CN201478472U - Lead frame with auxiliary sewing structure, electronic component with lead frame and device with electronic component - Google Patents

Lead frame with auxiliary sewing structure, electronic component with lead frame and device with electronic component Download PDF

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Publication number
CN201478472U
CN201478472U CN2009201563643U CN200920156364U CN201478472U CN 201478472 U CN201478472 U CN 201478472U CN 2009201563643 U CN2009201563643 U CN 2009201563643U CN 200920156364 U CN200920156364 U CN 200920156364U CN 201478472 U CN201478472 U CN 201478472U
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China
Prior art keywords
lead frame
electronic component
sewing
wire
pins
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Expired - Fee Related
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CN2009201563643U
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Chinese (zh)
Inventor
许富标
郭俊荣
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Individual
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Individual
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Priority to CN2009201563643U priority Critical patent/CN201478472U/en
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Abstract

Disclosed are a lead frame with an auxiliary sewing structure, an electronic component with a lead frame and a device with an electronic component. The device of the utility model comprises a flexible base plate, an electrical component with an auxiliary sewing structure lead frame and a plurality of conductive sutures, especially, the conductive sutures are sewn by penetrating through the flexible base plate, penetrate through the auxiliary sewing structure for fixing the electronic component on the flexible base plate, and the conductive sutures are electrically contacted with the auxiliary sewing structure of the electronic component.

