CN201576685U - Heat dissipation type paster diode - Google Patents

Heat dissipation type paster diode Download PDF

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Publication number
CN201576685U
CN201576685U CN2010200148114U CN201020014811U CN201576685U CN 201576685 U CN201576685 U CN 201576685U CN 2010200148114 U CN2010200148114 U CN 2010200148114U CN 201020014811 U CN201020014811 U CN 201020014811U CN 201576685 U CN201576685 U CN 201576685U
Authority
CN
China
Prior art keywords
electrode pin
paster
pipe fitting
heat dissipation
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010200148114U
Other languages
Chinese (zh)
Inventor
董志强
岳跃忠
潘荔青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gulf Semiconductor Shandong Co ltd
Original Assignee
Gulf Semiconductor Shandong Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gulf Semiconductor Shandong Co ltd filed Critical Gulf Semiconductor Shandong Co ltd
Priority to CN2010200148114U priority Critical patent/CN201576685U/en
Application granted granted Critical
Publication of CN201576685U publication Critical patent/CN201576685U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a heat dissipation type paster diode, which comprises a body; a left electrode pin paster and a right electrode pin paster are respectively disposed on the body; the left electrode pin paster is bent down, and arranged on the left outer side of the body in planar form; the right electrode pin paster is bent down, and arranged on the right outer side of the body in planar form. The paster diode of the utility model can solve the problem of prior arts that working heat is aggregated to the lower part of the paster diode and influence its using efficiency and service life.

Description

The heat dissipation type stamp-mounting-paper diode
Technical field
The utility model relates to technical field of electronic components, specifically a kind of heat dissipation type stamp-mounting-paper diode.
Background technology
Along with continuous progress in science and technology, electronic product more and more develops to miniaturization, ultra-thin formula direction.To this, not only need the overall dimension of electronic devices and components the smaller the better, and need electronic devices and components to have better radiating effect, the heat that is produced in the time of promptly electronic devices and components can being worked in time spreads out, effectively avoid its heat accumulation around electronic devices and components, unaffected to guarantee its use power and useful life.
At present, traditional stamp-mounting-paper diode mostly is with the bottom of its electrode pin paster bending to pipe fitting, so, the heat that stamp-mounting-paper diode is produced when work, accumulated in the bottom of stamp-mounting-paper diode after the absorption of electrode pin paster, make heat that stamp-mounting-paper diode gave out get back to the bottom of self again, it has played the effect of post bake has been carried out in the stamp-mounting-paper diode bottom, so influenced the use power and the useful life of stamp-mounting-paper diode, thus, many worries have been brought to every aspect.
Summary of the invention
The purpose of this utility model provides a kind of heat dissipation type stamp-mounting-paper diode, and the work calories that it can solve the prior art existence accumulates in the stamp-mounting-paper diode bottom and influences its use power and problem in useful life.
The purpose of this utility model is achieved through the following technical solutions: the heat dissipation type stamp-mounting-paper diode, it comprises pipe fitting, left electrode pin paster and right electrode pin paster are arranged respectively on the pipe fitting, left side electrode pin paster is the plane left-external side position that is arranged on pipe fitting after the bending of bottom, right electrode pin paster is the plane right outer fix that is arranged on pipe fitting after the bending of bottom.
The beneficial effect that the utility model can produce: stretch because of left electrode pin paster is plane left-external side to pipe fitting after the bending of bottom, and be arranged on the left-external side position of pipe fitting, right electrode pin paster is plane right lateral expansion to pipe fitting after the bending of bottom, and be arranged on the right outer fix of pipe fitting, so the heat that it is produced in the time of stamp-mounting-paper diode can being worked effectively spreads out, fundamentally avoided heat accumulation it to be carried out the problem of post bake, fundamentally guaranteed the use power and the useful life of stamp-mounting-paper diode in the stamp-mounting-paper diode bottom.Extensive use of the present utility model can produce good social, economic benefit.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the vertical view of Fig. 1.
Embodiment
Heat dissipation type stamp-mounting-paper diode of the present utility model, it comprises pipe fitting 1, left electrode pin paster 1a and right electrode pin paster 1b are arranged respectively on the pipe fitting 1, left side electrode pin paster 1a is the plane left-external side position that is arranged on pipe fitting 1 after the bending of bottom, right electrode pin paster 1b is the plane right outer fix that is arranged on pipe fitting 1 after the bending of bottom.During making, process various parts assemblings by above-mentioned requirements and get final product.
During work, the heat that is produced in the pipe fitting 1 of stamp-mounting-paper diode, absorbed by left electrode pin paster 1a and right electrode pin paster 1b respectively and spread out, it has effectively avoided its heat accumulation around pipe fitting 1, has fundamentally guaranteed the use power and the useful life of stamp-mounting-paper diode.
Left electrode pin paster 1a of the present utility model and the right electrode pin paster 1b form that is connected with commutator segment in the pipe fitting 1 respectively, and the form of perfusion megohmite insulant is known technology in the pipe fitting 1.
Technical scheme described in the utility model is not limited only to the execution mode of present embodiment record, can also have other execution mode to finish the technical solution of the utility model.
The technology that the utility model is not described in detail, shape, structure partly are known technology.

Claims (1)

1. heat dissipation type stamp-mounting-paper diode, it comprises pipe fitting (1), left electrode pin paster (1a) and right electrode pin paster (1b) are arranged respectively on the pipe fitting (1), it is characterized in that: left electrode pin paster (1a) is the plane left-external side position that is arranged on pipe fitting (1) after the bending of bottom, and right electrode pin paster (1b) is the plane right outer fix that is arranged on pipe fitting (1) after the bending of bottom.
CN2010200148114U 2010-01-11 2010-01-11 Heat dissipation type paster diode Expired - Fee Related CN201576685U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010200148114U CN201576685U (en) 2010-01-11 2010-01-11 Heat dissipation type paster diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010200148114U CN201576685U (en) 2010-01-11 2010-01-11 Heat dissipation type paster diode

Publications (1)

Publication Number Publication Date
CN201576685U true CN201576685U (en) 2010-09-08

Family

ID=42696559

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010200148114U Expired - Fee Related CN201576685U (en) 2010-01-11 2010-01-11 Heat dissipation type paster diode

Country Status (1)

Country Link
CN (1) CN201576685U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102226292A (en) * 2011-06-17 2011-10-26 如皋市易达电子有限责任公司 Surface mounting diode electroplating device cylinder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102226292A (en) * 2011-06-17 2011-10-26 如皋市易达电子有限责任公司 Surface mounting diode electroplating device cylinder

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100908

Termination date: 20140111