CN201486097U - Bamboo composite floor - Google Patents
Bamboo composite floor Download PDFInfo
- Publication number
- CN201486097U CN201486097U CN2009201245621U CN200920124562U CN201486097U CN 201486097 U CN201486097 U CN 201486097U CN 2009201245621 U CN2009201245621 U CN 2009201245621U CN 200920124562 U CN200920124562 U CN 200920124562U CN 201486097 U CN201486097 U CN 201486097U
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- Prior art keywords
- bamboo
- edge
- basal layer
- chip
- bamboo chip
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Abstract
The utility model discloses a bamboo composite floor. The floor comprises at least two layers of base layers, wherein the base layer is formed by a plurality of longitudinal bamboo chips horizontally pieced together, overlaid, and combined, at least one place between longitudinal tenons and mortises on the side wall of the base layer is full wafers of standing bamboo chips horizontally pieced together lengthways edge-on, wood flakes are combined on the upper surface of the base layer and the standing bamboo chips, the wood flakes can be combined on the lower surface thereof, the wood flakes also can be combined on the base layer, the standing bamboo chips, and the lower surface of the standing bamboo chips, and the matching contact surfaces or the compound contact surfaces are provided with adhesives. The floor has the benefits that the longitudinal tenons and mortises on the side wall of the base layer is applied with full wafers of standing bamboo chips horizontally pieced together lengthways edge-on, thereby having great counter bending ability, effectively preventing floors from buckling deformation, improving the product quality, and facilitating the meshing of the tenons and mortise grooves when being mounted.
Description
Technical field
The utility model relates to a kind of bamboo compound floor.
Background technology
People fully develop bamboo wood resource, produce many products of producing or living of being used to.With the surface course of wooden thin slice,, be exactly a kind of in the multiple wooden bamboo product with the basal layer of the stacked plate that forms of bamboo chip splicing as the floor as the floor.The wood bamboo composite floor of prior art, normally the longitudinal spliced stacked plate of at least two layers of bamboo chip is as the basal layer on floor.Its weak point is that buckling deformation takes place easily for two layers or three layers or four layers of longitudinal spliced stacked floor of making of bamboo chip, in case the floor slightly is out of shape, the difficulty of tenon and fourth of the twelve Earthly Branches groove engagement is just bigger during installation.
The utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of buckling deformation little, and the engagement of tenon and fourth of the twelve Earthly Branches groove is relatively easy to bamboo compound floor during installation.
The technical scheme of the utility model bamboo compound floor, comprise that basal layer is two-layerly at least to be combined by vertically flat stacked the putting of multi-disc bamboo chip, vertical tenon of described basal layer side, place, the fourth of the twelve Earthly Branches one of them place at least are the edge-on bamboo chips of vertical edge-on flat assembly of full wafer, the upper surface wood composite thin slice of described basal layer and edge-on bamboo chip.The soffit of described basal layer and edge-on bamboo chip can also the wood composite thin slice.The edge-on bamboo chip that wherein another place at vertical tenon of described basal layer side, place, the fourth of the twelve Earthly Branches also can be vertical edge-on flat assembly of full wafer.The soffit of described basal layer, edge-on bamboo chip and edge-on bamboo chip also can the wood composite thin slice.Described splicing contact surface or compound contact surface have adhesive.Described edge-on bamboo chip also can be a wood chip.
The beneficial effect of the utility model bamboo compound floor is, vertical tenon of basal layer side, place, the fourth of the twelve Earthly Branches use the edge-on bamboo chip of vertical edge-on flat assembly of full wafer, has bigger counter-bending ability, can prevent the floor buckling deformation effectively, improved the quality of product, tenon meshes just than being easier to the fourth of the twelve Earthly Branches groove during installation.
Description of drawings
Fig. 1 is the front view of the utility model first embodiment;
Fig. 2 is along the sectional drawing of A-A tangent plane among Fig. 1;
Fig. 3 is the enlarged drawing at I place among Fig. 2;
Fig. 4 is the enlarged drawing at II place among Fig. 2;
Fig. 5 is the front view of the utility model second embodiment;
Fig. 6 is along the sectional drawing of B-B tangent plane among Fig. 5;
Fig. 7 is the enlarged drawing at III place among Fig. 6;
Fig. 8 is the enlarged drawing at IV place among Fig. 6;
Fig. 9 is the front view of the utility model the 3rd embodiment;
Figure 10 is along the sectional drawing of C-C tangent plane among Fig. 9;
Figure 11 is the enlarged drawing at V place among Fig. 9;
Figure 12 is the enlarged drawing at VI place among Fig. 9.
