CN201573095U - Polishing head magnetic clamping device used in silicon wafer chemically mechanical polishing (CMP) equipment - Google Patents
Polishing head magnetic clamping device used in silicon wafer chemically mechanical polishing (CMP) equipment Download PDFInfo
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- CN201573095U CN201573095U CN2009202550301U CN200920255030U CN201573095U CN 201573095 U CN201573095 U CN 201573095U CN 2009202550301 U CN2009202550301 U CN 2009202550301U CN 200920255030 U CN200920255030 U CN 200920255030U CN 201573095 U CN201573095 U CN 201573095U
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model provides a magnetic clamping device of a polishing head and a mandrel used in silicon wafer chemically mechanical polishing (CMP) equipment. The magnetic clamping device comprises a magnet, a base and a switching knob capable of adjusting the rotation angle of the magnet. In the use process of the clamping device, the switching knob is rotated to adjust the on and off of magnetic property, so as to clamp and release the mandrel through the polishing head; when two poles of the column-shaped magnet are in the same steel ingot, the magnetic line directly passes through the steel ingot, and the base does not present magnetic property due to short circuit; and when the column-shaped magnet is rotated to another angle, two poles of the magnet are respectively positioned on two steel ingots of the base, the magnetic line is led out from the entire base to attract the mandrel. The magnetic clamping device utilizes the method to realize the positioning and clamping between the polishing head and the mandrel, and has the advantages of simple structure and convenient installation and operation.
Description
Technical field
The utility model relates to a kind of magnetic clamping device, the particularly a kind of rubbing head in the chemical mechanical polishing equipment of silicon wafer and magnetic clamping device of axle of being applied to.
Background technology
Along with the fast development of microelectric technique, more and more higher to the requirement of electronic device, the design of traditional large-scale device can not have been satisfied an urgent demand of current microminiaturization, high speed, precise treatment.The live width of large scale integrated circuit constantly descends, and to structural uprightization, the development of wiring multiple stratification.According to U.S.'s microelectric technique development block diagram, characteristic line breadth to 2011 year will be reduced to 0.05 μ m, to bring into use Φ 450mm silicon chip simultaneously, silicon chip surface total thickness variations (TTV) requires less than 0.2 μ m, the local flatness of silicon chip surface (SFQD) requires to be 2/3 of design live width, and requires large-sized silicon wafers like this surface to have nanoscale surface precision and Subnano-class surface roughness.To guarantee surface and inferior surperficial not damaged simultaneously, near the limit of Surface Machining.Realize so most advanced and sophisticated technological break-through, must deeply inquire into Ultraprecise polished Surface Machining Material Removal Mechanism and Ultraprecise polished surface processing technique.As one of ultra-precision surface manufacture method of new generation---chemically mechanical polishing (CMP) technology is the technology of at present best realization leveling, has obtained big quantity research and extensive use at ultra-precision surface manufacture fields such as integrated circuit, computer magnetic head/hard discs.
In the CMP process of silicon chip, rubbing head plays a part to pick up silicon chip and drives silicon chip be rotated polishing on polishing pad, and axle inside has vacuum and the back pressure gas circuit provides power for silicon wafer polishing, because axle and rubbing head are to adopt vacuum suction and mechanical device alignment by union to clamp, so air-tightness between the two is particularly important, in the prior art, it is all complicated to improve bubble-tight mechanical device, easy inadequately, install and operate also all inconvenient, axle is not easy accurate localization and immovable fitting in dock the process that clamps with rubbing head, and often causes unnecessary loss in assembling process.
The utility model content
The technical problems to be solved in the utility model provides a kind of simple in structure, install and operation all very convenient, docking with rubbing head in the process of clamping in axle can easily accurate localization and the rubbing head magnetic clamping device of immovable fitting.
