CN201498821U - High band radio frequency integrated connector - Google Patents
High band radio frequency integrated connector Download PDFInfo
- Publication number
- CN201498821U CN201498821U CN2009200350071U CN200920035007U CN201498821U CN 201498821 U CN201498821 U CN 201498821U CN 2009200350071 U CN2009200350071 U CN 2009200350071U CN 200920035007 U CN200920035007 U CN 200920035007U CN 201498821 U CN201498821 U CN 201498821U
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- CN
- China
- Prior art keywords
- outer conductor
- connector
- radio frequency
- integrated connector
- high band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a high band radio frequency integrated connector, which comprises an inner conductor 1, insulating medium 2, an outer conductor 3 and a mounting plate 4, and is characterized in that each mounting inner hole on the mounting plate 4 is manufactured into inner screw threads, the excircle of the outer conductor 3 is manufactured into outer screw threads, and the outer conductor 3 is screwed in the mounting inner hole of the mounting plate 4 through the screw threads. The utility model is an SMP integrated connector which can satisfy modularization requirement and be conveniently maintained and replaced, and the problems of complicated installation and maintenance, large processing difficulty and high production cost are solved through improving the connecting mode of an SMP positive head and the mounting plate from the welding into screw thread connection. When in assembly, each SMP positive head is screwed as an independent body. When in test, if one connector fails, the failed connector can be detached and replaced with a new connector, and the operation is convenient and simple. Material of the connector can be selected according to requirements of different users.
Description
Technical field
The utility model relates to a kind of high band radio frequency integrated connector, is specially adapted to require the frequency range height, leakage is little, the locus is narrow and small, requires again simultaneously in the communication system that multiple signals transmit simultaneously.
Background technology
Along with electronics, communication apparatus constantly develop to miniaturization, integrated, high band direction, conventional integrated connector is because the requirement of adopting that the connector frequency is low, volume can not satisfy scientific technological advance greatly and more and more.The SMP connector because of have the frequency height, advantages such as volume is little, integrated level is high, blind slotting convenience form the focus of paying close attention to into people, and provide three kinds of different interface dimensions satisfying the requirement of different contact engaging and separating forces, and become the first-selection of new integrated connector.
Traditional SMP integrated connector normally is fixed on the sun head of SMP series connector on the mounting panel of system.Fixing means commonly used is soldering.With positive hole that is respectively charged into the mounting panel of putting into scolding tin of a plurality of SMP, heating monoblock mounting panel flows evenly scolding tin, welds reliably.Because during heating, temperature is higher, the dielectric polytetrafluoroethylene that adopts is heated and easily expands usually, can be elongated, so dielectric will adopt the high glass medium of heat resisting temperature; In order to reduce the influence of expanding with heat and contract with cold and causing between inner and outer conductor and the dielectric, the material of inner and outer conductor is all selected the kovar alloy close with the glass medium coefficient of expansion for use, but kovar alloy is than the difficult processing of conventional stainless steel.The SMP sun head of glass sintering can satisfy the airtight requirement of machine system.After the assembling, if detect when in the SMP integrated connector one or more nonpassage of signal being arranged, when needing wherein one or more SMP sun of dismounting, must be again to the heating of whole erection plate, troublesome poeration is unfavorable for repair and replacement, and might damage mounting panel, cause integral body to scrap.
The utility model content
The technical problem that solves
For fear of the deficiencies in the prior art part, the utility model proposes a kind of high band radio frequency integrated connector, can either satisfy the SMP integrated connector that the modularization demand can be convenient to maintain and replace again.
Technical scheme
A kind of high band radio frequency integrated connector comprises inner wire 1, dielectric 2, outer conductor 3 and mounting panel 4; It is characterized in that: each on the described mounting panel 4 installed endoporus and is processed as internal thread, and the cylindrical of outer conductor 3 is processed into external screw thread, and outer conductor 3 is by being threaded into the installation endoporus of mounting panel 4.
The external screw thread of described outer conductor 3 be aided with during mounting panel 4 must be threaded gluing.
The material of described inner wire 1, outer conductor 3 and dielectric 2 is selected tin-phosphor bronze, stainless steel or polytetrafluoroethylene for use.
Described inner wire 1, outer conductor 3 materials are kovar alloy.
Described dielectric 2 glass mediums.
Beneficial effect
A kind of high band radio frequency integrated connector, the modularization demand can either be satisfied and the SMP integrated connector of maintain and replace can be convenient to again, by to of the improvement of SMP sun head with the connected mode of mounting panel, change into by original welding and to be threaded, solved installation and maintenance troubles, difficulty of processing is big, production cost is high problem.During assembling, each SMP sun head all be as one independently individuality pack into.During test,, only need defective item is pulled down, change a new connector and get final product if there are indivedual connectors to break down, convenient and simple for operation.Simultaneously, at the requirement of different user, can suitably select the material of connector.
Compared with prior art have the following advantages:
(1), adopt thread connecting mode, easy to loading and unloading, simple, easy operating;
(2), can select suitable material according to different requirements, make things convenient for production and processing, enhance productivity;
(3), improve cost performance of product, reduce production costs, shorten the production cycle.
Description of drawings
Fig. 1: be the no airtight structural representation that requires integrated connector of the present utility model;
Fig. 2: be the airtight structural representation that requires integrated connector that has of the present utility model;
Wherein: 1-inner wire, 2-dielectric, 3-outer conductor, 4-mounting panel.
