CN201478514U - Electrical connector structure - Google Patents

Electrical connector structure Download PDF

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Publication number
CN201478514U
CN201478514U CN200920161948XU CN200920161948U CN201478514U CN 201478514 U CN201478514 U CN 201478514U CN 200920161948X U CN200920161948X U CN 200920161948XU CN 200920161948 U CN200920161948 U CN 200920161948U CN 201478514 U CN201478514 U CN 201478514U
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CN
China
Prior art keywords
side wall
electric connector
connector structure
wall surface
circuit board
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Expired - Fee Related
Application number
CN200920161948XU
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Chinese (zh)
Inventor
郭志翰
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Inventec Corp
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Inventec Corp
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Priority to CN200920161948XU priority Critical patent/CN201478514U/en
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Publication of CN201478514U publication Critical patent/CN201478514U/en
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Abstract

An electrical connector structure is used for electrically connecting a memory module to a circuit board. The electrical connector structure comprises a body, and lateral wall surfaces of the body can be provided with grooves or ribs selectively so as to thin or thicken the body and enable the body to be heated uniformly, thereby forming uniform thermal expansion on each portion of the body to further prevent the body from warping or deforming caused by uneven heating.

Description

Electric connector structure
Technical field
The utility model is about a kind of electric connector, particularly a kind of electric connector structure.
Background technology
Generally speaking, plastic raw materials is broadly divided into thermoplastics (Thermoplastic) and thermoset plastics (Thermosetting).And the employed plastic material of electric connector industry mostly is thermoplastics at present, its characteristic is generally graininess at normal temperatures, be heated to the state that becomes fusion after the uniform temperature, to then penetrate curing molding after its cooling, if heating then can be softened the state that becomes fusion again once more, and can carry out plasticizing forming once more.Therefore, thermoplastics can be via heating and melting curing molding repeatedly.
Yet, general comparatively microscler electric connector, for example be applied to duplicate rows memory modules (dual in-linememory module, dimm) electric connector, or use single straight cutting memory modules (single in-linememory module, simm) electric connector, carrying out surface mount technology (Surface MountTechnology, SMT) time, because the dimensions length of memory modules connector is longer, place it on the circuit board through after an air blast or the baking of an infrared ray reflow stove (IR-reflow), can make the memory modules connector present a softening phenomenon.
In other words, in surface mount technology, usually the hot gas (about 260 ℃) that disengaged of air blast or infrared ray firing equipment is the top that is positioned at the memory modules connector, and the temperature that causes the plastic body top of connector to be heated is higher, relative, the temperature that the plastic body below is heated is then lower.Because the suffered temperature in upper and lower half of plastic body has nothing in common with each other, can also want in the thermal expansion speed of the first half that Come's is fast than the thermal expansion speed of Lower Half so cause plastic body easily, and cause the central part of plastic body upwards to arch upward, and then form a structural distortion, warpage.
Thus, plastic body is inhomogeneous because of being heated, and is easy to generate the inconsistent phenomenon of degrees of expansion, and structurally produces distortion (being that the plastic body warpage becomes an inverted U), makes terminal that plastic body plugged leave the scolding tin on the circuit board.In other words, terminal that has originally aligned and the scolding tin on the circuit board because of the thermal expansion situation difference of each one of plastic body, and cause terminal to contact even to produce inconsistent phenomenon really with scolding tin, make and weld or eat problems such as tin deficiency and cause taking place sky by accurately solid welding terminal of scolding tin.And the fixing intensity touched of welding is also not enough, even has terminal to weld wrong circuit board connecting point position and cause serious problems such as short circuit.Therefore, the anti-system mode that is necessary to seek solves the problem that this kind thermal expansion differs.
The utility model content
In view of above problem, the utility model provides a kind of electric connector structure, inhomogeneous with the plastic body that improves electric connector because of being heated, and cause situations such as plastic body warpage, distortion to take place, and prevent that with this contact of connector terminals and circuit board from producing dislocation, and cause the empty weldering of terminal or eat the tin deficiency even serious problems such as terminal weldering misconnection point take place.
Disclose the electric connector structure of an embodiment according to the utility model, electrically be arranged on the circuit board, use for a memory modules electrically to plug thereon.Electric connector structure includes a body, and is provided with a slot on body, plants so that memory modules to be provided.On at least one side wall surface of body, offer at least one groove,, when body is welded on circuit board, makes that body can thermally equivalent, and on each position of body, form uniform thermal expansion with the thickness of this skiving body.
