CN201442286U - Laser emitter of laser centering instrument of rotary gas cutting machine - Google Patents

Laser emitter of laser centering instrument of rotary gas cutting machine Download PDF

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Publication number
CN201442286U
CN201442286U CN2009200146968U CN200920014696U CN201442286U CN 201442286 U CN201442286 U CN 201442286U CN 2009200146968 U CN2009200146968 U CN 2009200146968U CN 200920014696 U CN200920014696 U CN 200920014696U CN 201442286 U CN201442286 U CN 201442286U
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CN
China
Prior art keywords
laser
lens barrel
cutting machine
cylindrical shell
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200146968U
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Chinese (zh)
Inventor
刘义
王锦元
李今强
范军
才佳
韩宝财
王洪余
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINZHOU HANGXING PHOTOELECTRIC EQUIPMENT CO Ltd
Original Assignee
JINZHOU HANGXING PHOTOELECTRIC EQUIPMENT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JINZHOU HANGXING PHOTOELECTRIC EQUIPMENT CO Ltd filed Critical JINZHOU HANGXING PHOTOELECTRIC EQUIPMENT CO Ltd
Priority to CN2009200146968U priority Critical patent/CN201442286U/en
Application granted granted Critical
Publication of CN201442286U publication Critical patent/CN201442286U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the laser emitter of the laser centering instrument of a rotary gas cutting machine, which solves the technical problems of the prior art that the positioning operation of the metal connecting bar is fussy, the cutting quality is affected by the vibration, the cutting accuracy is affected by the mechanical wear because the tip of the connecting bar is always in contact with the metal sheet, and the metal connecting bar is apt to be deformed under high cutting temperature. The utility model is characterized in that a semiconductor laser emitting assembly cylinder is installed in a lens tube, a laser emitting diode is installed in the semiconductor laser emitting assembly cylinder, the laser emitting diode is installed on the rotary shaft of the rotary gas cutting machine through the lens tube when in use, and the center is found through the laser beam of the non-contact type laser emitter. The utility model has the advantages that no human error is caused, no mechanism wear is caused, the operation is convenient, the center can be found rapidly and accurately, the precision is high, no noise is caused, the fault rate is low, and the laser beam axis and the mechanical rotary shaft are always kept coaxial and concentric because the laser beam axis emitted by the laser emitter and the rotary shaft rotate synchronously in the cutting process.

