CN201435296Y

CN201435296Y - High voltage inductance framework

Info

Publication number: CN201435296Y
Application number: CN 200920172477
Authority: CN
Inventors: 杭子明; 刘林; 宫龙
Original assignee: WUHU GLORYMV ELECTRONICS CO Ltd
Current assignee: WUHU GLORYMV ELECTRONICS CO Ltd
Priority date: 2009-06-08
Filing date: 2009-06-08
Publication date: 2010-03-31
Anticipated expiration: 2019-06-08

Abstract

The utility model discloses a high voltage inductance framework comprising two support plates (1), wherein the middle part of one support plate (1) is provided with a clamping groove; different support plates (1) are mutually glued and connected by glue coated in the clamping groove in a clamping way so as to form a framework with a crossed structure; at least one end of the support plate (1) is provided with a through hole; the through holes on the mutually clamped support plates (1) are positioned at two ends of the framework; a red copper wire (2) is wound at the periphery of the framework;a certain clearance is reserved between adjacent red copper wires (2); and joints at two ends of the red copper wire (2) are respectively fixed in the through holes on the support plates (1) at two ends of the framework, and led out from the through holes. The inductance framework with the structure leads the contact area between the surface of the red copper wire and the support plate to be greatly reduced; and the structure causes the red copper wire to be completely transparent inside and outside, thus expanding heat dissipation space, greatly improving heat dissipation performance, increasing inductance stability of an artificial line, and being simple in production technology and low in cost.

Description

A kind of high voltage induction skeleton

Technical field

The utility model relates to a kind of boostrap inductance framework, especially relates to a kind of high voltage induction skeleton to all very high a kind of pulse forming network inductor of processability, interchangeability and heat dispersion requirement.

Background technology

At present, boostrap is used widely in the high-voltage pulse field, the existing inductor structure that is used for pulse forming network (PFN), inductance coiling on long tubulose insulation framework during making, shown in Figure of description 1 and accompanying drawing 2, the centre is provided with tap inductance is divided into more piece, and the adjusting of inductance value is finished by the position of mobile tap.The inductor heat dispersion of this tubulose insulation framework structure is poor, and skeleton processing technology complexity is not easy to install and produce in enormous quantities; And also there are the following problems in specific implementation process for this version:

1. this bobbin processing technology complexity, the structure poor radiation, and all coiling red copper wire 1 surfaces contact closely with the skeleton inner surface, shown in Figure of description 1, accompanying drawing 2, accompanying drawing 3 and accompanying drawing 4, be unfavorable for heat radiation, cause inductance service behaviour instability, even lost efficacy.

2. this boostrap inductance framework complex structural designs, the material utilization rate is low, and processing technology is poor, causes processing cost and material cost expense to improve inconvenient batch machining and production.

The utility model content

Technical problem to be solved in the utility model is to provide a kind of high voltage induction skeleton at problems of the prior art, its objective is the heat dispersion that improves inductance framework, improves the processing technology of inductance framework.

The technical solution of the utility model is that this a kind of high voltage induction skeleton comprises at least two support plates, the middle part of at least one support plate is provided with draw-in groove, different support plates are by the mutual clamping of draw-in groove, form the skeleton of chi structure, at least one end is provided with through hole on the support plate, and the through hole on the support plate of clamping is positioned at the two ends of skeleton mutually.

Be provided with cementing layer between the described support plate by the mutual clamping of draw-in groove.

Red copper wire is wrapped in the periphery of described skeleton, leaves certain clearance between the adjacent red copper wire, and two end connectors of red copper wire are separately fixed in the through hole on the support plate of skeleton two ends, and in through hole joint are drawn.

A kind of high voltage induction skeleton with above-mentioned special construction has the following advantages:

1, this kind inductance framework adopts red copper wire 1 coiling to form, this structure makes the red copper wire surface and the contact area of support plate significantly reduce in the coiling process, this structure makes red copper wire inside and outside fully penetrating, has enlarged heat-dissipating space, has improved heat dispersion greatly, increased boostrap inductance stabilization, and support plate adopts the high machinery and the epoxy glass cloth laminated board material of dielectric property, and structure has good heat dissipation, processing is simple, the advantage that cost is low.

