CN201502974U - 一种led散热基座封装结构 - Google Patents
一种led散热基座封装结构 Download PDFInfo
- Publication number
- CN201502974U CN201502974U CN2009200779566U CN200920077956U CN201502974U CN 201502974 U CN201502974 U CN 201502974U CN 2009200779566 U CN2009200779566 U CN 2009200779566U CN 200920077956 U CN200920077956 U CN 200920077956U CN 201502974 U CN201502974 U CN 201502974U
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- led
- chip
- ceramic layer
- cooling base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200779566U CN201502974U (zh) | 2009-07-07 | 2009-07-07 | 一种led散热基座封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200779566U CN201502974U (zh) | 2009-07-07 | 2009-07-07 | 一种led散热基座封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201502974U true CN201502974U (zh) | 2010-06-09 |
Family
ID=42453907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009200779566U Expired - Fee Related CN201502974U (zh) | 2009-07-07 | 2009-07-07 | 一种led散热基座封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201502974U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102734678A (zh) * | 2012-05-30 | 2012-10-17 | 江苏威纳德照明科技有限公司 | 一种大功率led光源 |
WO2017054234A1 (zh) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Led灯管 |
WO2018176738A1 (zh) * | 2017-04-01 | 2018-10-04 | 杭州安得电子有限公司 | 一种led灯 |
-
2009
- 2009-07-07 CN CN2009200779566U patent/CN201502974U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102734678A (zh) * | 2012-05-30 | 2012-10-17 | 江苏威纳德照明科技有限公司 | 一种大功率led光源 |
CN102734678B (zh) * | 2012-05-30 | 2013-04-17 | 江苏威纳德照明科技有限公司 | 一种大功率led光源 |
WO2017054234A1 (zh) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Led灯管 |
WO2018176738A1 (zh) * | 2017-04-01 | 2018-10-04 | 杭州安得电子有限公司 | 一种led灯 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG YAOHENG OPTOELECTRONICS TECHNOLOGY CO., L Free format text: FORMER OWNER: HANGZHOU HAOYUE TECHNOLOGY CO., LTD. Effective date: 20110117 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 310030 WEST SIDE OF 3/F, PLANT 1, NO.8, XIYUAN ROAD, SANDUN TOWN, XIHU DISTRICT, HANGZHOU CITY, ZHEJIANG PROVINCE TO: 311600 PUTIAN VILLAGE ( INDUSTRIAL FUNCTION ZONE), QINTANG TOWNSHIP, JIANDE CITY, ZHEJIANG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20110117 Address after: 311600, Zhejiang, Jiande Province Qin Tang Xiang Pu Tian Village (industrial function area) Patentee after: Zhejiang Haolight Photoelectricity Technology Co., Ltd. Address before: No. 8, No. 1 West Hangzhou plant on the third floor of 310030 cities in Zhejiang province Xihu District three Town West Road Patentee before: Hangzhou Haoyue Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100609 Termination date: 20180707 |
|
CF01 | Termination of patent right due to non-payment of annual fee |