Above-mentioned electric connector structure, wherein, this groove is opened in this side wall surface and is adjacent on the position of this circuit board.
Above-mentioned electric connector structure, wherein, this groove is opened in this side wall surface and is away from the position of this circuit board.
Above-mentioned electric connector structure wherein, have a plurality of these grooves on this side wall surface of this body, and respectively this groove is spaced on this side wall surface.
Above-mentioned electric connector structure, wherein, this body has two these relative side wall surfaces, and this two side wall surface all is provided with this groove.
According to the electric connector structure of another embodiment that the utility model discloses, electrically be arranged on the circuit board, use for a memory modules electrically to plug thereon.Electric connector structure includes a body, and is provided with a slot on body, plants so that memory modules to be provided.At least one side wall surface in body is provided with at least one fin, increases the thickness of body with this, when body is welded on circuit board, makes that body can thermally equivalent, and form uniform thermal expansion on each position of body.
Above-mentioned electric connector structure, wherein, this fin is arranged on the position that this side wall surface is adjacent to this circuit board.
Above-mentioned electric connector structure, wherein, this fin is arranged on the position that this side wall surface is away from this circuit board.
Above-mentioned electric connector structure wherein, have a plurality of these fins on this side wall surface of this body, and respectively this fin is spaced on this side wall surface.
Above-mentioned electric connector structure, wherein, this body has two these relative side wall surfaces, and this two side wall surface all is provided with this fin.
Effect of the present utility model is, the body of electric connector can be in response to the position difference of welding heat source, and the side wall surface of corresponding body is provided with the groove or the structure of fin, with this skiving or the thickness of increase body, make that the thickness of upper and lower half of body is inequality, at electric connector in the technology that is welded on circuit board, its body is able to thermally equivalent and thermal expansion speed unanimity, cause warpage, distortion to avoid body to be heated irregular, and then prevent that the contact welding dislocation of terminal and circuit board or the phenomenon of disengaging contact from taking place.
Below in execution mode, be described in detail detailed features of the present utility model and advantage, its content is enough to make any those skilled in the art to understand technology contents of the present utility model and implements according to this, and according to the disclosed content of this specification, claim scope and accompanying drawing, any those skilled in the art can understand aforesaid purpose of the utility model and advantage easily, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the schematic appearance according to the electric connector structure of the utility model one embodiment;
Fig. 2 is the side cutaway view according to the electric connector structure of the utility model one embodiment;
Fig. 3 is the groove schematic diagram according to the body of another embodiment of the utility model;
Fig. 4 is according to the utility model groove schematic diagram of the body of an embodiment again;
Fig. 5 is the schematic appearance according to the electric connector structure of another embodiment of the utility model;
Fig. 6 is the side cutaway view according to the electric connector structure of another embodiment of the utility model;
Fig. 7 is according to the utility model schematic appearance of the electric connector structure of an embodiment again; And
Fig. 8 is according to the utility model side cutaway view of the electric connector structure of an embodiment again.
Wherein, Reference numeral
10 bodies
11,11 ' long side wall surface
12,12 ' short side wall surface
13 end faces
14 bottom surfaces
15 slots
16 terminal holes
20 terminals
31 grooves
32 fins
40 keepers
50 fastening assemblies
60 circuit boards
61 contacts
62 scolding tin
63 location holes
64 welding holes
D1, D1 ' first thickness
D2, D2 ' second thickness
Embodiment
Below in conjunction with accompanying drawing structural principle of the present utility model and operation principle are done concrete description:
According to electric connector structure that the utility model discloses, wherein the electric connector structure of indication can be a duplicate rows memory modules (dual in-line memory module, dimm) connector, or single straight cutting memory modules (single in-line memory module, connector simm).Yet, among the embodiment below the utility model, be example with the electric connector structure of duplicate rows memory modules, certain application product of the present utility model and scope are not exceeded with following embodiment.
Please consult Figure 1 and Figure 2 simultaneously.Wherein, Fig. 1 is the schematic appearance according to the electric connector structure of the utility model one embodiment.Fig. 2 is the side cutaway view according to the electric connector structure of the utility model one embodiment.
Include a body 10 and a plurality of terminal 20 according to the disclosed electric connector structure of the utility model.Wherein, it is tabular that body 10 constitutes a lengthwise by two relative long side wall surface 11,11 ' and two relative short side wall surfaces 12,12 ', the long side wall surface 11, the 11 ' definable that are parallel to body 10 go out an X direction, are parallel to short side wall surface 12,12 ' and then define a y direction.And upper and lower two sides in body 10 have an end face 13 and a bottom surface 14 respectively.