2, this kind inductance framework is simple in structure, easy to process, with preceding skeleton adopt turning processing, one of time processing, working (machining) efficiency is relatively low, the utility model support plate adopts stack a plurality of, adopts planer processing, once can process a plurality of, improved working (machining) efficiency, aspect material use, the support plate rapidoprint is few, has reduced cost.

3, this kind inductance framework support plate adopts the splicing screens to fix, and fixed form is simple, firm, and the structure dismounting is simple, and is easy to maintenance, interchangeability, flexibility are strong, are convenient to selection, and processing technology is simple, stock utilization improves greatly, and cost reduces, and is convenient in batches and automated production.

Description of drawings

The utility model is described in further detail below in conjunction with accompanying drawing:

Fig. 1 is the main TV structure schematic diagram of the inductance framework of existing structure.

Fig. 2 is the right TV structure schematic diagram of the inductance framework of existing structure.

Fig. 3 is the main TV structure schematic diagram that inductance framework combines with red copper wire in the existing structure.

Fig. 4 is the right TV structure schematic diagram that inductance framework combines with red copper wire in the existing structure.

Fig. 5 is a structural representation of the present utility model.

In Fig. 1～5,1: support plate; 2: red copper wire.

Embodiment

Fig. 1 is the structural representation of the inductance framework of existing structure, Fig. 2 is the right TV structure schematic diagram of the inductance framework of existing structure, Fig. 3 is the main TV structure schematic diagram that inductance framework combines with red copper wire in the existing structure, and Fig. 4 is the right TV structure schematic diagram that inductance framework combines with red copper wire in the existing structure.By Fig. 1, Fig. 2, Fig. 3 and Fig. 4 combination as can be known, the bobbin processing technology complexity in the prior art, structure poor radiation, and all coiling red copper wire 1 surfaces contact closely with the skeleton inner surface, be unfavorable for heat radiation, cause inductance service behaviour instability, even lost efficacy; And, this boostrap inductance framework complex structural designs, the material utilization rate is low, and processing technology is poor, causes processing cost and material cost expense to improve inconvenient batch machining and production.

Figure 5 shows that the structural representation of the utility model high voltage induction skeleton, as can be known shown in Figure 3, this skeleton comprises two support plates 1, the middle part of one of them support plate 1 is provided with draw-in groove, different support plates 1 are by the mutual clamping of draw-in groove, form the skeleton of chi structure, at least one end is provided with through hole on the support plate 1, through hole on the support plate 1 of clamping is positioned at the two ends of skeleton mutually, be provided with cementing layer between the support plate 1 by the mutual clamping of draw-in groove, i.e. coating adhesive in draw-in groove, two support plates 1 are glued together, and red copper wire 2 is wrapped in the periphery of described skeleton, leaves certain clearance between the adjacent red copper wire 2, two end connectors of red copper wire 2 are separately fixed in the through hole on the skeleton two ends support plate 1, and in through hole joint are drawn.

Claims

1, a kind of high voltage induction skeleton, it is characterized in that: this skeleton comprises at least two support plates (1), the middle part of at least one support plate (1) is provided with draw-in groove, different support plates (1) are by the mutual clamping of draw-in groove, form the skeleton of chi structure, support plate (1) is gone up at least one end and is provided with through hole, and the through hole on the support plate (1) of clamping is positioned at the two ends of skeleton mutually.

2, a kind of high voltage induction skeleton according to claim 1 is characterized in that: described support plate by the mutual clamping of draw-in groove is provided with cementing layer between (1).

3, a kind of high voltage induction skeleton according to claim 2, it is characterized in that: red copper wire (2) is wrapped in the periphery of described skeleton, adjacent red copper wire leaves certain clearance between (2), two end connectors of red copper wire (2) are separately fixed in the through hole on the skeleton two ends support plates (1), and in through hole joint are drawn.