CN201552692U - Connection structure between hot-half plates - Google Patents
Connection structure between hot-half plates Download PDFInfo
- Publication number
- CN201552692U CN201552692U CN200920212380XU CN200920212380U CN201552692U CN 201552692 U CN201552692 U CN 201552692U CN 200920212380X U CN200920212380X U CN 200920212380XU CN 200920212380 U CN200920212380 U CN 200920212380U CN 201552692 U CN201552692 U CN 201552692U
- Authority
- CN
- China
- Prior art keywords
- plate
- positioning guide
- utility
- upper cover
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a connection structure between hot-half plates, which comprises a plate and at least one upper cover plate positioning guide post arranged thereon. A guide sleeve is disposed on a contact face, contacting with the upper cover plate positioning guide post, of the plate. The connection structure has the advantages that the contact face of the plate with the positioning post is added with the positioning guide sleeve, thereby increasing engaging performance and service life of the plate.
Description
Technical field
The utility model relates to a kind of hot half module, relates in particular to the syndeton between a kind of hot half module plate.
Background technology
Hot half module plate is connected with adjacent plate and adopts positioning guide column directly to cooperate in the prior art, for the easy plucking of panel hole inner surface, and is easy to generate when opening with mould and kills phenomenon.
Summary of the invention
The utility model technical issues that need to address have provided the syndeton between a kind of hot half module plate, are intended to solve the above problems.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions:
The utility model comprises: at least one upper cover plate positioning guide column on plate and the plate; On the contact-making surface of plate and upper cover plate positioning guide column, also settle a guide pin bushing.
Compared with prior art, the beneficial effects of the utility model are: plate and reference column contact-making surface increase location guide pin bushing, the matching property and the service life of having improved plate.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described in further detail:
As seen from Figure 1: the utility model comprises: at least one upper cover plate positioning guide column 2 on plate 3 and the plate 3; On the contact-making surface of plate 3 and upper cover plate positioning guide column 2, also settle a guide pin bushing 1.
When hot half module assembles, plate directly cooperates with the upper cover plate positioning guide column usually, but the plate material is softer, hardness is generally about HRC32 °, and about HRC60 ° of positioning guide column case hardness is easy to produce the plucking phenomenon when motion, and the time has been grown the plate locating hole and become big, positioning accuracy descends, and influences the precision of adapted to injection system.The utility model increases a guide pin bushing (plate 4 altogether) between workpiece and positioning guide column, plate does not directly cooperate with positioning guide column like this, because about the hardness HRC60 of guide pin bushing °, therefore its intensity, hardness, wearability have improved greatly, and the stability and the life-span of mould all are greatly improved.
Though more than described the specific embodiment of the present utility model, but those skilled in the art is to be understood that, these only illustrate, and under the prerequisite that does not deviate from principle of the present utility model and essence, can make numerous variations or modification to these embodiments.Therefore, protection domain of the present utility model is limited by appended claims.
Claims (1)
1. the syndeton between the hot half module plate comprises: at least one upper cover plate positioning guide column on plate and the plate; It is characterized in that: on the contact-making surface of plate and upper cover plate positioning guide column, also settle a guide pin bushing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200920212380XU CN201552692U (en) | 2009-11-13 | 2009-11-13 | Connection structure between hot-half plates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200920212380XU CN201552692U (en) | 2009-11-13 | 2009-11-13 | Connection structure between hot-half plates |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201552692U true CN201552692U (en) | 2010-08-18 |
Family
ID=42612367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200920212380XU Expired - Lifetime CN201552692U (en) | 2009-11-13 | 2009-11-13 | Connection structure between hot-half plates |
Country Status (1)
Country | Link |
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CN (1) | CN201552692U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102328364A (en) * | 2011-09-28 | 2012-01-25 | 凡嘉科技(无锡)有限公司 | Positioning guide post structure of mould |
-
2009
- 2009-11-13 CN CN200920212380XU patent/CN201552692U/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102328364A (en) * | 2011-09-28 | 2012-01-25 | 凡嘉科技(无锡)有限公司 | Positioning guide post structure of mould |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20100818 |
|
CX01 | Expiry of patent term |