Description

Have the lead frame of assisting sewing structure, the device that has the electronic component of this lead frame and have this electronic component
[technical field]
The utility model is to have the lead frame (lead frame) of assistance sewing structure (stitching-assistingstructure), a kind of electronic component (electronic device) and an a kind of device with this electronic component with this lead frame about a kind of.
[background technology]
Contain the application that the conductor in electronic circuit and the textile and electronic component are coupled together gradually at the application of electronic circuit, allow textile, for example general exercisable weaving cotton cloth and clothes can combine electronic circuit and the textile at various functions.One comprises the Wearable electronic circuit in the above-mentioned application, this electronic circuit is to be fixed to or to be embedded in the dress ornament, these electronic circuits can be connected with knitting advance fabric or the conductor wire that is embedded in the clothes, allow these electronic circuits and other elements (for example, switch or other I/O elements) on textile, play a role whereby.
Be these electronic components and knitted advance fabric or be embedded in the connected mode of the conductor wire in the clothes for one of practical obstacle of such Wearable electronic circuit.Though conductor wire has been set up competent wearable line, these conductor wires are connected to element quite are difficult to efficient and cost-effective method and reach strong and be worn and wash to being enough to bear.The obvious too complex of scheme and the cost of scolding tin and/or printed circuit board (PCB) are too high on the use conditional electronic engineering, and can't integrate with traditional textile processing.
United States Patent (USP) notification number the 7th, 025, No. 596 patent exposure are a kind of at electronic circuit (electroniccircuit) (for example, the naked crystalline substance of semiconductor (semiconductor die)) with between the conductor wire form method and the device that is electrically connected in low scolding tin mode, wherein conductor wire is made into textile material alternately.According to this Prior Art, this electronic circuit is to be fixed on the carrier (carrier), and be electrically connected (for example, by routing engage, with the scolding tin welding) conductor rail (conductive trace) to this carrier.This carrier is can be sewed to penetrate.The conduction suture sew on each conductor rail of this carrier and then this conductor rail of electric contact (electrically contact) alternately, conduction suture and from this conductor rail sew conductor wire and then this corresponding conductor wire of electric contact of to this textile material correspondence.This carrier is further, and for example, the mode with sewing is fixed on this textile material.
Yet, Prior Art need adopt the carrier that can be penetrated, and this carrier must be finished traditional design of electronic circuits and making basically earlier, so significantly limited the mode of utilization electronic component (electronicdevice), especially only limits the electronic component that makes apparatus tradition pin (pin).In addition, being connected and conducting electricity electric contact the between suture and the conductor rail between this carrier of Prior Art and this textile material, whether strongly dressed and washed frequent for a long time to being enough to bear, still make us causing anxiety.And, comprise the combination of electronic circuit and carrier and the linker of textile material and still dislike complicated.
[utility model content]
Therefore, a category of the present utility model is to provide a kind of lead frame with pin, and especially, the pin of this lead frame has assistance sewing structure (stitching-assistingstructure).
In addition, another category of the present utility model is to provide electronic component and a kind of device with this electronic component that has according to lead frame of the present utility model.According to device of the present utility model and comprise electronic component and many conduction sutures that a flexible base plate (flexible substrate), has the lead frame of assisting sewing structure.Especially, these conduction sutures are that sewing penetrates this flexible base plate, and pass these and assist sewing structure, and then this electronic component is fixed on this flexible base plate, these conduction sutures are to carry out electric the contact with these assistance sewing structures of this electronic component.Whereby, the fixing electronic component of sewing is strongly dressed and is washed frequent to being enough to bear for a long time, the more important thing is, can process through the Textile Engineering mode according to electronic component of the present utility model.
According to the lead frame of first preferred embodiment of the present utility model, it comprises a substrate (base) and at least two pins.These pins extend from this bases.Especially, each the root pin in these pins has at least one assistance sewing structure, for example, and through hole (through hole) or breach (breach).
According to the electronic component of second preferred embodiment of the present utility model, it comprises a circuit element (circuit component) and a lead frame.This circuit element be with this leaded package together.This lead frame comprises a substrate and at least two pins.These pins extend from this bases.Especially, each the root pin in these pins has at least one assistance sewing structure, for example, and through hole or breach.
According to the device of the 3rd preferred embodiment of the present utility model, it comprises electronic component, and it comprises electronic component and many conduction sutures that a flexible base plate, has the lead frame of assisting sewing structure.This flexible base plate is can be sewed to penetrate.This electronic component comprises a circuit element and a lead frame.This circuit element be with this leaded package together.This lead frame comprises a substrate and at least two pins.These pins extend from this bases.Especially, each the root pin in these pins has at least one assistance sewing structure, for example, and through hole or breach.These conduction sutures are that sewing penetrates this flexible base plate, and pass these and assist sewing structure, and then this electronic component is fixed on this flexible base plate, and these conduction sutures are to carry out electric the contact with these assistance sewing structures of this electronic component.
