CN201549487U - Wafer transport unit of semiconductor device - Google Patents
Wafer transport unit of semiconductor device Download PDFInfo
- Publication number
- CN201549487U CN201549487U CN2009200746793U CN200920074679U CN201549487U CN 201549487 U CN201549487 U CN 201549487U CN 2009200746793 U CN2009200746793 U CN 2009200746793U CN 200920074679 U CN200920074679 U CN 200920074679U CN 201549487 U CN201549487 U CN 201549487U
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- CN
- China
- Prior art keywords
- roller bearing
- wafer
- transducer
- transport
- drive motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer transport unit of a semiconductor device, which comprises a transport belt, a transport roller, and a recovery unit transport belt that are arranged in sequence transversely, wherein the transport roller is provided with a transport shuttle; a first sensor is arranged between the transport belt and the transport roller, the lower part of the transport roller is provided with a second sensor, and the two sensors are connected with a sensor relay respectively; and when the sensors sense wafers, the sensor relays thereof are closed, and the roller drives a motor by a constant power supply. The wafer transport unit judges whether abnormal phenomena appear in the wafer transport process by sensing whether the wafers exist at the two positions, namely the position between the transport belt and the transport roller, and the position at which the upper part of the transport roller is, forces the transport roller to rotate continuously when sensing the abnormal wafer transport, so as to transport the wafers to a recovery device, and can avoid the generation of wafer lamination on the transport roller.
Description
Technical field
The utility model relates to a kind of semiconductor production equipment, is specifically related to a kind of wafer handling device of semiconductor equipment.
Background technology
The conventional semiconductor production equipment, as the board of WJ1000 model, the part that is used for wafer handling comprises transversely arranged successively feed belt 1, transmits roller bearing 2, retracting device conveyer belt 3 as shown in Figure 1, transmits to be vertically arranged with on the roller bearing 2 and transmits shuttle 4.Transmit roller bearing 2 by the roller bearing drive motor, the roller bearing CD-ROM drive motor is driven by the batch (-type) driving power.
Retracting device conveyer belt 3 is the abnormal conditions that occur in transport process in order to solve, and does not promptly transmit on the shuttle 4 when wafer 10 is sent to, but continues to transmit to the right from transmitting roller bearing 2, and just reclaimed wafer 10 get up by retracting device conveyer belt 3 this moment.If but wafer 10 is parked in to transmit and does not continue on the roller bearing 2 to pass to the right, retracting device conveyer belt 3 just can't reclaim wafer 10, and the wafer 10 on the feed belt 1 is come constantly passing to the right, and wafer 10 just stacks on transmission roller bearing 2.
The utility model content
Technical problem to be solved in the utility model provides a kind of wafer handling device of semiconductor equipment, and it can prevent that semiconductor production equipment from the phenomenon of the unusual stack of wafer taking place in transport process.
For solving the problems of the technologies described above, the technical solution of the wafer handling device of the utility model semiconductor equipment is:
Comprise transversely arranged successively feed belt, transmit roller bearing, retracting device conveyer belt, transmit on the roller bearing and be vertically arranged with the transmission shuttle; Transmit roller bearing by the roller bearing drive motor, the roller bearing CD-ROM drive motor is driven by the batch (-type) driving power; Between described feed belt and the transmission roller bearing first sensor is set, transmits the roller bearing below second transducer is set, described two transducers connect the transducer relay respectively; When transducer has sensed wafer, its transducer relay closes; Described roller bearing CD-ROM drive motor also is provided with stabilized power source, and the roller bearing CD-ROM drive motor is connected with batch (-type) driving power, stabilized power source respectively by power supply relay, is switched the driving power of roller bearing CD-ROM drive motor by power supply relay; Power supply relay is connected with described two transducer relays; When two transducer relay closes, power supply relay switches, and the roller bearing CD-ROM drive motor is driven by stabilized power source.
The series circuit at described two transducer relays, power supply relay place is arranged in the self-locking circuit, and self-locking circuit is in series with luminous alarm and buzzer siren, and luminous alarm and buzzer siren are connected in parallel to each other.
Be in series with reset switch in the described self-locking circuit.