End face 13 places at body 10 offer a slot 15 along X direction, use for a memory modules (not illustrating) and peg graft on it.And be respectively equipped with a plurality of terminal holes 16 in relative two sides of slot 15 inside, make each terminal hole 16 mutual respectively be spaced setting.The bottom surface 14 of body 10 then is provided with at least one keeper 40, body 10 by keeper 40 predetermined fixed on circuit board 60.In addition relative two short side wall surfaces 12,12 ' in body 10 are pivoted with a fastening assembly 50 respectively, make fastening assembly 50 be pivoted on one memory modules is held in hook position in the slot 15, and one removes the off-position that the memory modules button is held.
A plurality of terminals 20 are contained in respectively in the corresponding terminal hole 16, and a wherein side of these terminals 20 partly extends in the slot 15, constitute with the current-carrying part of memory modules and electrically conduct.Opposite side as for terminal 20 then partly is exposed to outside the body 10, and is resisted against on the contact 61 of the correspondence on the circuit board 60.
Locate to be provided with respectively at least one groove 31 in body 10 2 relative long side wall surfaces 11,11 ' again.Make groove 31 be parallel to the trend of slot 15 (being X direction) and be opened on the long side wall surface 11,11 ', and have a difference in height respectively in the end face 13 and the bottom surface 14 of groove 31 and body 10.In addition, the geometry sizes of groove 31 is not limited to mode shown in Figure 1 with the concrete trend that distributes, also can be as shown in Figure 3, Figure 4, be spaced on long side wall surface 11,11 ' with a plurality of grooves 31, and the actual conditions during according to the mechanics principle of plastic composite and injection molding changes and different selections can be arranged.
Moreover above-mentioned a plurality of terminals 20 can be a SMD LED surface-mount device LED (Surface Mount Technology, SMT) terminal.When welding, earlier on a plurality of contacts 61 of circuit board 60, be coated with scolding tin 62, and the keeper 40 of being located at body 10 bottom surfaces is inserted on the circuit board 60 in the corresponding location hole 63 that is provided with, can be connected on the corresponding scolding tin 62 of contact 61 just and suitably align the location so that all are exposed to body 10 outer terminals 20.
Temporary transient winding body 10 together sent in the firing equipment with circuit board 60 toast, this firing equipment of stating can be air blast or the infrared ray reflow stove (IR-reflow) in the surface mount technology (SMT technology), but not as limit.Firing equipment disengages a hot gas above body 10, and disengages in the process of hot gas at this, can make low-melting scolding tin 62 fusions, with contact 61 gluings of terminal 20 and circuit board 60 together.
It should be noted that especially, body 10 toasts above body 10 for the hot gas that is produced in response to surface mount technology (SMT technology), so groove 31 offer the position, mainly the height (as shown in Figure 2) at two long side wall surfaces 11,11 ' about 1/3 is provided with, make the bottom surface 14 (being on the side wall surface of proximate circuitry plate 60) that the position is close to body 10 of offering of its groove 31, and, make the first thickness D1 of body 10 first halves greater than the second thickness D2 of Lower Half with the thickness of this skiving body 10.In body 10 bake process, because the hot gas of baking is above body 10, so that the upper and lower half of body 10 inequality of being heated easily, and cause thermal expansion speed inequality.So, can be by the structural design of groove 31, formed in the Lower Half of body 10 than thin structure, make temperature can be fast vertically be delivered to Lower Half by the first half of body 10, so that reaching, body 10 is heated evenly and the state of thermal expansion speed unanimity.
Thus, body 10 uniform expanded by heating can be avoided body 10 buckling deformations, and the evenness between a plurality of terminals 20 of stable control and the contact 61, take place with the situation that contact 61 produces dislocation to reduce terminal 20, terminal 20 can accurately firmly electrically be engaged with contact 61 mutually.
In addition, below the utility model among each embodiment, groove 31 is opened on the relative long side wall surface of body 10 2 11,11 ' simultaneously, with explanation as most preferred embodiment, but not as limit, also groove 31 can be opened on one of them long side wall surface of body 10, only need make the segment thickness of body 10 be whittled into thin getting final product, so that body 10 thermally equivalents and thermal expansion speed unanimity.
In addition, as Fig. 5 and shown in Figure 6, be schematic appearance and side cutaway view according to the electric connector structure of another embodiment of the utility model.Its embodiment and aforesaid embodiment are roughly the same, below only are illustrated with regard to different locating.In the present embodiment, can be the terminal (DIP) of a stitch shape, and corresponding welding hole 64 is set, and (plated through hole PTH), makes a plurality of terminals 20 be located in the corresponding welding hole 64 on circuit board 60 with multiterminal 20.
