CN201587667U - 4-inch wafer packaging box - Google Patents
4-inch wafer packaging box Download PDFInfo
- Publication number
- CN201587667U CN201587667U CN2010200008034U CN201020000803U CN201587667U CN 201587667 U CN201587667 U CN 201587667U CN 2010200008034 U CN2010200008034 U CN 2010200008034U CN 201020000803 U CN201020000803 U CN 201020000803U CN 201587667 U CN201587667 U CN 201587667U
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- China
- Prior art keywords
- packing boxes
- shaped groove
- wafers
- loam cake
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a container for storing articles, in particular to a 4-inch wafer packaging box, which structurally comprises an upper cover and a bottom cover, wherein the inner edges of two symmetrical side surfaces of the upper cover are provided with small convex ribs; a plurality of rows of saw-teethed bulges are arranged inside the upper cover; the center of each saw-teethed bulge is provided with a V-shaped groove; the outer top surface of the upper cover is provided with a boss playing a role in lamination; and the outer bottom surface of the bottom cover is provided with a concave surface matched with the boss of the upper cover. The 4-inch wafer packaging box is simple, convenient and durable in use, has the optimized interior space, and fully protects a wafer due to the optimal design of the box structure so as to avoid the wafer from being damaged during the process of storage or transportation; furthermore, a plurality of 4-inch wafer packaging boxes can be laminated, thus being convenient for a user and improving efficiency.
Description
Technical field
The utility model relates to the container that object stores, and refers in particular to 4 inches wafers to packing boxes.
Background technology
Wafers to packing boxes in the market is made up of three parts usually, i.e. loam cake, shell fragment and bottom.The shortcoming of the wafers to packing boxes of this structure is: in use, shell fragment and loam cake need be assembled together, when long-term use, loosening and distortion takes place in shell fragment easily, make phenomenons such as wafer is beated, friction in packing delivery process, cause wafer to be worn, greatly reduced the service life of wafer, the serious wafer that then makes breaks, and causes very big worries to the user.Existing in addition wafers to packing boxes mostly can not be superimposed, and promptly the lower surface of the upper surface of loam cake and bottom can not be superimposed, and this structure has greatly been wasted the space, has reduced efficient, improved the shipment cost.
Summary of the invention
4 inches wafers to packing boxes that the purpose of this utility model is to provide a kind of optimization of inside structure, convenience ease in use and saves the space.
The technical solution of the utility model is as follows:
A kind of 4 inches wafers to packing boxes, comprise loam cake 1 and bottom 2, it is characterized in that: the edge medial surface of 1 two symmetrical sides of loam cake is provided with small convex rib 3, the relative projection that is provided with at least four gang saw dentations 4 about loam cake 1 inside, and each jagged convex top center is provided with a V-shaped groove; Be provided with the boss 5 of superimposed effect on the exterior top surface of loam cake 1, the outside bottom surface of bottom 2 is provided with the concave surface 8 that matches with boss 5.
On the basis of technique scheme, two symmetrical sides of bottom 2 are provided with the button bit 7 that matches with small convex rib 3.
On the basis of technique scheme, on bottom 2 both sides button bits 7, be provided with inclined-plane 11.
On the basis of technique scheme, be provided with the area of space of reservation as handgrip groove 10 in bottom 2 both sides.
On the basis of technique scheme, be provided with the reinforced rib 6 of support and positioning action in bottom 2 inside.
On the basis of technique scheme, the bottom of bottom 2 has been provided with four small boss 9 that support and protect the effect of lid base plane.
On the basis of technique scheme, the projection 4 of four gang saw dentations is highly successively decreased from outside to inside successively, be provided with first V-shaped groove 411, second V-shaped groove 412, the 3rd V-shaped groove 421, the 4th V-shaped groove 422 on each projection 4 from outside to inside successively, the bottom width of described each V-shaped groove increases to interior side direction gradually from the box body lateral direction.