The technical solution of the utility model is: the rubbing head magnetic clamping device that is applied in the chemical mechanical polishing equipment of silicon wafer comprises cylindrical switch assembly and pedestal, the cylindrical switch assembly is by 2 blocks of half-cylindrical magnet, be clipped in 2 half-cylindrical magnet middle parts be used to separate forming of cylindrical magnetic iron every magnetic patch and the switching knob that is arranged on the adjusting cylindrical magnetic iron anglec of rotation on the cylindrical magnetic iron, described pedestal comprises 2 magnetic inductive blocks and is clipped in 2 magnetic isolation plates between the magnetic inductive block, be provided with and the suitable hole of cylindrical magnetic switch module at the interface place of 2 magnetic inductive blocks, on 2 magnetic inductive blocks, be respectively equipped with installing hole, the material of described 2 magnetic inductive blocks is a magnetic material, and described material every magnetic patch is a nonmagnetic substance; Pedestal also comprises pressure strip, be provided with on the pressure strip with 2 magnetic inductive blocks on the corresponding fixing hole of installing hole.
The beneficial effects of the utility model are: this device is fixed on the rubbing head by the screw that is positioned at installing hole, when rotary switch is the position of ON, the N of 2 blocks of magnet in the magnet arrangement, the S utmost point lay respectively in 2 different magnetic inductive blocks of pedestal, the magnetic line of force passes the magnet clamping device and attracts each other with the steel ingot that is fixed on the axle, thereby strengthens the air-tightness between axle and the rubbing head; When rotary switch was the position of OFF, the N of the magnet in the magnet arrangement, the S utmost point were positioned at same magnetic inductive block of pedestal simultaneously, and the magnetic line of force short circuit of magnet can not be passed the magnet clamping device, thereby can not attract each other with the steel ingot that is fixed on the axle; So just can realize having or not of magnetic force by switching knob, can be fastening thereby realize with axle and rubbing head, and device is simple in structure, easy to operate.
Description of drawings
Fig. 1. be structural representation of the present utility model;
Fig. 2. for the switching knob position is the magnet positions relational structure schematic diagram of ON;
Fig. 3. for the switching knob position is the magnet positions relational structure schematic diagram of OFF;
Fig. 4. be rubbing head and axle assembly structure schematic diagram;
Fig. 5. be axle marginal texture schematic diagram.
In the drawings: 101 switching knobs, 102 magnet, 103 magnetic inductive blocks, the steel ingot of 104 magnetic isolation plates, 105 on magnetic patch, 106 fixing holes, 107 pressure strips, 201 axles, 202 rubbing heads, 203 magnetic clamping devices, 204 axles.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described in further detail.
Shown in accompanying drawing 1-5, the rubbing head magnetic clamping device that is applied in the chemical mechanical polishing equipment of silicon wafer comprises cylindrical switch assembly and pedestal, the cylindrical switch assembly is by 2 blocks of half-cylindrical magnet 102, be clipped in 2 half-cylindrical magnet 102 middle parts be used to separate forming of cylindrical magnetic iron 102 every magnetic patch 105 and the switching knob 101 that is arranged on adjusting cylindrical magnetic iron 102 anglecs of rotation on the cylindrical magnetic iron 102, described pedestal comprises 2 magnetic inductive blocks 103 and is clipped in 2 magnetic isolation plates 104 between the magnetic inductive block 103, be provided with and the suitable hole of cylindrical magnetic switch module at the interface place of 2 magnetic inductive blocks 103, on 2 magnetic inductive blocks 103, be respectively equipped with installing hole, the material of described 2 magnetic inductive blocks 103 is a magnetic material, and described material every magnetic patch is a nonmagnetic substance; Pedestal also comprises pressure strip 107, be provided with on the pressure strip 107 with 2 magnetic inductive blocks 103 on the corresponding fixing hole 106 of installing hole.