Description

Rotation gas cutting machine laser centrescope generating laser
Technical field
The utility model belongs to a kind of optical instrument, particularly a kind of rotation gas cutting machine laser centrescope generating laser that positions at the sheet metal rotation cutting searching center of circle.
Background technology
In the prior art, rotation gas cutting machine is on sheet metal during the cutting metal circular hole, what seek the center of circle and location employing on sheet metal is the mode of metal connecting rod location, promptly on rotation gas cutting machine gyroaxis, the metal connecting rod is installed, by the top center of circle of on sheet metal, seeking of metal connecting rod, because the top influence that when seeking the center of circle and location, is subject to environment of metal connecting rod, there are following problems: the one, the influence of being vibrated, minor variations takes place in the position in the center of circle, location thereupon, influences cut quality; The 2nd, the metal connecting rod is top to be contacted with sheet metal after finding the center of circle fixing always, also along with the rotation of rotation gas cutting machine gyroaxis, exist the mechanical wear in the use, the time one is long, and error increases, influence cutting accuracy, the 3rd, the metal connecting rod is top when seeking the center of circle, inconvenient operation, more loaded down with trivial details, influence operating efficiency, also, be easy to generate distortion in the hot environment of cutting because the metal connecting rod is worked, so need often to change, otherwise can influence cut quality.
Summary of the invention
Technical problem to be solved in the utility model is, overcome the deficiencies in the prior art part, a kind of contactless rotation gas cutting machine laser centrescope generating laser is provided, seek the center of circle by the laser beam of generating laser, to increase work efficiency, guarantee cut quality.
Technical solution adopted in the utility model is, it has a lens barrel, be processed with one is used for being connected with the gyroaxis that rotates the gas cutting machine and plays blind hole to semiconductor Laser emission assembly dustproof effect simultaneously in the upper end of lens barrel, in inside, lens barrel lower end semiconductor laser emitting module cylindrical shell is installed, a substrate is installed in described semiconductor laser emitting module cylindrical shell, be welded with the Laser emission diode on the substrate, semiconductor laser emitting module cylindrical shell bottom focuses on by being threaded and adjusts seat, focusing on the adjustment seat, in focusing on the diaphragm seat, condenser is installed below by the focusing diaphragm seat that is threaded; Outside in the lower end of lens barrel with the protective sleeve that has been threaded, heat-protecting glass is installed and compresses at the front end of protective sleeve by clamp nut; On the cylindrical shell of described lens barrel lower end, also be processed with screwed hole and the correction holding screw is installed therein, proofread and correct tightening by this screwed hole and realize adjusting the location.
The lower end of lens barrel is outside with the protective sleeve that has been threaded, and heat-protecting glass is installed and is compressed by clamp nut at the front end of protective sleeve; Also branch is two-layer up and down on the cylindrical shell of described lens barrel lower end is processed with screwed hole along cylindrical shell circumference three equal parts, and described semiconductor laser emitting module cylindrical shell is proofreaied and correct holding screws by 6 and adjusted the location by this screwed hole correction tightening realization.
Also be processed with the breach of 120 degree that an air supply pipe that allows rotation gas cutting machine passes through in the upper surface of described lens barrel.
On the cylindrical shell of the upper end of described lens barrel, also be processed with clamp screw pit and 2 tightening hand button screwed holes, wherein be separately installed with holding screw and tightening hand button.
During use, the utility model is installed on the rotation gas cutting machine gyroaxis by lens barrel, with holding screw and the locking of tightening hand button, rotate synchronously with gyroaxis in the work, power by power-line plug, the semiconductor laser emitting diode can send red laser beam, when laser beam searches out when being cut the sheet metal central point, rotation gas cutting machine is located at once, thereby finishes the center of circle and the location work sought, in cutting process, laser beam axis is coaxial all the time concentric with the machinery rotation axle.
The beneficial effects of the utility model are, adopt the laser beam of contactless generating laser to seek the center of circle, there is not human error, do not have mechanical wear, and easy to operate, the searching center of circle is quick, accurate, precision is high, realized that the gas rotary knife cutter seeks the function of the center of circle and location exactly when work, and noiseless, fault rate is low, can improve production and processing efficient, guarantee cut quality.
Description of drawings
Fig. 1 is user mode figure of the present utility model.
Fig. 2 is a front view of the present utility model.
Fig. 3 is the cutaway view of Fig. 2.
Among the figure: 1 lens barrel, 2 protective sleeves, 3 semiconductor laser emitting module cylindrical shells; 4 condensers, 5 heat-protecting glasses, 6 clamp nuts; 7 focus on diaphragm seat, 8 power-line plugs, 9 holding screws; 10 tightening hand buttons; 11 Laser emission diodes, 12 rotation gas cutting machine gyroaxises, 13 focus on the adjustment seat; 14 proofread and correct holding screw, 15 substrates.
The specific embodiment
Shown in accompanying drawing 2 and accompanying drawing 3, the utility model has a lens barrel 1, be processed with a gyroaxis that is used for and rotates the gas cutting machine 12 in the upper end of lens barrel 1 and be connected and play blind hole simultaneously, also be processed with the breach of 120 degree that an air supply pipe that allows rotation gas cutting machine passes through in the upper surface of lens barrel 1 semiconductor Laser emission assembly dustproof effect; On the cylindrical shell of the upper end of described lens barrel 1, also be processed with 1 clamp screw pit and 2 tightening hand button screwed holes, wherein be separately installed with holding screw 9 and tightening hand button 10; Semiconductor laser emitting module cylindrical shell 3 is installed in lens barrel 1 lower end, also branch is two-layer up and down on described lens barrel 1 lower end cylindrical shell is processed with 6 screwed holes along cylindrical shell circumference three equal parts, and described semiconductor laser emitting module cylindrical shell 3 is proofreaied and correct holding screws 14 by 6 and adjusted the location by this screwed hole correction tightening realization; A substrate 15 is installed in interference in described semiconductor laser emitting module cylindrical shell 3, be welded with Laser emission diode 11 on the substrate 15, semiconductor laser emitting module cylindrical shell 3 tops are processed with a through hole, the lead that is connected with power-line plug 8 welds together by this through hole and Laser emission diode 11, semiconductor laser emitting module cylindrical shell 3 bottoms focus on by being threaded and adjust seat 13, focusing on adjustment seat 13, in focusing on diaphragm seat 7, condenser 4 is installed below by the focusing diaphragm seat 7 that is threaded; Outside in the lower end of lens barrel 1 with the protective sleeve 2 that has been threaded, heat-protecting glass 5 is installed and compresses at the front end of protective sleeve 2 by clamp nut 6.
As shown in Figure 1, during use, the utility model is installed on the rotation gas cutting machine gyroaxis 12 by lens barrel 1, with holding screw 9 and 2 tightening hand button 10 lockings, electric power connection line and LASER Light Source are connected, opening power, by power-line plug 8 power supplies, semiconductor laser emitting diode 11 can send the red laser beam of 620 nanometers~780 nanometers, spot diameter is in 1~1.5 millimeter scope, when laser beam searches out when being cut the sheet metal central point, rotation gas cutting machine is located at once, seek the center of circle and location work thereby finish, laser beam axis that generating laser sends in cutting process and gyroaxis 12 rotate synchronously, have guaranteed that laser beam axis and machinery rotation axle are coaxial all the time concentric.