Advantage of the present utility model is: convenience ease in use, and durable; The inner space is optimized, the optimum design of this box-shaped structure, and the wafer that adequately protected makes it not to be damaged in storage or delivery process; But also can be superimposed with each other by a plurality of 4 inches wafers to packing boxes, made things convenient for the user, improved efficient.
Description of drawings
Fig. 1 is the composition structural representation of 4 inches wafers to packing boxes.
Fig. 2 is the structural representation of 4 inches wafers to packing boxes loam cakes.
Fig. 3 is the external structure scheme drawing of 4 inches wafers to packing boxes loam cakes.
Fig. 4 is the structural representation of 4 inches wafers to packing boxes bottoms.
Fig. 5 is the external structure scheme drawing of 4 inches wafers to packing boxes bottoms.
Fig. 6 is 4 inches a plurality of outside drawings that are superimposed with each other of wafers to packing boxes.
Assembling scheme drawing when Fig. 7 is 4 inches wafers to packing boxes uses.
Fig. 8 is the partial enlarged drawing of the inner jagged projection of 4 inches wafers to packing boxes loam cakes.
Among the figure, 1. 5. 12.4 inches wafer horses in boss 6. reinforced ribs, 7. button bit 8. concave surfaces, 9. small boss 10. handgrip grooves, 11. inclined-planes of loam cake 2. bottom 3. small convex ribs, 4. jagged projectioies and V-shaped groove (411,412,421,422)
The specific embodiment
See Fig. 1,4 inches R.5 serial wafers to packing boxes are made of loam cake 1 and bottom 2.Wherein, shown in Fig. 2,3,5, the edge medial surface of 1 two symmetrical sides of loam cake is provided with small convex rib 3, the relative projection that is provided with at least four gang saw dentations 4 about loam cake 1 inside, and each jagged convex top center is provided with a V-shaped groove; Be provided with the boss 5 of superimposed effect on the exterior top surface of loam cake 1, the outside bottom surface of bottom 2 is provided with the concave surface 8 that matches with boss 5.The stacked effect of a plurality of wafers to packing boxes is referring to Fig. 6.After one closed 4 inches R.5 the concave surface 8 of the uniqueness that is provided with of the wafers to packing boxes bottoms 2 of series and another 4 inches R.5 the boss 5 that is provided with of the wafers to packing boxes loam cakes 1 of series match, then realized being superimposed with each other of two 4 inches R.5 serial wafers to packing boxes, so repeated to realize being superimposed with each other of a plurality of 4 inches R.5 serial wafers to packing boxes.
See Fig. 8, the projection 4 of four gang saw dentations is highly successively decreased from outside to inside successively, be provided with first V-shaped groove 411, second V-shaped groove 412, the 3rd V-shaped groove 421, the 4th V-shaped groove 422 on each projection 4 from outside to inside successively, the bottom width of described each V-shaped groove increases to interior side direction gradually from the box body lateral direction.After loam cake cooperated with bottom, wafer will be fixed on V-shaped groove (411﹠amp; 421) in, when the packing box accident is subjected to external force, when dropping on the ground, the wafer of the inside packaging will with V-shaped groove (411﹠amp; 421) mutual extrusion causes jagged projection to deform, and after serration was deformed to certain degree, wafer will touch V-shaped groove (412﹠amp; 422), at V-shaped groove (412﹠amp; 422) under the resistance, wafer will change quiescence into by the motion impact conditions, avoids wafer to continue to be subjected to bigger impact, thereby has protected wafer, makes it not to be broken.At 4 inches R.5 in the storage and loading process of wafers to packing boxes of series, wafer can not produce mobile, has protected the safety of 4 inches wafers fully.
See Fig. 3,4,5, on the exterior top surface of loam cake 1, also be provided with the boss 5 of superimposed effect.Bottom 2 inside have been provided with the reinforced rib 6 of support and positioning action; two symmetrical sides of bottom 2 are provided with the button bit 7 that matches with loam cake small convex rib 3; the outside bottom surface of bottom 2 is provided with the concave surface 8 that matches with loam cake boss 5, has also had four small boss 9 that support and protect the plane effect of cover bottom in the bottom of bottom 2.Wherein, be provided with inclined-plane 11 on the button bit of bottom both sides, simultaneously, the area of space that is provided with reservation in the bottom both sides is as handgrip groove 10.
