CN201498383U - Capacitor lead forming die - Google Patents

Capacitor lead forming die Download PDF

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Publication number
CN201498383U
CN201498383U CN2009200480022U CN200920048002U CN201498383U CN 201498383 U CN201498383 U CN 201498383U CN 2009200480022 U CN2009200480022 U CN 2009200480022U CN 200920048002 U CN200920048002 U CN 200920048002U CN 201498383 U CN201498383 U CN 201498383U
Authority
CN
China
Prior art keywords
lead forming
capacitor lead
forming die
capacitor
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200480022U
Other languages
Chinese (zh)
Inventor
黄锋
陈健
惠晶
林石福
顾君
石明华
严惠平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Huifeng Electronic Technology Co Ltd
Original Assignee
Nantong Huifeng Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong Huifeng Electronic Technology Co Ltd filed Critical Nantong Huifeng Electronic Technology Co Ltd
Priority to CN2009200480022U priority Critical patent/CN201498383U/en
Application granted granted Critical
Publication of CN201498383U publication Critical patent/CN201498383U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a capacitor lead forming die, which comprises a die body. A lead forming penetrating hole is arranged in the middle of the die body, and a diamond layer connected with the die body is arranged on the periphery of the lead forming penetrating hole. The capacitor lead forming die is reasonable in structure and long in service life and is wear resistant, and further, produced products are fine in smoothness and stable in size.

Description

The capacitor lead wire mould
Technical field:
The utility model relates to a kind of capacitor lead wire mould.
Background technology:
Existing capacitor lead wire mould is whole metal material, and lead-in wire moulding perforation place is easy to wear, and the product glossiness of production is not good, the product size instability, and useful life is short.
Summary of the invention:
It is a kind of rational in infrastructure, wear-resisting that the purpose of this utility model is to provide, and the product glossiness of production is good, the capacitor lead wire mould that the product size of production is stable.
Technical solution of the present utility model is:
A kind of capacitor lead wire mould comprises die ontology, and lead-in wire moulding perforation is set in the middle of the die ontology, it is characterized in that: the diamond layer that is connected with die ontology in the setting of lead-in wire moulding perforation periphery.
The utility model is rational in infrastructure, and is wear-resisting, and the product glossiness of production is good, and the product size of production is stable, long service life.
Description of drawings:
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the configuration diagram of an embodiment of the utility model.
Embodiment:
A kind of capacitor lead wire mould comprises die ontology 1, and lead-in wire moulding perforation 2 is set in the middle of the die ontology, the diamond layer 3 that is connected with die ontology in the setting of lead-in wire moulding perforation periphery.

Claims (1)

1. a capacitor lead wire mould comprises die ontology, and lead-in wire moulding perforation is set in the middle of the die ontology, it is characterized in that: the diamond layer that is connected with die ontology in the setting of lead-in wire moulding perforation periphery.
CN2009200480022U 2009-08-25 2009-08-25 Capacitor lead forming die Expired - Fee Related CN201498383U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200480022U CN201498383U (en) 2009-08-25 2009-08-25 Capacitor lead forming die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200480022U CN201498383U (en) 2009-08-25 2009-08-25 Capacitor lead forming die

Publications (1)

Publication Number Publication Date
CN201498383U true CN201498383U (en) 2010-06-02

Family

ID=42441585

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200480022U Expired - Fee Related CN201498383U (en) 2009-08-25 2009-08-25 Capacitor lead forming die

Country Status (1)

Country Link
CN (1) CN201498383U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100602

Termination date: 20100825