CN201576685U - Heat dissipation type paster diode - Google Patents
Heat dissipation type paster diode Download PDFInfo
- Publication number
- CN201576685U CN201576685U CN2010200148114U CN201020014811U CN201576685U CN 201576685 U CN201576685 U CN 201576685U CN 2010200148114 U CN2010200148114 U CN 2010200148114U CN 201020014811 U CN201020014811 U CN 201020014811U CN 201576685 U CN201576685 U CN 201576685U
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- CN
- China
- Prior art keywords
- electrode pin
- paster
- pipe fitting
- heat dissipation
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a heat dissipation type paster diode, which comprises a body; a left electrode pin paster and a right electrode pin paster are respectively disposed on the body; the left electrode pin paster is bent down, and arranged on the left outer side of the body in planar form; the right electrode pin paster is bent down, and arranged on the right outer side of the body in planar form. The paster diode of the utility model can solve the problem of prior arts that working heat is aggregated to the lower part of the paster diode and influence its using efficiency and service life.
Description
Technical field
The utility model relates to technical field of electronic components, specifically a kind of heat dissipation type stamp-mounting-paper diode.
Background technology
Along with continuous progress in science and technology, electronic product more and more develops to miniaturization, ultra-thin formula direction.To this, not only need the overall dimension of electronic devices and components the smaller the better, and need electronic devices and components to have better radiating effect, the heat that is produced in the time of promptly electronic devices and components can being worked in time spreads out, effectively avoid its heat accumulation around electronic devices and components, unaffected to guarantee its use power and useful life.
At present, traditional stamp-mounting-paper diode mostly is with the bottom of its electrode pin paster bending to pipe fitting, so, the heat that stamp-mounting-paper diode is produced when work, accumulated in the bottom of stamp-mounting-paper diode after the absorption of electrode pin paster, make heat that stamp-mounting-paper diode gave out get back to the bottom of self again, it has played the effect of post bake has been carried out in the stamp-mounting-paper diode bottom, so influenced the use power and the useful life of stamp-mounting-paper diode, thus, many worries have been brought to every aspect.
Summary of the invention
The purpose of this utility model provides a kind of heat dissipation type stamp-mounting-paper diode, and the work calories that it can solve the prior art existence accumulates in the stamp-mounting-paper diode bottom and influences its use power and problem in useful life.
The purpose of this utility model is achieved through the following technical solutions: the heat dissipation type stamp-mounting-paper diode, it comprises pipe fitting, left electrode pin paster and right electrode pin paster are arranged respectively on the pipe fitting, left side electrode pin paster is the plane left-external side position that is arranged on pipe fitting after the bending of bottom, right electrode pin paster is the plane right outer fix that is arranged on pipe fitting after the bending of bottom.
The beneficial effect that the utility model can produce: stretch because of left electrode pin paster is plane left-external side to pipe fitting after the bending of bottom, and be arranged on the left-external side position of pipe fitting, right electrode pin paster is plane right lateral expansion to pipe fitting after the bending of bottom, and be arranged on the right outer fix of pipe fitting, so the heat that it is produced in the time of stamp-mounting-paper diode can being worked effectively spreads out, fundamentally avoided heat accumulation it to be carried out the problem of post bake, fundamentally guaranteed the use power and the useful life of stamp-mounting-paper diode in the stamp-mounting-paper diode bottom.Extensive use of the present utility model can produce good social, economic benefit.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the vertical view of Fig. 1.
Embodiment
Heat dissipation type stamp-mounting-paper diode of the present utility model, it comprises pipe fitting 1, left electrode pin paster 1a and right electrode pin paster 1b are arranged respectively on the pipe fitting 1, left side electrode pin paster 1a is the plane left-external side position that is arranged on pipe fitting 1 after the bending of bottom, right electrode pin paster 1b is the plane right outer fix that is arranged on pipe fitting 1 after the bending of bottom.During making, process various parts assemblings by above-mentioned requirements and get final product.
During work, the heat that is produced in the pipe fitting 1 of stamp-mounting-paper diode, absorbed by left electrode pin paster 1a and right electrode pin paster 1b respectively and spread out, it has effectively avoided its heat accumulation around pipe fitting 1, has fundamentally guaranteed the use power and the useful life of stamp-mounting-paper diode.
Left electrode pin paster 1a of the present utility model and the right electrode pin paster 1b form that is connected with commutator segment in the pipe fitting 1 respectively, and the form of perfusion megohmite insulant is known technology in the pipe fitting 1.
Technical scheme described in the utility model is not limited only to the execution mode of present embodiment record, can also have other execution mode to finish the technical solution of the utility model.
The technology that the utility model is not described in detail, shape, structure partly are known technology.
Claims (1)
1. heat dissipation type stamp-mounting-paper diode, it comprises pipe fitting (1), left electrode pin paster (1a) and right electrode pin paster (1b) are arranged respectively on the pipe fitting (1), it is characterized in that: left electrode pin paster (1a) is the plane left-external side position that is arranged on pipe fitting (1) after the bending of bottom, and right electrode pin paster (1b) is the plane right outer fix that is arranged on pipe fitting (1) after the bending of bottom.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010200148114U CN201576685U (en) | 2010-01-11 | 2010-01-11 | Heat dissipation type paster diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010200148114U CN201576685U (en) | 2010-01-11 | 2010-01-11 | Heat dissipation type paster diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201576685U true CN201576685U (en) | 2010-09-08 |
Family
ID=42696559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010200148114U Expired - Fee Related CN201576685U (en) | 2010-01-11 | 2010-01-11 | Heat dissipation type paster diode |
Country Status (1)
Country | Link |
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CN (1) | CN201576685U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102226292A (en) * | 2011-06-17 | 2011-10-26 | 如皋市易达电子有限责任公司 | Surface mounting diode electroplating device cylinder |
-
2010
- 2010-01-11 CN CN2010200148114U patent/CN201576685U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102226292A (en) * | 2011-06-17 | 2011-10-26 | 如皋市易达电子有限责任公司 | Surface mounting diode electroplating device cylinder |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100908 Termination date: 20140111 |