During use, as shown in Figure 7,4 inches product wafers are placed in the wafer horse 12, again wafer horse 12 is put in the bottom 2 of wafers to packing boxes, the loam cake 1 of 4 inches wafers to packing boxes is placed on the bottom 2 of 4 inches wafers to packing boxes, with hand the button bit 7 of 4 inches wafers to packing boxes loam cakes, 1 in-to-in small convex rib 3 and bottom is matched from the top down and be in the same place, box is in closed condition.When opening box, hand need be put in the design headspace zone handgrip groove 10, under the effect of the outside power of finger, the small convex rib 3 of box loam cake 1 can break away from the button bit 7 of box bottom 2, and with the loam cake 1 of the box of handing up, box has just been opened so again.
4 inches of the utility model are the optimized design of the loam cake inner space of the wafers to packing boxes of series R.5; 4 inches wafers have adequately protected; but also can realize being superimposed with each other of a plurality of 4 inches R.5 serial wafers to packing boxes; made things convenient for the user; improve efficient, fully realized economy, practicality and the durability of product.
Claims (7)
1. 4 inches wafers to packing boxes, comprise loam cake (1) and bottom (2), it is characterized in that: the edge medial surface of (1) two symmetrical side of loam cake is provided with small convex rib (3), the relative projection that is provided with at least four gang saw dentations (4) about loam cake (1) inside, each jagged convex top center is provided with a V-shaped groove; Be provided with the boss (5) of superimposed effect on the exterior top surface of loam cake (1), the outside bottom surface of bottom (2) is provided with the concave surface (8) that matches with boss (5).
2. 4 inches wafers to packing boxes as claimed in claim 1 is characterized in that: two symmetrical sides of bottom (2) are provided with the button bit (7) that matches with small convex rib (3).
3. 4 inches wafers to packing boxes as claimed in claim 2 is characterized in that: be provided with inclined-plane (11) on bottom (2) both sides button bits (7).
4. as claim 1 or 2 or 3 described 4 inches wafers to packing boxes, it is characterized in that: be provided with the area of space of reservation as handgrip groove (10) in bottom (2) both sides.
5. as claim 1 or 2 or 3 described 4 inches wafers to packing boxes, it is characterized in that: the reinforced rib (6) that has been provided with support and positioning action in bottom (2) inside.
6. as claim 1 or 2 or 3 described 4 inches wafers to packing boxes, it is characterized in that: the bottom of bottom (2) has been provided with four small boss (9) that support and protect the effect of lid base plane.
7. as claim 1 or 2 or 3 described 4 inches wafers to packing boxes, it is characterized in that: the projection of four gang saw dentations (4) is highly successively decreased from outside to inside successively, be provided with first V-shaped groove (411), second V-shaped groove (412), the 3rd V-shaped groove (421), the 4th V-shaped groove (422) on each projection (4) from outside to inside successively, the bottom width of described each V-shaped groove increases to interior side direction gradually from the box body lateral direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010200008034U CN201587667U (en) | 2010-01-11 | 2010-01-11 | 4-inch wafer packaging box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010200008034U CN201587667U (en) | 2010-01-11 | 2010-01-11 | 4-inch wafer packaging box |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201587667U true CN201587667U (en) | 2010-09-22 |
Family
ID=42747433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010200008034U Expired - Lifetime CN201587667U (en) | 2010-01-11 | 2010-01-11 | 4-inch wafer packaging box |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201587667U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113320830A (en) * | 2021-05-08 | 2021-08-31 | 上海传芯半导体有限公司 | Packing box for storing mask base plate |
-
2010
- 2010-01-11 CN CN2010200008034U patent/CN201587667U/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113320830A (en) * | 2021-05-08 | 2021-08-31 | 上海传芯半导体有限公司 | Packing box for storing mask base plate |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20100922 |