fastening.
Further, described heat dissipation cold plate end is provided with a slide block slot, is placed with slide block in the slide block slot, and described socket is fixedly mounted on the slide block, leaves the space between slide block and the slide block slot, and this space makes slide block suitably to slide in chute.
The displacement up and down that described slide block slides in chute is less than the radius of corner or the plug head chamfering right-angle side size at plugs and sockets socket edge.
Adopting slide block and chute structure, is because when the dovetail groove slide rail of dovetail on heat dissipation cold plate of the electronic device substrate box that has plug inserted socket, the axial location of plug and socket had deviation unavoidably.But because slide block can be fillet or oblique angle in suitable slip of space all directions and plug head edge, socket can be adjusted the position voluntarily by insertion force, thereby has avoided causing the plugs and sockets damage or being out of shape, inserting difficulty and loose contact etc. with contacting firmly because of hard collision.Behind the plug insertion socket, slide block is in overhead positions, and slide block still can suitably slide when the heat radiation contact-making surface compresses like this, avoids it to hinder the action that compresses of heat radiation contact-making surface.
The utility model also is provided with the slide block lid that is used to cover slide block, and described slide block lid is fixed on the outer surface of slide block slot by screw.
The utility model also is provided with the lid that is used to cover the electronic device substrate box.
The utility model mainly is the electronic equipment dissipating heat from the mobile communication base station rack, require design according to the design feature of the rack inner electronic equipment of mobile communication base station and heat radiation, can avoid the hard collision between plug and the socket when making plug and contact firmly and cause plugs and sockets to damage or be out of shape, insertion difficulty and loose contact etc., it is closely good with the assurance heat transfer property with contacting of electronic device substrate box to guarantee to insert the back heat dissipation cold plate again, and realizes the little and whole plug process plug of contact engaging and separating force easily.
Description of drawings
Fig. 1 is STRUCTURE DECOMPOSITION figure of the present utility model;
Fig. 2 is the heat dissipation cold plate among Fig. 1;
Fig. 3 is the dovetail groove hierarchic structure and the breach structure limit of heat dissipation cold plate;
Fig. 4 is the chute structure on the heat dissipation cold plate;
Fig. 5 is the electronic device substrate box among Fig. 1;
Fig. 6 is the hierarchic structure limit of electronic device substrate box;
Fig. 7 puts into the gap segments of heat dissipation cold plate dovetail groove for the dovetail of electronic device substrate box;
Fig. 8 is that the electronic device substrate box inserts section in the gap;
Fig. 9 begins to insert for plug;
Figure 10 begins to compress electronic device substrate box and heat dissipation cold plate for the ladder compressing structure;
Figure 11 plug insertion socket process is finished;
Figure 12 is the electronic device substrate box elasticity interference dovetail hierarchic structure of second embodiment.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
The structure of first embodiment of the utility model is shown in accompanying drawing 1-11, for the utlity model has the electronic equipment hot swap structure STRUCTURE DECOMPOSITION figure of cooling system, comprise heat dissipation cold plate 1, slide block 2, socket 3, plug 4, electronic device substrate box 5, substrate lid 6 and the slide block cover plate 7 etc. that have ladder dovetail groove, chute and include radiating tube with ladder dovetail structure.Heat dissipation cold plate 1 inside is cast into metal tube or heat pipe, and purpose is by them the heat that electronic device produces to be taken away, and heat dissipation cold plate 1 is fixedly mounted in the rack.The back end design of heat dissipation cold plate 1 has a step, be processed with a chute on the step, be used to lay slide block 2, slide block 2 is placed in the slide block slot, slide block 2 is placed in the chute and can suitably slides in chute, and its slide displacement up and down is less than the radius of corner or the plug head chamfering right-angle side size at plugs and sockets socket edge.Socket 3 is fixedly mounted on the slide block 2.Electronic equipment is installed in the electronic device substrate box 5 with dovetail, and plug 4 is fixed on the electronic device substrate box 5 front end connector assemblies.