Temporary transient winding body 10 together sent in the firing equipment with circuit board 60 toast, this firing equipment of stating can be wave soldering technology (wave solder process), mainly circuit board 60 is carried out a The pre-heat treatment, make thermal current pass through welding hole 64, each welding hole 64 all can be reached is enough to make the temperature of scolding tin filling.Then, with the scolding tin of fusion under the driving of motor-mount pump, the flow-disturbing ripple (turbulentwave) of upwards kicking up, and compressing from bottom to top makes scolding tin enter in the welding hole 64 from circuit board 60 bottom surfaces, make cemented terminal of scolding tin 20 and welding hole 64, and body 10 is welded on the circuit board 60.
It should be noted that especially, body 10 for the heat that produced in response to wave soldering technology below body 10, so groove 31 offer the position, mainly the height (as shown in Figure 6) at two long side wall surfaces 11,11 ' about 2/3 is provided with, make the end face 13 (promptly on the side wall surface away from circuit board 60) that the position is close to body 10 of offering of its groove 31, and, make the first thickness D1 ' of body 10 first halves less than the second thickness D2 ' of Lower Half with the thickness of these skiving body 10 first halves.
Body 10 through the wave soldering technologies in because the hot gas of wave soldering is below body 10, so that the upper and lower half of body 10 inequality of being heated easily, and cause thermal expansion speed inequality.So, can be by the structural design of groove 31, form one than thin structure at the first half of body 10, make heat energy can be fast vertically be delivered to the first half by the Lower Half of body 10, so that reaching, body 10 is heated evenly and the state of thermal expansion speed unanimity.
Thus, body 10 uniform expanded by heating can be avoided body 10 buckling deformations, and prevent to leave welding hole 64 because of body 10 warpages cause terminal 20, cause empty weldering or weld untrue situation and take place, make terminal 20 accurately firmly electrically to engage mutually with welding hole 64.
In addition, as shown in Figures 7 and 8, for according to the utility model schematic appearance and the side cutaway view of the electric connector structure of an embodiment again.Its embodiment and aforesaid embodiment are roughly the same, below only are illustrated with regard to different locating.
Mainly locate to be provided with respectively at least one fin 32 in relative two long side wall surfaces 11,11 ' of body 10, the trend (being X direction) that fin 32 is parallel to slot 15 is protruded on long side wall surface 11,11 ', makes to have a difference in height respectively between the end face 13 of fin 32 and body 10 and the bottom surface 14.In addition, the geometry sizes of fin 32 is not limited to mode shown in Figure 7 with the concrete trend that distributes, its fin 32 position and distributed quantity be set, what also can be same as Fig. 3 or groove 31 shown in Figure 4 offers position and distributed quantity, be spaced on long side wall surface 11,11 ' with a plurality of fins 32, and the actual conditions during according to the mechanics principle of plastic composite and injection molding changes and different selections can be arranged.
In the present embodiment, a plurality of terminals 20 can be a SMD LED surface-mount device LED (Surface Mount Technology, SMT) terminal (DIP) of a terminal or a stitch shape, if during the SMD LED surface-mount device LED terminal, the salient position of fin 32, mainly the height (as shown in Figure 8) at two long side wall surfaces 11,11 ' about 2/3 is provided with, make the salient position of its fin 32 be close to the end face 13 (promptly on the side wall surface away from circuit board 60) of body 10, and, make the first thickness D1 of body 10 first halves greater than the second thickness D2 of Lower Half with this thickness that increases body 10 first halves.Thus, can be by the structural design of fin 32, formed at the first half of body 10 than thick structure, make temperature vertically be delivered to Lower Half by the first half of body 10, so that reaching respectively, body 10 upper and lower half are heated evenly and the state of thermal expansion speed unanimity.And then avoid body 10 buckling deformations, and strengthen the structural strength of body 10.
If a plurality of terminals 20 can be the terminal (DIP) of a stitch shape, then the salient position of fin 32 is at the height of two long side wall surfaces 11,11 ' about 1/3, increase the thickness of body 10 Lower Halves with this, in like manner by body 10 Lower Half thickness greater than first half thickness, make body 10 to reach to be heated evenly and the state of thermal expansion speed unanimity.
In addition, above-mentioned fin 32 is arranged among the embodiment of body 10, its fin 32 is arranged on the relative long side wall surface of body 10 2 11,11 ' simultaneously, with explanation as most preferred embodiment, but not as limit, it also can be arranged on fin 32 on one of them long side wall surface of body 10, only need make thicker the getting final product of segment thickness increase of body 10, so that each position of body 10 has identical thermal expansion speed.
Effect according to the disclosed electric connector structure of the utility model is, body can be in response to the heat source position difference in when welding, and select with the groove or the setting of fin, make that the thickness of upper and lower half of body is neither identical, so that the thermal expansion speed unanimity of body thermally equivalent and upper and lower half, avoiding causing buckling deformation because of the body heating temperature is inhomogeneous, and then the phenomenon that prevents the contact welding dislocation of intrinsic a plurality of terminal and circuit board or break away from contact takes place.With this easier body be heated front terminal and connecting point position kept.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.