Be in series with adjustable resistance on the branch road of described stabilized power source place.
Described stabilized power source is external 3VDC.
Lateral separation between described two transducers is greater than the diameter of wafer.
The technique effect that the utility model can reach is:
Whether the utility model exists wafer to judge whether the wafer handling process occurs unusually by between sensing feed belt and the transmission roller bearing and these two positions, transmission roller bearing top simultaneously, and sensing wafer handling when unusual, forcing to transmit roller bearing continues to rotate, thereby wafer handling to retracting device, can be avoided transmitting generation wafer lamination on the roller bearing.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the wafer handling schematic representation of apparatus of prior art semiconductor equipment;
Fig. 2 is the wafer handling schematic representation of apparatus of the utility model semiconductor equipment.
Description of reference numerals among the figure:
1 is feed belt, and 2 are the transmission roller bearing,
3 is the retracting device conveyer belt, and 4 are the transmission shuttle,
10 is wafer, and A is a first sensor,
B is second transducer, and F is an amplifier,
J
CBe transducer relay, J
DBe power supply relay,
RL is luminous alarm, and BZ is a buzzer siren,
RST is a reset switch, and R is an adjustable resistance,
E is the roller bearing CD-ROM drive motor, V
WBe stabilized power source,
V
JBe the batch (-type) driving power.
Embodiment
The wafer handling device of the utility model semiconductor equipment comprises transversely arranged successively feed belt 1, transmits roller bearing 2, retracting device conveyer belt 3, transmits to be vertically arranged with on the roller bearing 2 and transmits shuttle 4; Whether between feed belt 1 and the transmission roller bearing 2 first sensor A is set, being used for sensing has wafer promptly will be sent to transmission roller bearing 2 from feed belt 1; Transmit roller bearing 2 belows the second transducer B is set, be used for sensing wafer and whether uploaded away from transmitting roller bearing 2.Two sensors A, B are arranged on the axis in wafer handling path, and the lateral separation between two sensors A, B is greater than the diameter of wafer.
Lateral separation between two sensors A, the B is greater than the diameter of wafer, can not cause two sensors A, B to be sheltered from by same wafer and produces the phenomenon of misoperation.
As shown in Figure 2, two sensors A, B are connected with amplifier F respectively, and amplifier F is provided with three ports, and an OVDC is an earth terminal, and one is operating voltage input termination 24VDC, and one is output; Amplifier F output connects the transducer relay J
CThe control end points, the transducer relay J
CThe control end points for often opening connection.
When sensors A and/or B had sensed wafer, the output of the amplifier F that is connected with this transducer output 24VDC made its transducer relay J
CClosed.
Roller bearing CD-ROM drive motor E is provided with the two-way driving power, and one the tunnel is original batch (-type) driving power V
J, another road is stabilized power source V
WThe driving power of roller bearing CD-ROM drive motor E is by power supply relay J
DSwitch.
Batch (-type) driving power V
JBy power supply relay J
DNormally closed end points connect roller bearing CD-ROM drive motor E; Stabilized power source V
WBy power supply relay J
DThe Chang Kaiduan point connect roller bearing CD-ROM drive motor E, stabilized power source V
WBe external 3VDC, stabilized power source V
WBe in series with adjustable resistance R on the branch road.
Two transducer relay J
CControl end points and power supply relay J
DControl end points series connection, this section series circuit one termination 24VDC, a termination OVDC.
Two transducer relay J
C, power supply relay J
DThe series circuit at place is arranged in the self-locking circuit, and self-locking circuit is in series with luminous alarm RL and buzzer siren BZ, and luminous alarm RL and buzzer siren BZ are connected in parallel to each other.Be in series with reset switch RST in the self-locking circuit.
When two transducer relay J
CBe in closure state, 24VDC is linked into power supply relay J
DThe control end points, power supply relay J then
DAction, the contact switches to Chang Kaiduan by normal-closed end, with the driving power of roller bearing CD-ROM drive motor E by batch (-type) driving power V
JSwitch to stabilized power source V
W, at this moment just by external 3VDC stabilized power source V
WDrive roller bearing CD-ROM drive motor E, and regulate the rotating speed of roller bearing CD-ROM drive motor E by adjustable resistance R.