The utility model provides a kind of lead frame (lead frame), comprises:
One substrate (base); And
At least two pins (pin), these pins extend from this bases, and each the root pin in these pins has at least one assistance sewing structure (stitching-assisting structure).
Described lead frame is characterized in that: these assistance sewing structures of assisting in the sewing structure are a through hole (through hole) or a breach (breach).
The utility model also provides a kind of electronic component (electronic device), comprises:
One circuit element (circuit component); And
One lead frame (lead frame), this circuit element and this leaded package together, this lead frame comprises:
One substrate (base); And
At least two pins (pin), these pins extend from this bases, and each the root pin in these pins has at least one assistance sewing structure (stitching-assisting structure).
Described electronic component is characterized in that: these assistance sewing structures of assisting in the sewing structure are a through hole (through hole) or a breach (breach).
The utility model also provides a kind of device, comprises:
One flexible base plate (flexible substrate), this flexible base plate can be sewed and penetrate;
One electronic component (electronic device) comprises:
One circuit element (circuit component); And
One lead frame (lead frame), this circuit element and this leaded package together, this lead frame comprises:
One substrate (base); And
At least two pins (pin), these pins extend from this bases, and each the root pin in these pins has at least one assistance sewing structure (stitching-assisting structure); And
Many conduction sutures (conductive thread), these conduction suture sewing penetrate this flexible base plate and pass and knit alternately at these and assist between the sewing structure, and then this electronic component is fixed on this flexible base plate, wherein these conduction sutures carry out electric the contact with these assistance sewing structures.
Described device is characterized in that: these assistance sewing structures of assisting in the sewing structure are a through hole (through hole) or a breach (breach).
Described device is characterized in that: these conduction sutures are sewn on this flexible base plate and are electrically connected circuit to form one.
Described device is characterized in that: this flexible base plate is a weaving body or a polymer body.
Described device, it is characterized in that: these conduction sutures comprise and are selected from by one first metal wire, first covering yarn (coupling yarn), one second covering yarn, one first closes twist yarn (twistedyarn), the one in the group that twist yarn forms is closed in one doubling (doubled yarn) and one second, this first metal wire is made up of at least one wire, this first covering yarn is to coat the long fibre of at least one conductive cores by at least one wire, many conduction short fibers, long fibre of at least one non-conductive core or many non-conductive short fibers constitute, this second covering yarn is to coat the long fibre of at least one conductive cores by at least one through the rolling wire, many conduction short fibers, long fibre of at least one non-conductive core or many non-conductive short fibers constitute, first to close twist yarn be to be closed by at least one wire and at least one non-conductive yarn or a wire to twist with the fingers institute and constitute for this, this doubling is not had side by side to close by at least one wire and at least one wire or a non-conductive yarn to twist with the fingers institute and constitute, and second to close twist yarn be by this first metal wire for this, this first covering yarn, this second covering yarn, combination constituted in the middle of this doubling and this first closed twist yarn.
Described device is characterized in that: this wire and should be made by the one that is selected from the group that is made up of copper, corronil, corson alloy, pack fong, adonic, chromiumcopper, Kufil gold, silver, gold, lead, zinc, aluminium, nickel, brass, phosphor bronze, beallon, nichrome, tungsten, platinum, palladium, copper-tungsten and stainless steel through the rolling wire.
In sum, the utility model is strongly dressed for a long time and is washed frequently to being enough to bear in conjunction with the fixing electronic component of its sewing of the device of electronic component, and the kinds of electronic components that can use is extensive.The utility model can carry out with the weaving processing procedure easily, does not have the pollution of soldering welding processing procedure.In addition, lead frame of the present utility model is easy to manufacture, and the conduction suture can be sewn on the flexible base plate easily, is electrically connected to form one that circuit offers another electronic circuit electricity or a power supply connects.
Can describe in detail and appended graphic being further understood by following creation about advantage of the present utility model and spirit.
[description of drawings]
Figure 1A is the lead frame 10 that illustrates according to first preferred embodiment of the present utility model, and the pin 104 of this lead frame 10 has into the assistance sewing structure of through hole 106a.
Figure 1B is the distortion that illustrates according to the lead frame 10 of first preferred embodiment of the present utility model, and the pin 104 of this lead frame 10 has the assistance sewing structure that becomes to lack 106b.
Fig. 2 A is the electronic component 20 that illustrates according to second preferred embodiment of the present utility model, and this electronic component 20 is to adopt the lead frame 10 among Figure 1A to do encapsulation.
Fig. 2 B is the distortion that illustrates according to the electronic component 20 of second preferred embodiment of the present utility model, and this electronic component 20 is to adopt the lead frame 10 among Figure 1B to do encapsulation.
Fig. 2 C is the distortion that illustrates according to the electronic component 20 of second preferred embodiment of the present utility model, and this electronic component 20 has virtual pin 104 '.
Fig. 3 is the device 30 that illustrates according to the 3rd preferred embodiment of the present utility model, and this device 30 comprises the electronic component 20 among Fig. 2 A.
10: lead frame 102: substrate
104: pin 104 ': virtual pin
106a: assist sewing structure (through hole) 106b: assist sewing structure (breach)
20: electronic component 202: circuit element
204: metal wire 30: device
302: flexible base plate 304: the conduction suture
