CN201473612U

CN201473612U - Manganese electrolytic deposition cathode board structure recycling conductive folder

Info

Publication number: CN201473612U
Application number: CN2009201517132U
Authority: CN
Inventors: 施军锐
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-04-21
Filing date: 2009-04-21
Publication date: 2010-05-19
Anticipated expiration: 2019-04-21

Abstract

The utility model discloses a manganese electrolytic deposition cathode board structure recycling a conductive folder, comprising a part with a copper conductive folder cut off from the upper side of a main board of an old cathode plate and a new main board, wherein the new main board is reserved with an L-shaped gap avoiding the copper conductive folder, and the old main board part with the copper conductive folder is also connected with the new main board by a bolt. The lower edge of the old main board is in welded connection with the new main board in the lap position, and the edge of the gap is in welded connection with the new main board in the lap position to form an L-shaped lap weld. The utility model possibly uses the original copper conductive folder. The structure has the advantages of simple and reliable process and short construction period, ensures good conductivity, can completely replace the old board after renovation and reform, and reduces the cost for replacing electrolytic cathode boards of enterprises.

Description

The manganese electrolytic deposition negative plate structure of recycle conductive clip

Technical field

The utility model relates to a kind of structure of electrolytic negative plate, especially for the structure of the renovation electrolytic negative plate of a kind of recycle conductive clip of electrolytic manganese production industry.

Background technology

Electrolytic metal Mn is the hydrometallurgy product of manganese, at home in the production practice for many years, the production technique that general the employing " leached---purification---electrolysis ", in electrolytic process, to use a large amount of electrolytic negative plates, general electrolytic negative plate all adopts stainless materials such as SUS304,1Cr18Ni9Ti as mainboard, use the electrolysis copper bar as conductive lead wire in the upper surface, adopt the mode and the mainboard of bolted or welding to join, shelve the overlapping mode conduction by the plane.Because its long period of soaking is in sour environment, and how to beat or mode of vibration is got the electrolytic metal manganese product that is deposited on the stainless steel mainboard, prolongation along with duration of service, mainboard can produce and corrode and be out of shape and scrap, one side electrolytic copper and stainless material cost height, the electrolytic negative plate usage quantity is bigger on the other hand, the bigger production cost of bringing for the day-to-day operation of enterprise.Adopt the conductive clip welding assembly electric excessively, can address the above problem, but it can not utilize the popularization that has restricted the novel energy-conserving negative electrode again.

Summary of the invention

The purpose of this utility model provides a kind of manganese electrolytic deposition negative plate structure of recycle conductive clip, can keep good conductive effect, can make full use of original conductive contact again.

The purpose of this utility model is to be achieved through the following technical solutions:

A kind of manganese electrolytic deposition negative plate structure of recycle conductive clip, comprise part that has the copper conductive clip and new mainboard under cutting from old negative plate mainboard upside, the described old master's plate portion that has conductive clip is connected by bolt clamping stiffening web with new mainboard upper end, and old master's plate lower rim is welded to connect in lap-joint with new mainboard.

Further, be reserved with the L type breach of avoiding the copper conductive clip on the described new mainboard, the edge of breach welds with new mainboard lap-joint and is connected, and forms L type overlapping weld.

The beneficial effects of the utility model are, utilized original copper conductive clip as much as possible, the old master's plate portion that cuts adopts bolt clamping stiffening web to be connected with new mainboard, joint welding is connected metal solder of the same race, simple and reliable process between the part that contains the copper conductive clip and the new mainboard L type breach, short construction period, further strengthen the intensity that connects when having guaranteed good electrical conductivity, can replace new plate fully behind the renewal and reform, reduced the cost of the cloudy plate plate of enterprise's replacing electrolysis.

Description of drawings

With embodiment the utility model is described in further detail with reference to the accompanying drawings below.

Fig. 1 is old electrolytic negative plate structure iron;

Fig. 2 is the part that has the copper conductive clip under cutting on the old electrolytic negative plate;

Fig. 3 is new mainboard structure figure;

Fig. 4 is the electrolytic negative plate structure iron after the renovation;

Fig. 5 is that A shown in Figure 4 is to view;

Fig. 6 is a B-B view shown in Figure 4.

Among the figure:

1, old master's plate; 2, copper conductive clip; 3, line of cut; 4, old master's plate remaining part; 5, bolt hole; 6, new mainboard; 7, bolt hole; 8, back side overlapping weld; 9, L type overlapping weld; 10, web plate; 11, stiffening web.

Embodiment

The specific embodiment of the manganese electrolytic deposition negative plate structure of recycle conductive clip described in the utility model is shown in Fig. 1 to 5, wherein Figure 1 shows that the structure of old negative plate, it is made up of old master's plate 1, copper conductive clip 2, stiffening web 11, copper conductive clip 2 further is welded to connect by stainless steel web plate 10 and old master's plate 1, during renovation, along line of cut 3 waste and old mainboard is cut out down, leave and take have the copper conductive clip old master's plate portion 4 as shown in Figure 2; New mainboard 6 to be replaced as shown in Figure 3, new stainless steel plate is cut for one jiao, be reserved with the L type breach of avoiding the copper conductive clip, make it have the width that is equal to conductive clip 2 and the required weld length that stretches into, new mainboard 6 upper ends are drilled with and old crab bolt hole 5 corresponding bolts hole 7; With old master's plate portion that has a copper conductive clip 4 shown in Figure 2 and new mainboard 6 combinations shown in Figure 3,

corresponding bolt hole

5 and 7 is aimed at, still with the stiffening web 11 pulled down on the fastening old plate of stainless steel bolt clamping as non-conductive hangers.Fig. 4 to 5 has provided the synoptic diagram of this unitized construction, for the part that has the copper conductive clip that new mainboard 6 and old plate is cut get off combines firmly, and has better electroconductibility, new mainboard 6 welds along the lower rim of L type breach and old master's plate 4 respectively, forms back side overlapping weld 8 and L type overlapping weld 9.The welding that back side overlapping weld 8 and L type overlapping weld 9 are between the metal of the same race, the weldprocedure mature and reliable, technology simply can guarantee the intensity that connects, do not influence the conduction of electric current, adopt structure described in the utility model, to replacing new plate fully behind the waste and old electrolytic negative plate renewal and reform, reduced the cost of the cloudy plate plate of enterprise's replacing electrolysis.

Claims

1. the manganese electrolytic deposition negative plate structure of a recycle conductive clip, comprise part that has the copper conductive clip and new mainboard under cutting from old negative plate mainboard upside, it is characterized in that the described old master's plate portion that has conductive clip is connected by bolt clamping stiffening web with new mainboard upper end, old master's plate lower rim is welded to connect in lap-joint with new mainboard.

2. the manganese electrolytic deposition negative plate structure of recycle conductive clip according to claim 1 is characterized in that, is reserved with the L type breach of avoiding the copper conductive clip on the described new mainboard, and the edge of breach welds with new mainboard lap-joint and is connected, and forms L type overlapping weld.