Claims (3)

1. one kind is rotated gas cutting machine laser centrescope generating laser, include a lens barrel [1], power-line plug [8], it is characterized in that, be processed with one is used for being connected with the gyroaxis that rotates the gas cutting machine [12] and plays blind hole to semiconductor Laser emission assembly dustproof effect simultaneously in the upper end of lens barrel [1], in lens barrel [1] inside, lower end semiconductor laser emitting module cylindrical shell [3] is installed, a substrate [15] is installed in described semiconductor laser emitting module cylindrical shell [3], on described substrate [15], be welded with Laser emission diode [11], semiconductor laser emitting module cylindrical shell [3] bottom focuses on by being threaded and adjusts seat [13], focusing on adjustment seat [13], in focusing on diaphragm seat [7], condenser [4] is installed below by the focusing diaphragm seat [7] that is threaded; Outside in the lower end of lens barrel [1] with the protective sleeve that has been threaded [2]; heat-protecting glass [5] is installed and compresses at the front end of protective sleeve [2] by clamp nut [6]; on the cylindrical shell of described lens barrel [1] lower end, also be processed with screwed hole and correction holding screw [14] is installed therein; on the upper end cylindrical shell of described lens barrel [1], also be processed with clamp screw pit and tightening hand button screwed hole, wherein be separately installed with holding screw [9] and tightening hand button [10].
2. according to the generating laser of the said rotation gas of claim 1 cutting machine laser centrescope, it is characterized in that, also be processed with the breach of 120 degree that an air supply pipe that allows rotation gas cutting machine passes through in the upper surface of described lens barrel [1].
3. according to the generating laser of the said rotation gas of claim 1 cutting machine laser centrescope, it is characterized in that, divide on the cylindrical shell of described lens barrel [1] lower end two-layerly up and down to be processed with 6 screwed holes, correspondingly be equipped with 6 and proofread and correct holding screws [14] along cylindrical shell circumference three equal parts.
CN2009200146968U 2009-06-19 2009-06-19 Laser emitter of laser centering instrument of rotary gas cutting machine Expired - Fee Related CN201442286U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200146968U CN201442286U (en) 2009-06-19 2009-06-19 Laser emitter of laser centering instrument of rotary gas cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200146968U CN201442286U (en) 2009-06-19 2009-06-19 Laser emitter of laser centering instrument of rotary gas cutting machine

Publications (1)

Publication Number Publication Date
CN201442286U true CN201442286U (en) 2010-04-28

Family

ID=42546962

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200146968U Expired - Fee Related CN201442286U (en) 2009-06-19 2009-06-19 Laser emitter of laser centering instrument of rotary gas cutting machine

Country Status (1)

Country Link
CN (1) CN201442286U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103016494A (en) * 2012-12-31 2013-04-03 浙江天成自控股份有限公司 Connecting structure and connecting method for rivet nut and plate
CN104985331A (en) * 2015-07-10 2015-10-21 李欣岳 Laser cutting equipment and optical axis calibration method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103016494A (en) * 2012-12-31 2013-04-03 浙江天成自控股份有限公司 Connecting structure and connecting method for rivet nut and plate
CN104985331A (en) * 2015-07-10 2015-10-21 李欣岳 Laser cutting equipment and optical axis calibration method thereof

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100428

Termination date: 20120619