CN201562122U - Wafer delivery mechanism of photoetching machine - Google Patents
Wafer delivery mechanism of photoetching machine Download PDFInfo
- Publication number
- CN201562122U CN201562122U CN2009202140171U CN200920214017U CN201562122U CN 201562122 U CN201562122 U CN 201562122U CN 2009202140171 U CN2009202140171 U CN 2009202140171U CN 200920214017 U CN200920214017 U CN 200920214017U CN 201562122 U CN201562122 U CN 201562122U
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- CN
- China
- Prior art keywords
- housing
- pump drainage
- litho machine
- transfer mechanism
- wafer transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a photoetching machine, in particular to a wafer delivery mechanism of a photoetching machine, which comprises a motor, a belt and a guide track arranged inside a casing. The motor drives the belt to move on the guide track, and the casing is hermetically connected with a suction drainage pipeline for sucking and draining powdered solids in the casing. The suction drainage pipeline connected with the casing for sucking and draining powdered solids can suck and drain all of the powdered solids in the casing by virtue of the suction force thereof, which can prevent the powdered solids from blocking the guide track to ensure smooth movement of the belt on the guide track, thereby effectively avoiding motor damage due to overload.
Description
Technical field
The utility model relates to a kind of litho machine, relates in particular to a kind of wafer transfer mechanism of litho machine.
Background technology
Existing litho machine comes transferring wafer by wafer transfer mechanism when wafer is carried out photoetching.Described wafer transfer mechanism comprises motor, belt and guide rail.Described belt moves on guide rail under driven by motor.Wafer then is placed on the belt, follows belt movement, so that carry out photoetching.
Yet the wafer transfer mechanism of this litho machine in use phenomenon occurs damaging through regular meeting.By the failure analysis that damages parts is found: generally all be because motor (motor) damage causes.Find and further analyze: motor is to burn out because of overload.The reason of motor overload finds it is to make the change of belt movement resistance cause greatly owing to break flour blocks guide rail after deliberation.
And these break flours produce owing to belt in use weares and teares, and these break flours can stop up guide rail, make belt movement be obstructed, and finally make motor burn because of overload.
Therefore, how preventing that break flour from stopping up guide rail, thereby prevent motor so the accident that is damaged, is the technical matters that those skilled in the art need to be resolved hurrily.
The utility model content
Technical problem to be solved in the utility model provides a kind of wafer transfer mechanism of litho machine, can pump drainage falls the break flour on the guide rail, prevents that break flour from stopping up guide rail and causing the burn-down of electric motor accident.
To achieve the above object, the utility model adopts following technical scheme:
A kind of wafer transfer mechanism of litho machine comprises the motor, belt and the guide rail that place in the housing, and the driven by motor belt moves on guide rail, and described housing seal is connected to a pump drainage pipeline that is used for break flour in the described housing of pump drainage.
In the wafer transfer mechanism of the litho machine of stating, described pump drainage pipeline is connected with vacuum aspirator.
In the wafer transfer mechanism of the litho machine of stating, described pump drainage pipeline is connected with the airduct pipeline of the board that is in negative pressure state.
In the wafer transfer mechanism of the litho machine of stating, described pump drainage pipeline is inhaled the powder case through one and is connected with described housing seal.
In the wafer transfer mechanism of the litho machine of stating, described suction powder case is arranged on the below of housing.
In the wafer transfer mechanism of the litho machine of stating, described suction powder case is arranged on the top of housing.
In the wafer transfer mechanism of the litho machine of stating, described suction powder case is arranged on the side of housing.
The beneficial effects of the utility model are as follows:
The utility model is by connecing a pump drainage pipeline that is used for break flour in the described housing of pump drainage at housing, suction by described pump drainage pipeline is clean with the break flour pump drainage in the housing, prevent that break flour from stopping up guide rail, thereby guarantee belt motion smoothly on guide rail, and then, effectively avoided motor to damage phenomenon because of overload.
Description of drawings
The wafer transfer mechanism of litho machine of the present utility model is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of the wafer transfer mechanism of the utility model litho machine;
Among the figure, 1-housing, 2-pump drainage pipeline, 3-inhale powder case, 4-T-valve.
Embodiment
Below will the wafer transfer mechanism of litho machine of the present utility model be described in further detail.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development may be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose of this utility model, feature are become apparent, embodiment of the present utility model is further described below in conjunction with accompanying drawing.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model: by connect a pump drainage pipeline that is used for break flour in the described housing of pump drainage at housing, suction by described pump drainage pipeline is clean with the break flour pump drainage in the housing, prevent that break flour from stopping up guide rail, thereby guarantee belt motion smoothly on guide rail, and then, effectively avoided motor to damage phenomenon because of overload.