[embodiment]
Below in detail preferred embodiment of the present utility model and practical application example will be described in detail, so as to proving absolutely feature of the present utility model, spirit and advantage.
See also Figure 1A and Figure 1B, these graphic exposure are according to the lead frame 10 of first preferred embodiment of the present utility model.
Shown in Figure 1A and Figure 1B, according to the lead frame 10 of first preferred embodiment of the present utility model, it comprises a substrate 102 and at least two pins 104.Figure 1A and Figure 1B are the lead frames that illustrates for single semiconductor light-emitting elements (semiconductor light-emitting device) encapsulation usefulness, therefore only draw two pins 104, as illustrative examples.
Be shown in Figure 1A and Figure 1B equally, these pins 104 extend from these substrate 102 places.Especially, each the root pin 104 in these pins 104 has at least one assistance sewing structure (106a, 106b), for example, and four through hole 106a that Figure 1A illustrates, or six breach 106b illustrating of Figure 1B.What need emphasize is that the utility model discloses the assistance sewing structure that is formed on the pin and do not exceed with through hole and breach.
In order to conduct electricity and strong purpose, it is made that this substrate 102 and these pins 104 mostly are metal.In addition, for the different electrodes of isolating this lead frame 10 and fix this substrate 102 and these pins 104, as lead frame, be with the common base that forms of a macromolecular material moulding, shown in Figure 1A and Figure 1B between this substrate 102 and these pins 104.Obvious ground, easy to manufacture according to lead frame of the present utility model.
See also Fig. 2 A, Fig. 2 B and Fig. 2 C, these graphic exposure are according to the electronic component 20 of second preferred embodiment of the present utility model.
Shown in Fig. 2 A and Fig. 2 B, electronic component 20 according to second preferred embodiment of the present utility model, it comprises a lead frame 10 and a circuit element 202, for example, semiconductor light-emitting elements, integrated circuit, photodetector, solar cell, power supply unit, micro electronmechanical function element, switch, memory body, processor, passive device etc.This circuit element 202 is to be packaged together with this lead frame 10.
Similar to Figure 1A and Figure 1B, the lead frame 10 that is illustrated in Fig. 2 A and Fig. 2 B is for the lead frame of single semiconductor light-emitting elements encapsulation usefulness, therefore only draws two pins 104, as illustrative examples.Similarly, the circuit element 202 that figure is illustrated in 2A and Fig. 2 B is semiconductor light-emitting elements, as illustrative examples.
This circuit element 202 is to be packaged together with this lead frame 10.The embodiment that is disclosed as Fig. 2 A and Fig. 2 B, this circuit element (semiconductor light-emitting elements) the 202nd is fixed in this substrate 102, and the electrode on it is the electrode that is electrically connected to correspondence on this lead frame 10 with metal wire 204 by the mode of routing (wiring) respectively.Be shown in the case that Fig. 2 A and Fig. 2 B are disclosed equally, be with the common base that forms of a macromolecular material moulding between this substrate 102 and these pins 104, and the depression that material transparent (for example, epoxy resin, glass) is filled up base seals and provides optical design with this circuit element (semiconductor light-emitting elements) 202.
Be shown in Fig. 2 A and Fig. 2 B equally, these pins 104 extend from these substrate 104 places.Especially, each the root pin 104 in these pins 104 has at least one assistance sewing structure (106a, 106b), for example, and four through hole 106a that Fig. 2 A illustrates, or six breach 106b illustrating of Fig. 2 B.What need emphasize is that the utility model discloses the assistance sewing structure that is formed on the pin and do not exceed with through hole and breach.
Obvious ground, this electronic component 20 can be sewed securely by the sewing machine or in artificial hand seam mode with the conduction suture and is fixed on the flexible base plate, and by the conduction suture directly with this flexible base plate on conductive region electricly contact or provide another electronic circuit or power supply electrical connection.And the fixing electronic component 20 of sewing is strongly dressed for a long time and is washed frequently to being enough to bear.In addition, can be widely used in existing kinds of electronic components according to electronic component of the present utility model with pin.
Further, for being sewed more securely, this electronic component 20 is fixed on the flexible base plate, and then this electronic component 20 more can be born dressed for a long time and wash frequent, shown in Fig. 2 C, the electronic component 20 that is shown among Fig. 2 C is identical haply with electronic component 20 in being shown in Fig. 2 A, the electronic component 20 among Fig. 2 C further have at least one not tool be electrically connected the virtual pin (dummy pin) 104 ' of function.Especially, the virtual pin 104 ' of each root has at least one assistance sewing structure 106a, for example, and four through hole 106a that Fig. 2 C illustrates.In Fig. 2 C, have structure, element with Fig. 2 A duplicate numbers mark, corresponding structure among its same execution graph 2A, the function that element had.Seldom do at this and to give unnecessary details.
By assisting sewing structure 106a, the pin 104 of the electronic component 20 among Fig. 2 C can be sewed securely with the conduction suture to be fixed on the flexible base plate and electrical connection is provided.And especially, the virtual pin 104 ' of the electronic component 20 among Fig. 2 C can be sewed securely with conduction suture or non-conductive general suture and is fixed on this flexible base plate.
See also Fig. 3, Fig. 3 discloses the device 30 according to the 3rd preferred embodiment of the present utility model.
As shown in Figure 3, device 30 according to the 3rd preferred embodiment of the present utility model, it comprises a flexible base plate 302, many conductions suture 304 and electronic components 20, for example, light-emitting diode, laser diode, photodetector, integrated circuit elements, solar cell, power supply unit, switch, memory body, micro electronmechanical function element, processor, passive device, etc.
Similar to Fig. 2 A, the electronic component 20 that is illustrated in Fig. 3 is the light-emitting diodes with two pins 104, as illustrative examples.