With screw magnetic clamping device 203 is fastened on the rubbing head 202 by fixing hole 106 and installing hole, because axle 201 materials own are the relatively poor austenitic stainless steel of magnetic conductivity, so need on axle 201, two blocks of steel ingots 204 that magnetic conductivity is stronger be installed with magnetic clamping device 203 corresponding positions, can regulate having or not of magnetic easily by the switching knob 101 that reverses in the magnetic clamping device 203, thereby realize the location and the clamping of rubbing head 202 and axle 201.
These magnetic clamping device 203 specific operation process are: when switching knob 101 is in the position of OFF, magnet 102 is rotated N, S the two poles of the earth all are on the same magnetic inductive block 103, this moment, the magnetic line of force of magnet 102 directly passed through in this piece magnetic inductive block 103, the outside just exhibit magnetic properties not of whole pedestal, promptly rubbing head 202 and axle 201 can be not clamped; And when switching knob 101 was in the position of ON, magnet 102 was rotated N, S the two poles of the earth are in respectively on two magnetic inductive blocks 103, and the magnetic line of force will be derived the steel ingot 204 that holds the axle 201 from whole pedestal outside; Thereby realize the location clamping of rubbing head 202 and axle 201 and loosen process.
Claims (2)
1. rubbing head magnetic clamping device that is applied in the chemical mechanical polishing equipment of silicon wafer, it is characterized in that comprising cylindrical switch assembly and pedestal, described cylindrical switch assembly is by 2 blocks of half-cylindrical magnet (102), be clipped in 2 blocks of half-cylindrical magnet (102) middle part be used to separate forming of cylindrical magnetic iron (102) every magnetic patch (105) and the switching knob (101) that is arranged on adjusting cylindrical magnetic iron (102) anglec of rotation on the cylindrical magnetic iron (102), described pedestal comprises 2 magnetic inductive blocks (103) and is clipped in magnetic isolation plate (104) between 2 magnetic inductive blocks (103), be provided with and the suitable hole of cylindrical magnetic switch module at the interface place of 2 magnetic inductive blocks (103), on 2 magnetic inductive blocks (103), be respectively equipped with installing hole.
2. the rubbing head magnetic clamping device that is applied in the chemical mechanical polishing equipment of silicon wafer according to claim 1, it is characterized in that: described pedestal also comprises pressure strip (107), be provided with on the pressure strip (107) with 2 magnetic inductive blocks (103) on the corresponding fixing hole of installing hole (106).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202550301U CN201573095U (en) | 2009-12-22 | 2009-12-22 | Polishing head magnetic clamping device used in silicon wafer chemically mechanical polishing (CMP) equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202550301U CN201573095U (en) | 2009-12-22 | 2009-12-22 | Polishing head magnetic clamping device used in silicon wafer chemically mechanical polishing (CMP) equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201573095U true CN201573095U (en) | 2010-09-08 |
Family
ID=42692975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202550301U Expired - Fee Related CN201573095U (en) | 2009-12-22 | 2009-12-22 | Polishing head magnetic clamping device used in silicon wafer chemically mechanical polishing (CMP) equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201573095U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105485097A (en) * | 2015-12-31 | 2016-04-13 | 天津罗斯诺普信息技术有限公司 | Rotary knob fastening device |
| CN105706329A (en) * | 2013-10-29 | 2016-06-22 | 吉瑞高新科技股份有限公司 | Electronic cigarette charging apparatus and charging method |
-
2009
- 2009-12-22 CN CN2009202550301U patent/CN201573095U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105706329A (en) * | 2013-10-29 | 2016-06-22 | 吉瑞高新科技股份有限公司 | Electronic cigarette charging apparatus and charging method |
| CN105706329B (en) * | 2013-10-29 | 2018-07-10 | 吉瑞高新科技股份有限公司 | Electronic cigarette charging unit and charging method |
| CN105485097A (en) * | 2015-12-31 | 2016-04-13 | 天津罗斯诺普信息技术有限公司 | Rotary knob fastening device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100908 Termination date: 20141222 |
|
| EXPY | Termination of patent right or utility model |