See also Fig. 1, Figure 1 shows that the structural representation of the wafer transfer mechanism of the utility model litho machine.
The wafer transfer mechanism of this litho machine comprises the motor, belt and the guide rail that place in the housing 1, and the driven by motor belt moves on guide rail, and described housing 1 is sealingly connected to a pump drainage pipeline 2 that is used for break flour in the described housing of pump drainage.
Described pump drainage pipeline 2 can be connected with vacuum aspirator.Certainly, described pump drainage pipeline 2 also can be connected with the airduct pipeline of the litho machine board that is in negative pressure state (among the figure for illustrating).In the present embodiment, because the litho machine board is provided with the airduct pipeline with negative pressure state originally, so described pump drainage pipeline 2 can insert in the airduct pipeline that is in negative pressure state that these litho machine boards itself have by a T-valve 4.
In the present embodiment, set up one between described pump drainage pipeline 2 and the housing 1 and inhale powder case 3, airtight connection between the three.Be that described pump drainage pipeline 2 is tightly connected with described housing 1 by this suction powder case 3.Concrete structure is as follows: described suction powder case 3 is provided with suction inlet and escape hole, and the suction inlet of the interface of described housing 1 and described suction powder case 3 is sealedly and fixedly connected, and the escape hole of described suction powder case 3 and the suction inlet of described pump drainage pipeline 2 are sealedly and fixedly connected.Inhale powder case 3 by setting up, can guarantee to dwindle the sectional area of pump drainage pipeline 2 under certain suction area prerequisite of (this suction area equates with interface area on the housing 1), thus saving tubing, and the volume of minimizing entire mechanism.
In the present embodiment, described suction powder case 3 is arranged on the side of housing 1.Certainly, described suction powder case 3 also can be arranged on housing 1 above or below.When inhaling powder case 3 and be arranged on the below of housing 1, owing to can utilize the gravity of break flour, therefore, pump drainage break flour most effective.
Through experiment repeatedly as can be known, when the suction of described pump drainage pipeline 2 more than or equal to 0.001kg/cm2, can obtain reasonable break flour pump drainage effect.
The utility model is by connecing a pump drainage pipeline that is used for break flour in the described housing of pump drainage at housing, suction by described pump drainage pipeline is clean with the break flour pump drainage in the housing, prevent that break flour from stopping up guide rail, thereby guarantee belt motion smoothly on guide rail, and then, effectively avoided motor to damage phenomenon because of overload.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (7)
1. the wafer transfer mechanism of a litho machine comprises the motor, belt and the guide rail that place in the housing, and the driven by motor belt moves on guide rail, it is characterized in that, described housing seal is connected to a pump drainage pipeline that is used for break flour in the described housing of pump drainage.
2. the wafer transfer mechanism of litho machine as claimed in claim 1 is characterized in that, described pump drainage pipeline is connected with vacuum aspirator.
3. the wafer transfer mechanism of litho machine as claimed in claim 1 is characterized in that, described pump drainage pipeline is connected with the airduct pipeline of the litho machine board that is in negative pressure state.
4. the wafer transfer mechanism of litho machine as claimed in claim 1 is characterized in that, described pump drainage pipeline is inhaled the powder case through one and is connected with described housing seal.
5. the wafer transfer mechanism of litho machine as claimed in claim 4 is characterized in that, described suction powder case is arranged on the below of housing.
6. the wafer transfer mechanism of litho machine as claimed in claim 4 is characterized in that, described suction powder case is arranged on the top of housing.
7. the wafer transfer mechanism of litho machine as claimed in claim 4 is characterized in that, described suction powder case is arranged on the side of housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202140171U CN201562122U (en) | 2009-11-20 | 2009-11-20 | Wafer delivery mechanism of photoetching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202140171U CN201562122U (en) | 2009-11-20 | 2009-11-20 | Wafer delivery mechanism of photoetching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201562122U true CN201562122U (en) | 2010-08-25 |
Family
ID=42627270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202140171U Expired - Fee Related CN201562122U (en) | 2009-11-20 | 2009-11-20 | Wafer delivery mechanism of photoetching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201562122U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108802882A (en) * | 2018-06-05 | 2018-11-13 | 邢明 | A kind of diffraction grating etching machine |
| CN108807167B (en) * | 2018-06-05 | 2020-11-10 | 深圳市信展通电子有限公司 | Production and manufacturing method of diode electrode |
-
2009
- 2009-11-20 CN CN2009202140171U patent/CN201562122U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108802882A (en) * | 2018-06-05 | 2018-11-13 | 邢明 | A kind of diffraction grating etching machine |
| CN108807167B (en) * | 2018-06-05 | 2020-11-10 | 深圳市信展通电子有限公司 | Production and manufacturing method of diode electrode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130221 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130221 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20181120 |