CN201387802Y

CN201387802Y - Plane transformer

Info

Publication number: CN201387802Y
Application number: CN200920147467U
Authority: CN
Inventors: 林哲仕; 吕理敦; 吴名章
Original assignee: Li Shin International Enterprise Corp
Current assignee: Lite On Technology Changzhou Co Ltd; Lite On Technology Corp
Priority date: 2009-04-13
Filing date: 2009-04-13
Publication date: 2010-01-20
Anticipated expiration: 2019-04-13

Abstract

The utility model provides a plane transformer, which comprises a magnetic core group, an integrated circuit board, two shading metallic foils, two groups of connection structures and a plurality of conductive objects; the magnetic core group is provided with a first magnetic core and a second magnetic core, the integrated circuit board is arranged between the first magnetic core and the second magnetic core, a primary winding and a secondary winding are formed in the integrated circuit board, the shading metallic foils are arranged in the integrated circuit board at intervals so as to divide the primary winding and the secondary winding, the connection structures are arranged at the end parts of the two opposite sides of the integrated circuit board and are electrically connected with the shading metallic foils, so as to be electrically communicated, the conductive objects are arranged on the integrated circuit board, both the primary winding and the secondary winding are electrically connected with the conductive objects respectively, and the shading metallic foils are electrically connected with the corresponding conductive objects, so as to form an earthing; therefore, the utility model is provided with the function of electromagnetic interference shielding.

Description

Flat surface transformer

Technical field

The utility model refers to a kind of flat surface transformer with electromagnetic interference shield (EMIShielding) especially relevant for a kind of flat surface transformer.

Background technology

Transformer is various electronic installation, indispensable basic module during as running such as power supply unit or power supply change-over device, wherein has little, in light weight etc. the characteristic of volume with the transformer of high frequency again, therefore can be used for to reach the power supply of frivolous requirement, and along with electronic installation under the trend development of miniaturization, slimming, high power etc., transformer also needs the direction improvement of and flat structure little towards volume, by being applied to driving, communication as LED with the high unit price consumption electronic products power supply of power supply, specific (special) requirements etc.Because of comparing down with the traditional transformer of same power, it is better that flat (plane) volume of transformer dwindles electrical characteristic, more can reach frivolous requirement, and can accomplish the characteristic of bigger power output under identical volume.

As shown in Figure 6, be existing a kind of flat surface transformer, comprise magnetic core 11 on, once magnetic core 12, a circuit board 13 and a plurality of pin 14, upper and lower

magnetic core

11,12 is symmetrical structure, circuit board 13 can be multilayer be laminated structure and have one the coiling circuit to form a main winding and a level winding (not shown), pin 14 1 ends are arranged in the circuit board 13 and are electrically connected to reach with the coiling circuit, and circuit board 13 is provided with 11,12 of upper and lower magnetic cores, and upper and lower

magnetic core

11,12 can use the mode of a glue and stick together mutually.The other end of pin 14 can be used for a system circuit board on a plurality of corresponding connection gaskets (Surface Mount Technology SMT) connects (not shown), and flat surface transformer is fixed on the system circuit board by surface mount technology.By this, just can utilize the electromagnetic coupled effect between the coiling circuit of upper and lower

magnetic core

11,12 and circuit board 13, to reach the purpose of voltage transitions.

Yet above-mentioned existing flat surface transformer is easy to generate electromagnetic interference (EMI), and especially under the use of high frequency, the situation of electromagnetic interference is serious especially, makes accurate electronic building brick be interfered.Further, traditional transformer is used in the Switching Power Supply, effect is changing voltage and electric current, and the coil of transformer has high-frequency current when Switching Power Supply is operated, therefore transformer has become the antenna that receives electric field in fact, and exhale noise, and make electronic building brick be interfered.

The utility model content

The purpose of this utility model, a kind of flat surface transformer is provided, mainly is to be formed with in the surface-mounted integrated circuit member of electromagnetic interference shield (EMI Shielding), thereby have the effect that anti electromagnetic wave disturbs, to prevent that high frequency from using down, is interfered accurate electronic building brick.