The specific embodiment
First embodiment:
Fig. 1, Fig. 2, Fig. 3, bamboo compound floor shown in Figure 4, comprise that basal layer 2 is two-layerly to be combined by vertically flat stacked the putting of multi-disc bamboo chip 3, the groove place, vertical fourth of the twelve Earthly Branches of described basal layer 2 sides is edge-on bamboo chips 4 of vertical edge-on flat assembly of full wafer, the upper surface wood composite thin slice 1 of described basal layer 2 and edge-on bamboo chip 4.Described splicing contact surface or compound contact surface have adhesive.
Second embodiment:
Fig. 5, Fig. 6, Fig. 7, bamboo compound floor shown in Figure 8, comprise that basal layer 2 is two-layerly to be combined by vertically flat stacked the putting of multi-disc bamboo chip 3, the groove place, vertical fourth of the twelve Earthly Branches of described basal layer 2 one sides is edge-on bamboo chips 4 of vertical edge-on flat assembly of full wafer, and vertical tenon place of described basal layer 2 another sides is edge-on bamboo chips 5 of vertical edge-on flat assembly of full wafer.The upper surface wood composite thin slice 1 of described basal layer 2, edge-on bamboo chip 4 and edge-on bamboo chip 5, the soffit wood composite thin slice 6 of described basal layer 2, edge-on bamboo chip 4 and edge-on bamboo chip 5.Described splicing contact surface or compound contact surface have adhesive.
The 3rd embodiment:
Fig. 9, Figure 10, Figure 11, bamboo compound floor shown in Figure 12, comprise that basal layer 2 is three layers and is combined by vertically flat stacked the putting of multi-disc bamboo chip 3, the groove place, vertical fourth of the twelve Earthly Branches of described basal layer 2 one sides is edge-on bamboo chips 4 of vertical edge-on flat assembly of full wafer, and vertical tenon place of described basal layer 2 another sides is edge-on bamboo chips 5 of vertical edge-on flat assembly of full wafer.The upper surface wood composite thin slice 1 of described basal layer 2, edge-on bamboo chip 4 and edge-on bamboo chip 5, the soffit wood composite thin slice 6 of described basal layer 2, edge-on bamboo chip 4 and edge-on bamboo chip 5.Described splicing contact surface or compound contact surface have adhesive.
Claims (7)
1. bamboo compound floor, comprise that basal layer (2) is two-layerly at least to be combined by vertically flat stacked the putting of multi-disc bamboo chip (3), it is characterized in that, vertical tenon of described basal layer (2) side, place, the fourth of the twelve Earthly Branches one of them place at least are the edge-on bamboo chips (4) of vertical edge-on flat assembly of full wafer, the upper surface wood composite thin slice (1) of described basal layer (2) and edge-on bamboo chip (4).
2. bamboo compound floor according to claim 1 is characterized in that, the soffit wood composite thin slice (6) of described basal layer (2) and edge-on bamboo chip (4).
3. bamboo compound floor according to claim 1 is characterized in that, wherein another place at vertical tenon of described basal layer (2) side, place, the fourth of the twelve Earthly Branches is the edge-on bamboo chip (5) of vertical edge-on flat assembly of full wafer.
4. bamboo compound floor according to claim 3 is characterized in that, the soffit wood composite thin slice (6) of described basal layer (2), edge-on bamboo chip (4) and edge-on bamboo chip (5).
5. according to above any described bamboo compound floor of claim, it is characterized in that described splicing contact surface or compound contact surface have adhesive.
6. according to claim 1 or 2 or 4 described bamboo compound floors, it is characterized in that described edge-on bamboo chip (4) is a wood chip.
7. according to claim 3 or 4 described bamboo compound floors, it is characterized in that described edge-on bamboo chip (5) is a wood chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201245621U CN201486097U (en) | 2009-07-10 | 2009-07-10 | Bamboo composite floor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201245621U CN201486097U (en) | 2009-07-10 | 2009-07-10 | Bamboo composite floor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201486097U true CN201486097U (en) | 2010-05-26 |
Family
ID=42424982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009201245621U Expired - Fee Related CN201486097U (en) | 2009-07-10 | 2009-07-10 | Bamboo composite floor |
Country Status (1)
Country | Link |
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CN (1) | CN201486097U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103726632A (en) * | 2013-12-13 | 2014-04-16 | 余成月 | Bamboo-wood composite floor |
-
2009
- 2009-07-10 CN CN2009201245621U patent/CN201486097U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103726632A (en) * | 2013-12-13 | 2014-04-16 | 余成月 | Bamboo-wood composite floor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20120710 |