Claims (10)

1. electric connector structure, electrically be arranged on the circuit board, use for a memory modules and electrically plug thereon, it is characterized in that, this electric connector structure includes a body, this body has a slot, plugs for this memory modules, and has at least one groove at least one side wall surface of this body.
2. electric connector structure according to claim 1 is characterized in that this groove is opened in this side wall surface and is adjacent on the position of this circuit board.
3. electric connector structure according to claim 1 is characterized in that this groove is opened in this side wall surface and is away from the position of this circuit board.
4. electric connector structure according to claim 1 is characterized in that, have a plurality of these grooves on this side wall surface of this body, and respectively this groove is spaced on this side wall surface.
5. electric connector structure according to claim 1 is characterized in that, this body has two these relative side wall surfaces, and this two side wall surface all is provided with this groove.
6. electric connector structure, electrically be arranged on the circuit board, use for a memory modules and electrically plug thereon, it is characterized in that, this electric connector structure includes a body, this body has a slot, plugs for this memory modules, and has at least one fin at least one side wall surface of this body.
7. electric connector structure according to claim 8 is characterized in that, this fin is arranged on the position that this side wall surface is adjacent to this circuit board.
8. electric connector structure according to claim 8 is characterized in that, this fin is arranged on the position that this side wall surface is away from this circuit board.
9. electric connector structure according to claim 8 is characterized in that, have a plurality of these fins on this side wall surface of this body, and respectively this fin is spaced on this side wall surface.
10. electric connector structure according to claim 8 is characterized in that, this body has two these relative side wall surfaces, and this two side wall surface all is provided with this fin.
CN200920161948XU 2009-07-09 2009-07-09 Electrical connector structure Expired - Fee Related CN201478514U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200920161948XU CN201478514U (en) 2009-07-09 2009-07-09 Electrical connector structure

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Application Number Priority Date Filing Date Title
CN200920161948XU CN201478514U (en) 2009-07-09 2009-07-09 Electrical connector structure

Publications (1)

Publication Number Publication Date
CN201478514U true CN201478514U (en) 2010-05-19

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Application Number Title Priority Date Filing Date
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CN (1) CN201478514U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544796A (en) * 2010-12-28 2012-07-04 凡甲电子(苏州)有限公司 Card edge connector and assembly thereof
CN107305298A (en) * 2016-04-21 2017-10-31 松下知识产权经营株式会社 Component mounting apparatus and component crimping method
CN109244734A (en) * 2017-07-11 2019-01-18 庆良电子股份有限公司 High speed connector

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544796A (en) * 2010-12-28 2012-07-04 凡甲电子(苏州)有限公司 Card edge connector and assembly thereof
CN102544796B (en) * 2010-12-28 2014-06-18 凡甲电子(苏州)有限公司 Card edge connector and assembly thereof
CN107305298A (en) * 2016-04-21 2017-10-31 松下知识产权经营株式会社 Component mounting apparatus and component crimping method
CN107305298B (en) * 2016-04-21 2021-06-15 松下知识产权经营株式会社 Component pressure welding device and component pressure welding method
CN109244734A (en) * 2017-07-11 2019-01-18 庆良电子股份有限公司 High speed connector

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100519

Termination date: 20180709

CF01 Termination of patent right due to non-payment of annual fee