CN201408753Y - semiconductor chassis - Google Patents
semiconductor chassis Download PDFInfo
- Publication number
- CN201408753Y CN201408753Y CN2009200902734U CN200920090273U CN201408753Y CN 201408753 Y CN201408753 Y CN 201408753Y CN 2009200902734 U CN2009200902734 U CN 2009200902734U CN 200920090273 U CN200920090273 U CN 200920090273U CN 201408753 Y CN201408753 Y CN 201408753Y
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- chassis
- component
- utility
- pit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a component for making an integral semiconductor piece, in particular to a semiconductor chassis. The semiconductor chassis comprises a semiconductor chassis body that isprovided with one surface contacted with the semiconductor component. The semiconductor chassis is characterized in that one surface of the semiconductor chassis body contacted with the semiconductorcomponent is provided with a concave pit that is square, circular or hexagonal. The integral semiconductor piece made from the chassis has good contact effect between the chassis and the component andreduces the entire damage rate.
Description
Technical field
The utility model relates to a kind of parts of making whole of semiconductor, relates in particular to a kind of semiconductor chassis.
Background technology
Whole of conventional semiconductor is such: with the ceramics of flat board as the chassis, semiconductor element is welded on the chassis, owing to, tend to occur the situation of semiconductor element not prison welding on the chassis, influenced the performance of whole of semiconductor as the plane smoother of the ceramics on chassis.
Summary of the invention
The purpose of this utility model is exactly at above-mentioned shortcoming, provides a kind of and can make the firmly semiconductor chassis of welding of semiconductor element and chassis.
The technical solution of the utility model is achieved in that the semiconductor chassis, comprise the semiconductor chassis body, the semiconductor chassis body has the one side that contacts with semiconductor element, it is characterized in that: the one side that the semiconductor chassis body contacts with semiconductor element has pit, and such pit is square, circular or hexagonal.
The beneficial effects of the utility model are: whole of the semiconductor that uses such chassis to make has the chassis and contacts good effect with components and parts, reduces whole spoilage.
Description of drawings
Fig. 1 is the structural representation on the utility model semiconductor chassis
Wherein, 1, semiconductor chassis body 2, pit
Embodiment
The utility model will be further described below in conjunction with accompanying drawing.
The semiconductor chassis comprises semiconductor chassis body 1, has the one side that contacts with semiconductor element, and as shown in Figure 1, the one side that semiconductor chassis body 1 contacts with semiconductor element has pit 2.
According to different situations, such pit is square, circular or hexagonal.
When using the semiconductor chassis body to make whole of semiconductor, semiconductor element can be placed in pit 2 places, can make the semiconductor element difficult drop-off, thereby improve whole performance.
Claims (2)
1, semiconductor chassis comprises the semiconductor chassis body, and the semiconductor chassis body has the one side that contacts with semiconductor element, it is characterized in that: the one side that the semiconductor chassis body contacts with semiconductor element has pit.
2, semiconductor according to claim 1 chassis is characterized in that: described pit is square, circular or hexagonal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200902734U CN201408753Y (en) | 2009-05-15 | 2009-05-15 | semiconductor chassis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200902734U CN201408753Y (en) | 2009-05-15 | 2009-05-15 | semiconductor chassis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201408753Y true CN201408753Y (en) | 2010-02-17 |
Family
ID=41679699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200902734U Expired - Fee Related CN201408753Y (en) | 2009-05-15 | 2009-05-15 | semiconductor chassis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201408753Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165588A (en) * | 2013-02-27 | 2013-06-19 | 西安永电电气有限责任公司 | Insulated gate bipolar transistor (IGBT) module |
-
2009
- 2009-05-15 CN CN2009200902734U patent/CN201408753Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165588A (en) * | 2013-02-27 | 2013-06-19 | 西安永电电气有限责任公司 | Insulated gate bipolar transistor (IGBT) module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100217 Termination date: 20110515 |