CN201530060U

CN201530060U - Wafer slicer guide wheel

Info

Publication number: CN201530060U
Application number: CN2009200429524U
Authority: CN
Inventors: 施海明; 陆景刚; 张锦根; 鄂林
Original assignee: Zhenjiang Huantai Silicon Technology Co Ltd
Current assignee: Zhenjiang Huantai Silicon Technology Co Ltd
Priority date: 2009-06-30
Filing date: 2009-06-30
Publication date: 2010-07-21
Anticipated expiration: 2019-06-30

Abstract

The utility model relates to a production facility of silicon wafers for solar energy, belongs to a slicer component used for cutting silicon single crystal bars into wafers, and particularly relates to a wafer slicer guide wheel. The wafer slicer guide wheel comprises a cylindrical wheel body and spiral guide grooves distributed on the outer cylindrical surface of the guide wheel, wherein space between adjacent guide grooves is reduced gradually from the front end of the guide wheel to the rear end thereof. The wafer slicer guide wheel has the advantages of increasing economization of wafer cutting to the utmost extent by utilizing changes of cutting line during a cutting process. Because the diameter of the cutting line is reduced gradually due to cutting loss during a process of sequentially bypassing the guide grooves and cutting bars, space of the guide grooves arranged on the guide wheel is reduced gradually matching with reduction of the diameter of the cutting line, and then more wafers can be cut out by utilizing the bar per unit length and cutting line consumption per unit length, thereby reducing manufacturing cost of wafers.

Description

Wafer slice machine guide wheel

Technical field

The utility model relates to a kind of production equipment of silicon suitable for solar purposes wafer, is a kind of parts that are used for the silicon single crystal bar is cut into the slicer of wafer, specifically is a kind of wafer slice machine guide wheel.

Background technology

The common working method of the existing slicer that is used for cutting the silicon wafer bar is as shown in Figure 1: the guide wheel 11 that the surface is placed with the helical form guide groove is set, line of cut 12 is on the guide groove of guide wheel, thereby the one-directional rotation by guide wheel makes line of cut move formation multistage cutting active section on the length direction of guide wheel, with the line of cut cutting silicon single crystal bar 13 formation wafers that move.In this structure, the spacing of the guide groove of arranging on the whole guide wheel has determined the spacing of each section cutting active section of each line of cut.When the spacing of guide groove is big, the wafer number that the bar of unit length can cut is less, when the spacing of guide groove hour, the wafer number that the bar of unit length can cut is more, to the consumption of material, the thick more guide groove spacing that allows of line of cut diameter is also big more when considering the line of cut cutting.In the common Guiding wheel structure, guide groove spacing on the guide wheel is evenly to be provided with according to the nominal diameter of employed line of cut, does not improve the wafer number that the consumption of wafer number that unit bar length can cut and unit length line of cut can be cut to greatest extent.

Summary of the invention

Technical problem to be solved in the utility model is, providing a kind of can increase the cutting quantity that unit length bar and unit length line of cut consume lower wafer, can reduce the wafer slice machine guide wheel of wafer manufacture cost.

Wafer slice machine guide wheel of the present utility model includes columned wheel body and is arranged in spiral-shaped guide groove on the guide wheel external cylindrical surface, it is characterized in that: to the rear end, the spacing of adjacent guide groove reduces gradually by the front end of guide wheel.

Effect of the present utility model is embodied in: utilize the variation of line of cut in cutting process, improve the economy of wafer cutting to greatest extent.Because line of cut is being walked around each guide groove successively and is being cut that its diameter reduces gradually because of the cutting wearing and tearing in the process of bar, be arranged on that guide groove on the guide wheel cooperates reducing of line of cut diameter and spacing is dwindled gradually, make the bar of unit length and the line of cut consumption of unit length can cut out more wafer like this, reduced the wafer manufacturing cost.

Description of drawings

Fig. 1 is slicer cutting work principle figure;

Fig. 2 is a guide wheel schematic diagram of the present utility model;

Fig. 3 is the local structure for amplifying schematic diagram of the A at guide wheel of the present utility model edge.

The specific embodiment

As shown in Figure 2, wafer slice machine guide wheel of the present utility model includes columned wheel body 21 and the helical form guide groove 22 that is arranged on the wheel body, by the front end of guide wheel to the rear end, the spacing L of adjacent guide groove reduces gradually, in the course of work, line of cut begins to leave guide wheel after go into, walking around all guide grooves successively from guide groove foremost, by the rotation of a pair of guide wheel, drive line of cut cutting bar.

Claims

1. wafer slice machine guide wheel comprises including columned wheel body and being arranged in spiral-shaped guide groove on the guide wheel external cylindrical surface, it is characterized in that: to the rear end, the spacing of adjacent guide groove reduces gradually by the front end of guide wheel.