Be shown in Fig. 3 equally, this flexible base plate 30 is can be sewed to penetrate.This electronic component 20 comprises a lead frame 10 and a circuit element 202 (for example, semiconductor light-emitting elements), and this circuit element 202 is to be packaged together with this lead frame 10.As the embodiment that Fig. 3 disclosed, this circuit element (semiconductor light-emitting elements) the 202nd is fixed in this substrate 102, and the electrode on it is the electrode that is electrically connected to correspondence on this lead frame 10 with metal wire 204 by the mode of routing respectively.The embodiment that is shown in Fig. 3 equally and is disclosed, be with the common base that forms of a macromolecular material moulding between this substrate 102 and these pins 104, and the depression that material transparent (for example, epoxy resin, glass) is filled up base seals and provides optical design with this circuit element (semiconductor light-emitting elements) 202.
Be shown in Fig. 3 equally, these pins 104 extend from these substrate 104 places.Especially, each the root pin 104 in these pins 104 has at least one assistance sewing structure (106a), for example, and four through hole 106a that Fig. 3 illustrates, or six breach 106b illustrating of Fig. 2 B.What need emphasize is that the utility model discloses the assistance sewing structure that is formed on the pin and do not exceed with through hole and breach.These conduction sutures 304 are to sew by the sewing machine or in artificial hand seam mode to penetrate this flexible base plate 302, and pass these and assist sewing structure 106a, and then this electronic component 20 is firmly fixed on this flexible base plate 302.Especially, these conduction sutures 304 are to assist sewing structure (106a, 106b) to carry out electric the contact with these, and these conduction sutures 304 provide this electronic component 20 to be electrically connected with these flexible base plate 302 another electronic circuits.Obvious ground, this electronic component 20 are strongly dressed for a long time and are washed frequently to being enough to bear by these conduction sutures 304 sewing is fixing.Obvious ground, this electronic component 20 can be fixed on the flexible base plate by sewing securely with the conduction suture and by the conduction suture directly with this flexible base plate 302 on electric contact of conductive region, or be electrically connected with another electronic circuit or a power supply, and the fixing electronic component 20 of sewing is strongly dressed for a long time and is washed frequently to being enough to bear.
In practical application, these conduction sutures 304 and being sewn on this flexible base plate 302 are electrically connected to form one that circuit offers another electronic circuit electricity or a power supply connects.
In a specific embodiment, this flexible base plate 302 is a weaving body or polymer bodies.
In a specific embodiment, the metal wire that can form by at least one wire as these conduction sutures 304.These conduction sutures 304 can be to coat long fine or the covering yarn (coupling yarn) that many non-conductive short fibers constituted of at least one conductive cores long fine (core filament), many conduction short fibers (short fiber), at least one non-conductive core by at least one wire.These conduction sutures 304 also can be to coat long fine or another covering yarn that many non-conductive short fibers constituted of long fine, the many conduction short fibers of at least one conductive cores, at least one non-conductive core by at least one through the rolling wire.These conduction sutures 304 also can be to close twist yarn (twisted yarn) by what at least one wire and at least one non-conductive yarn or a wire closed that sth. made by twisting constitutes.These conduction sutures 304 also can be not have the doubling (doubledyarn) that any twisting constitutes side by side by at least one wire and at least one wire, at least one non-conductive yarn.These conduction sutures 304 also can be by above-mentioned metal wire, covering yarn, doubling and close twist yarn and make up the twist yarn that closes that is constituted.The composition of above-mentioned conduction suture 304 also can bear according to tension force, functional requirements such as flexility bears, fire line, conductivity combine with the material that meets this functional requirement respectively.
In a specific embodiment, above-mentioned be used for making this wire and should be through rolling material wiry can be copper (copper), corronil (CuNi alloy), corson alloy (CuNiSi alloy), pack fong (CuNiZn alloy), adonic (CuNiSn alloy), chromiumcopper (CuCralloy), Kufil (CuAg alloy), silver (silver), gold (gold), plumbous (lead), zinc (zinc), aluminium (aluminum), nickel (nickel) brass (brass), phosphor bronze (phosphorbronze), beallon (beryllium copper), nichrome (nichrome), tungsten (tungsten), platinum (platinum), palladium (palladium), copper-tungsten (CuW alloy), stainless steel (stainless steel) or other commercial conducting metal or alloy.
In sum, Prior Art on compared to the connection electronic component to flexible base plates such as the bodies of weaving, strongly dressed for a long time and wash frequently in conjunction with the fixing electronic component of its sewing of the device of electronic component according to the utility model, and the kinds of electronic components that can use is extensive to being enough to bear.According to the utility model, being connected between electronic component and the flexible base plate is to reach with the sewing of conduction suture, obvious ground, and the utility model can carry out with the weaving processing procedure easily, does not have the pollution of soldering welding processing procedure.In addition, according to the utility model, lead frame is easy to manufacture, and the conduction suture can be sewn on the flexible base plate easily, is electrically connected to form one that circuit offers another electronic circuit electricity or a power supply connects.Obvious ground the utlity model has advantage and effect that Prior Art can't be reached.
By the above detailed description of preferred embodiments, be to wish to know more to describe feature of the present utility model and spirit, and be not to come category of the present utility model is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the desire application of the utility model institute of various changes and tool equality.Therefore, the category of the claim that the utility model is applied for should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.