Just realized such function thus: when first sensor A sense at feed belt 1 and transmit wafer arranged between the roller bearing 2 (be first sensor A sense be about to wafer to leave from feed belt 1 to be sent to transmit on the roller bearing 2), simultaneously the second transducer B sense transmit roller bearing 2 above wafer (promptly the second transducer B senses transmitting on the roller bearing 2 and also has wafer to be walked by biography) is being arranged, two sensors A, B are respectively to separately transducer relay J
COutput signal makes two transducer relay J
CClosure, signal pass to power supply relay J then
D, power supply relay J
DThe batch (-type) driving power V of roller bearing CD-ROM drive motor E will originally be controlled
JSwitch to stabilized power source V
WOn, make roller bearing CD-ROM drive motor E drive transmission roller bearing 2 and continue to rotate, thereby wafer is constantly transmitted to the right with a constant speed, until retracting device conveyer belt 3, reclaim thereby be recovered device, be unlikely on transmission roller bearing 2, lamination to take place.
Owing in this process, have spacing between wafer and the wafer, so the some situations that does not have wafer in blink among two sensors A, the B can occur, this moment, the relay of this transducer disconnected power supply relay J
DThe driving power of roller bearing CD-ROM drive motor E is switched back original batch (-type) driving power V again
J, can cause like this becoming chaotic in the transmission action that transmits roller bearing 2 places.The utility model is with two transducer relay J
CWith power supply relay J
DBe arranged in the self-locking circuit, and be in series with luminous alarm RL and buzzer siren BZ, can when realizing self-locking, send sound and light alarm, to remind the staff.
Claims (6)
1. the wafer handling device of a semiconductor equipment comprises transversely arranged successively feed belt, transmits roller bearing, retracting device conveyer belt, transmits on the roller bearing and is vertically arranged with the transmission shuttle; Transmit roller bearing by the roller bearing drive motor, the roller bearing CD-ROM drive motor is driven by the batch (-type) driving power; It is characterized in that:
Between described feed belt and the transmission roller bearing first sensor is set, transmits the roller bearing below second transducer is set, described two transducers connect the transducer relay respectively; When transducer has sensed wafer, its transducer relay closes;
Described roller bearing CD-ROM drive motor also is provided with stabilized power source, and the roller bearing CD-ROM drive motor is connected with batch (-type) driving power, stabilized power source respectively by power supply relay, is switched the driving power of roller bearing CD-ROM drive motor by power supply relay; Power supply relay is connected with described two transducer relays; When two transducer relay closes, power supply relay switches, and the roller bearing CD-ROM drive motor is driven by stabilized power source.
2. the wafer handling device of semiconductor equipment according to claim 1, it is characterized in that: the series circuit at described two transducer relays, power supply relay place is arranged in the self-locking circuit, self-locking circuit is in series with luminous alarm and buzzer siren, and luminous alarm and buzzer siren are connected in parallel to each other.
3. the wafer handling device of semiconductor equipment according to claim 2 is characterized in that: be in series with reset switch in the described self-locking circuit.
4. the wafer handling device of semiconductor equipment according to claim 1 is characterized in that: be in series with adjustable resistance on the branch road of described stabilized power source place.
5. the wafer handling device of semiconductor equipment according to claim 1, it is characterized in that: described stabilized power source is external 3VDC.
6. the wafer handling device of semiconductor equipment according to claim 1, it is characterized in that: the lateral separation between described two transducers is greater than the diameter of wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200746793U CN201549487U (en) | 2009-11-12 | 2009-11-12 | Wafer transport unit of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200746793U CN201549487U (en) | 2009-11-12 | 2009-11-12 | Wafer transport unit of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201549487U true CN201549487U (en) | 2010-08-11 |
Family
ID=42604666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200746793U Expired - Fee Related CN201549487U (en) | 2009-11-12 | 2009-11-12 | Wafer transport unit of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201549487U (en) |
-
2009
- 2009-11-12 CN CN2009200746793U patent/CN201549487U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131217 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131217 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20151112 |
|
| EXPY | Termination of patent right or utility model |