Heat dissipation cold plate 1 and electronic device substrate box 5 adopt interface arrangment to link together, and the interface arrangment in the present embodiment is as follows:
Dovetail groove on the heat dissipation cold plate 1, wherein dovetail groove is rectilinear on one side, the another side dovetail groove is step-like.Linear dovetail trough rim plays slide rail and guide effect, places the below.The stairstepping dovetail groove rises and compresses and guide effect, and the limit places the top.Step-like dovetail groove front end has a bit of breach, so that electronic device substrate box 5 is put into easily.Dovetail structure on the electronic device substrate box 5, corresponding with heat dissipation cold plate 1 structure, on one side dovetail is rectilinear, another side is oppositely step-like.Circuit board and electronic device all are installed on the electronic device substrate box 5, and the electronic device partial design will be installed become boxlike, build with lid 6.The characteristics of heat radiation contact-making surface compressing structure are that one side groove with dovetail groove is designed to a bit of step-like, one side dovetail of coattail board is designed to a bit of oppositely step-like, make the leading portion that inserts dovetail groove at dovetail, be matched in clearance between dovetail groove and the dovetail, and the contact of in the end a bit of ladder is an interference fits.Can utilize the inclined-plane contact force of dovetail groove and dovetail that the contact-making surface of heat dissipation cold plate 1 with electronic device substrate box 5 compressed like this, guarantee that their heat conductivilitys are good, and contact engaging and separating force be little, the plug easy.
Accompanying drawing 2 is the structural representation of the heat dissipation cold plate 1 in the accompanying drawing 1; Accompanying drawing 3 is the dovetail groove hierarchic structure of heat dissipation cold plate 1 and the structural representation on breach structure limit; Accompanying drawing 4 is the structural representation of the chute structure on the heat dissipation cold plate 1; Accompanying drawing 5 is the structural representation of the electronic device substrate box 5 in the accompanying drawing 1; Accompanying drawing 6 is the structural representation on the hierarchic structure limit of electronic device substrate box 5; Can easily put into the dovetail groove of heat dissipation cold plate 1 for the dovetail that makes electronic device substrate box 5, specially opened a breach at the dovetail groove front end of heat dissipation cold plate 1 shown in the accompanying drawing 3, accompanying drawing 7 is put into the structural representation of the gap segments of heat dissipation cold plate 1 dovetail groove for the dovetail of electronic device substrate box 5; For electronic device substrate box 5 is inserted easily, the dovetail of interlude is a matched in clearance with cooperating of dovetail groove, and Fig. 8 is the electronic device substrate box inserts section in the gap a structural representation; Do not produce hard collision and contact firmly when making plug 4 insert sockets 3, when plug 4 insertions, the slide block 2 of mounting receptacle 3 can suitably slip in chute, and Fig. 9 is the structural representation of plug 4 when beginning to insert socket 3; For electronic device substrate box 5 is contacted closely with the contact-making surface of heat dissipation cold plate 1, the hierarchic structure that last segment that inserts plays pressuring action begins contact, Figure 10 begins to compress the structural representation of electronic device substrate box 5 and heat dissipation cold plate 1 for the ladder compressing structure utilizes the contact force on dovetail inclined-plane, and at this moment slide block 2 still can suitably slide in chute in order to avoid influence pressuring action; The cooperation of this embodiment dovetail and contact position, dovetail groove two ends is an interference fits; In order to reduce the insertion force of hold-down segment, reduce the displacement of interference fits section as far as possible, Figure 11 inserts the structural representation that socket 3 processes are finished for plug 4.
As another embodiment, the structure basically identical of its structure and first embodiment just changes the dovetail of hold-down segment and the cooperation of contact position, dovetail groove two ends into the elasticity interference fit from interference fits.Figure 12 is a kind of embodiment of elasticity interference fit, and it is to compress position contacting at electronic device substrate box ladder dovetail two ends, processes elastic groove.
Claims (10)
1. electronic equipment hot swap structure with cooling system, it is characterized in that comprising that inside is provided with the heat dissipation cold plate of thermal component (1), and the electronic device substrate box (5) that is used to install electronic equipment, heat dissipation cold plate (1) is provided with socket (3), electronic device substrate box (5) is provided with the plug (4) corresponding with socket (3), described heat dissipation cold plate (1) and electronic device substrate box (5) adopt interface arrangment to link together, and this interface arrangment is close to the heat dissipation cold plate (1) and the contact-making surface of electronic device substrate box (5) mutually.