Claims (10)

1. lead frame is characterized in that: comprise:
One substrate; And
At least two pins, these pins extend from this bases, and each the root pin in these pins has at least one assistance sewing structure.
2. lead frame as claimed in claim 1 is characterized in that: these assistance sewing structures of assisting in the sewing structure are a through hole or a breach.
3. electronic component is characterized in that: comprise:
One circuit element; And
One lead frame, this circuit element and this leaded package together, this lead frame comprises:
One substrate; And
At least two pins, these pins extend from this bases, and each the root pin in these pins has at least one assistance sewing structure.
4. electronic component as claimed in claim 3 is characterized in that: these assistance sewing structures of assisting in the sewing structure are a through hole or a breach.
5. device is characterized in that: comprise:
One flexible base plate, this flexible base plate can be sewed and penetrate;
One electronic component comprises:
One circuit element; And
One lead frame, this circuit element and this leaded package together, this lead frame comprises:
One substrate; And
At least two pins, these pins extend from this bases, and each the root pin in these pins has at least one assistance sewing structure; And
Many conduction sutures, these conduction suture sewing penetrate this flexible base plate and pass and knit alternately at these and assist between the sewing structure, and then this electronic component is fixed on this flexible base plate, wherein these conduction sutures carry out electric the contact with these assistance sewing structures.
6. device as claimed in claim 5 is characterized in that: these assistance sewing structures of assisting in the sewing structure are a through hole or a breach.
7. device as claimed in claim 5 is characterized in that: these conduction sutures are sewn on this flexible base plate and are electrically connected circuit to form one.
8. device as claimed in claim 5 is characterized in that: this flexible base plate is a weaving body or a polymer body.
9. device as claimed in claim 5, it is characterized in that: these conduction sutures comprise and are selected from by one first metal wire, first covering yarn, one second covering yarn, one first closes twist yarn, the one in the group that twist yarn forms is closed in one doubling and one second, this first metal wire is made up of at least one wire, this first covering yarn is to coat the long fibre of at least one conductive cores by at least one wire, many conduction short fibers, long fibre of at least one non-conductive core or many non-conductive short fibers constitute, this second covering yarn is to coat the long fibre of at least one conductive cores by at least one through the rolling wire, many conduction short fibers, long fibre of at least one non-conductive core or many non-conductive short fibers constitute, first to close twist yarn be to be closed by at least one wire and at least one non-conductive yarn or a wire to twist with the fingers institute and constitute for this, this doubling is not had side by side to close by at least one wire and at least one wire or a non-conductive yarn to twist with the fingers institute and constitute, and second to close twist yarn be by this first metal wire for this, this first covering yarn, this second covering yarn, combination constituted in the middle of this doubling and this first closed twist yarn.
10. device as claimed in claim 9 is characterized in that: this wire and should be made by the one that is selected from the group that is made up of copper, corronil, corson alloy, pack fong, adonic, chromiumcopper, Kufil gold, silver, gold, lead, zinc, aluminium, nickel, brass, phosphor bronze, beallon, nichrome, tungsten, platinum, palladium, copper-tungsten and stainless steel through the rolling wire.
CN2009201563643U 2009-06-17 2009-06-17 Lead frame with auxiliary sewing structure, electronic component with lead frame and device with electronic component Expired - Fee Related CN201478472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201563643U CN201478472U (en) 2009-06-17 2009-06-17 Lead frame with auxiliary sewing structure, electronic component with lead frame and device with electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201563643U CN201478472U (en) 2009-06-17 2009-06-17 Lead frame with auxiliary sewing structure, electronic component with lead frame and device with electronic component

Publications (1)

Publication Number Publication Date
CN201478472U true CN201478472U (en) 2010-05-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110890659A (en) * 2018-08-21 2020-03-17 Smk株式会社 Connector and connector assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110890659A (en) * 2018-08-21 2020-03-17 Smk株式会社 Connector and connector assembly
CN110890659B (en) * 2018-08-21 2021-12-10 Smk株式会社 Connector and connector assembly

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100519

Termination date: 20150617

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