Embodiment
Now in conjunction with the embodiments, accompanying drawing is further described the utility model:
Present embodiment is made up of inner wire 1, dielectric 2, outer conductor 3 and mounting panel 4.
Described inner wire 1, outer conductor 3 materials are kovar alloy.
Described dielectric 2 glass mediums.
Dielectric 2 and inner wire 1 are packed in the outer conductor 3 in the lump, behind some glue on the external screw thread of outer conductor 3, outer conductor 3 is screwed in the screwed hole of mounting panel 4, be screwed to the position with corresponding frock.Inner wire afterbody extension can weld with user's wiring board.The external screw thread of described outer conductor 3 be aided with during mounting panel 4 must be threaded gluing.
By to of the improvement of SMP sun head with the connected mode of mounting panel, change into by original welding and to be threaded, solved installation and maintenance troubles, difficulty of processing is big, production cost is high problem.During assembling, each SMP sun head all be as one independently individuality pack into.During test,, only need defective item is pulled down, change a new connector and get final product if there are indivedual connectors to break down, convenient and simple for operation.Simultaneously, at the requirement of different user, can suitably select the material of connector.Not high and when not having airtight the requirement, the material of connector can be selected conventional tin-phosphor bronze, stainless steel and polytetrafluoroethylene for use when frequency of utilization; Frequency of utilization is higher and airtight requirement is arranged, and the material of connector can be selected more expensive kovar alloy and glass medium for use.
Claims (5)
1. a high band radio frequency integrated connector comprises inner wire (1), dielectric (2), outer conductor (3) and mounting panel (4); It is characterized in that: each on the described mounting panel (4) installed endoporus and is processed as internal thread, and the cylindrical of outer conductor (3) is processed into external screw thread, and outer conductor (3) is by being threaded into the installation endoporus of mounting panel (4).
2. high band radio frequency integrated connector according to claim 1 is characterized in that: the external screw thread of described outer conductor (3) be aided with during mounting panel (4) must be threaded gluing.
3. high band radio frequency integrated connector according to claim 1 and 2 is characterized in that: the material of described inner wire (1), outer conductor (3) and dielectric (2) is selected tin-phosphor bronze, stainless steel or polytetrafluoroethylene for use.
4. high band radio frequency integrated connector according to claim 1 and 2 is characterized in that: described inner wire (1), outer conductor (3) material are kovar alloy.
5. high band radio frequency integrated connector according to claim 1 and 2 is characterized in that: described dielectric (2) glass medium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200350071U CN201498821U (en) | 2009-10-13 | 2009-10-13 | High band radio frequency integrated connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200350071U CN201498821U (en) | 2009-10-13 | 2009-10-13 | High band radio frequency integrated connector |
Publications (1)
Publication Number | Publication Date |
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CN201498821U true CN201498821U (en) | 2010-06-02 |
Family
ID=42442018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009200350071U Expired - Fee Related CN201498821U (en) | 2009-10-13 | 2009-10-13 | High band radio frequency integrated connector |
Country Status (1)
Country | Link |
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CN (1) | CN201498821U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682815A (en) * | 2013-11-05 | 2014-03-26 | 深圳市大富科技股份有限公司 | Cluster connector |
CN105281085A (en) * | 2015-11-18 | 2016-01-27 | 成都雷电微力科技有限公司 | A radio frequency connector used for tile-type plane sub-arrays |
CN105304996A (en) * | 2015-11-18 | 2016-02-03 | 成都雷电微力科技有限公司 | Vertical radio frequency connection structure used for tile type face array |
CN105356101A (en) * | 2015-11-24 | 2016-02-24 | 宁波市鄞州永佳连接器件厂(普通合伙) | Television closed-circuit connector |
CN108551074A (en) * | 2018-05-29 | 2018-09-18 | 上海科发电子产品有限公司 | A kind of sintering mold for connector |
CN109887888A (en) * | 2019-03-07 | 2019-06-14 | 河北中瓷电子科技有限公司 | TO glass metal encapsulating package and preparation method |
-
2009
- 2009-10-13 CN CN2009200350071U patent/CN201498821U/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682815A (en) * | 2013-11-05 | 2014-03-26 | 深圳市大富科技股份有限公司 | Cluster connector |
CN103682815B (en) * | 2013-11-05 | 2016-03-09 | 深圳市大富科技股份有限公司 | A kind of cluster connector |
CN105281085A (en) * | 2015-11-18 | 2016-01-27 | 成都雷电微力科技有限公司 | A radio frequency connector used for tile-type plane sub-arrays |
CN105304996A (en) * | 2015-11-18 | 2016-02-03 | 成都雷电微力科技有限公司 | Vertical radio frequency connection structure used for tile type face array |
CN105304996B (en) * | 2015-11-18 | 2019-01-22 | 成都雷电微力科技有限公司 | A kind of vertical radio frequency connecting structure for tile type face battle array |
CN105356101A (en) * | 2015-11-24 | 2016-02-24 | 宁波市鄞州永佳连接器件厂(普通合伙) | Television closed-circuit connector |
CN108551074A (en) * | 2018-05-29 | 2018-09-18 | 上海科发电子产品有限公司 | A kind of sintering mold for connector |
CN109887888A (en) * | 2019-03-07 | 2019-06-14 | 河北中瓷电子科技有限公司 | TO glass metal encapsulating package and preparation method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20121013 |