2. the electronic equipment hot swap structure with cooling system according to claim 1 is characterized in that described interface arrangment is that dovetail groove is set, and goes up the dovetail that setting matches with dovetail groove at electronic device substrate box (5) on heat dissipation cold plate (1).
3. the electronic equipment hot swap structure with cooling system according to claim 2 is characterized in that the dovetail groove and the leading portion between the dovetail that match are matched in clearance, and back segment then is interference fits or elasticity interference fit.
4. according to claim 2 or 3 described electronic equipment hot swap structures with cooling system, the both sides up and down that it is characterized in that heat dissipation cold plate (1) are provided with dovetail groove, wherein Yi Bian dovetail groove is a linear, the dovetail groove of another side is a stairstepping, the both sides up and down of described electronic device substrate box (5) are provided with corresponding dovetail, wherein Yi Bian dovetail is a linear, and the dovetail of another side is reverse stairstepping.
5. the electronic equipment hot swap structure with cooling system according to claim 4 is characterized in that the stairstepping dovetail groove front end of described heat dissipation cold plate (1) is provided with a bit of breach that electronic device substrate box (5) is put into easily of being convenient to.
6. the electronic equipment hot swap structure with cooling system according to claim 4 is characterized in that the reverse stairstepping dovetail two ends of described electronic device substrate box (5) are provided with elastic groove.
7. the electronic equipment hot swap structure with cooling system according to claim 1, it is characterized in that described heat dissipation cold plate (1) end is provided with a slide block slot, be placed with slide block (2) in the slide block slot, described socket (3) is fixedly mounted on the slide block (2), leave the space between slide block (2) and the slide block slot, this space makes slide block (2) suitably to slide in chute.
8. the electronic equipment hot swap structure with cooling system according to claim 7 is characterized in that displacement up and down that described slide block (2) slides radius of corner or the plug head chamfering right-angle side size less than plugs and sockets socket edge in chute.
9. according to claim 7 or 8 described electronic equipment hot swap structures with cooling system, it is characterized in that also being provided with the slide block lid (7) that is used to cover slide block (2), described slide block lid (7) is fixed on the outer surface of slide block slot by screw.
10. the electronic equipment hot swap structure with cooling system according to claim 1 is characterized in that also being provided with the lid (6) that is used to cover electronic device substrate box (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202652216U CN201590981U (en) | 2009-12-15 | 2009-12-15 | Electronic equipment hot plug mechanism with heat removal system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202652216U CN201590981U (en) | 2009-12-15 | 2009-12-15 | Electronic equipment hot plug mechanism with heat removal system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201590981U true CN201590981U (en) | 2010-09-22 |
Family
ID=42750775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202652216U Expired - Fee Related CN201590981U (en) | 2009-12-15 | 2009-12-15 | Electronic equipment hot plug mechanism with heat removal system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201590981U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9144178B2 (en) | 2013-03-01 | 2015-09-22 | International Business Machines Corporation | Selective clamping of electronics card to coolant-cooled structure |
| CN106793628A (en) * | 2017-02-13 | 2017-05-31 | 江苏汇邦仪表有限公司 | A kind of warm and humid controller of hot flow path plug-in |
-
2009
- 2009-12-15 CN CN2009202652216U patent/CN201590981U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9144178B2 (en) | 2013-03-01 | 2015-09-22 | International Business Machines Corporation | Selective clamping of electronics card to coolant-cooled structure |
| US9258925B2 (en) | 2013-03-01 | 2016-02-09 | International Business Machines Corporation | Selective clamping of electronics card to coolant-cooled structure |
| US9591787B2 (en) | 2013-03-01 | 2017-03-07 | International Business Machines Corporation | Selective clamping of electronics card to coolant-cooled structure |
| CN106793628A (en) * | 2017-02-13 | 2017-05-31 | 江苏汇邦仪表有限公司 | A kind of warm and humid controller of hot flow path plug-in |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100922 Termination date: 20101215 |