In order to achieve the above object, the utility model provides a kind of flat surface transformer, comprising: a magnetic core set, have one first magnetic core and one second magnetic core that are oppositely arranged, and this first magnetic core has one first and stretches into portion and this second magnetic core and have one second and stretch into portion; One surface-mounted integrated circuit is arranged between this first magnetic core and this second magnetic core, and first second portion of stretching into that stretches into portion and this second magnetic core of this first magnetic core stretches into respectively in this surface-mounted integrated circuit, is formed with main winding and secondary winding in this surface-mounted integrated circuit; Two metal formings of covering with opening port, being arranged in this surface-mounted integrated circuit at interval, these two cover metal forming and separate this elementary winding and this secondary winding; Two groups of syndetons are arranged at the relative end, both sides of this surface-mounted integrated circuit, and being positioned at this two edges that cover metal forming, and these two groups of syndetons electrically connect these two and cover metal forming, make these two to cover the metal forming electrical communication; And a plurality of conductive object, be arranged at this surface-mounted integrated circuit, and this elementary winding and this secondary winding respectively with corresponding conductive object electrically connect, and these two cover metal forming and corresponding conductive object electrically connect with formation ground connection.

The benefit that the utlity model has: owing to be provided with the design of covering metal forming and syndeton in the surface-mounted integrated circuit to form electromagnetic interference shield (EMI Shielding), thereby has the effect that anti electromagnetic wave disturbs, to prevent that high frequency from using down, is interfered accurate electronic building brick.

For enabling further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.

Description of drawings

Fig. 1 is a stereogram of the present utility model;

Fig. 2 is three-dimensional exploded view of the present utility model (one);

Fig. 3 is three-dimensional exploded view of the present utility model (two), wherein illustrates surface-mounted integrated circuit and is the signal that multilayer is decomposed;

Fig. 4 is three-dimensional exploded view of the present utility model (three), wherein illustrates the signal of another embodiment of syndeton;

Fig. 5 is three-dimensional exploded view of the present utility model (four), wherein illustrates the signal that surface-mounted integrated circuit is multilayer decomposition and another embodiment of syndeton;

Fig. 6 is the perspective exploded view of existing flat surface transformer.

The primary clustering symbol description

11 times magnetic cores 12 of last magnetic core

Circuit board 13 pins 14

The utility model

Magnetic core set 20

First magnetic core 21

First basal wall, 211 the first side walls 212

First stretches into portion 213

Second magnetic core 22

Second basal wall, 221 second sidewalls 222

Second stretches into portion 223

Surface-mounted integrated circuit 30

End, limit 301,302

Through hole 31 elementary windings 32

Secondary winding 33 covers metal forming 34

Open 341 syndetons 35,35 '

Guide hole 36

Conduction object 40

Embodiment

See also Fig. 1 to shown in Figure 3, the utility model provides a kind of flat surface transformer, and it comprises a magnetic core set 20, a surface-mounted integrated circuit 30 and a plurality of conductive object 40.

Magnetic core set 20 has one first magnetic core 21 and one second magnetic core 22, first magnetic core 21 has that one first basal wall 211, two the first side walls 212 and one first stretch into 22 of portion's 213, the second magnetic cores and have one the 1 basal wall 211, two second sidewalls 222 and one second stretch into portion 223.Two the first side walls 212 of first magnetic core 21 are connected in the both sides of first basal wall 211 relatively, first stretches into portion 213 forms from the central portion extension of first basal wall 211, similarly, two second sidewalls 222 of second magnetic core 22 are connected in the both sides of second basal wall 221 relatively, and second stretches into portion 223 forms from the central portion extension of second basal wall 221.

The structural member that surface-mounted integrated circuit 30 forms for multilayer is laminated, wherein in Fig. 3 graphic, show and be the schematic diagram that multi-layer sheet decomposes, surface-mounted integrated circuit 30 has a through hole 31 that runs through surface-mounted integrated circuit 30, reach and in surface-mounted integrated circuit 30, be formed with elementary (PRI) winding 32 and secondary (SEC) winding 33, as shown in the figure, the conductive pattern of elementary winding 32 (becoming the pattern of coiled type) reaches on the laminate that is arranged on the first half that is electrically connected in regular turn earlier continuously, form elementary winding 32 afterwards again on the laminate of Lower Half, the conductive pattern of secondary winding 33 (pattern of type in flakes) then is arranged on the central portion laminate.

In the utility model, what be provided with in surface-mounted integrated circuit 30 that two intervals are provided with tool opening port 341 covers metal forming 34, and two cover metal forming 34 and separate elementary winding 32 and secondary winding 33.As shown in the figure, two cover on metal forming 34 two laminates up and down that are arranged on secondary winding 33 at interval, and folder is established secondary winding 33, and elementary winding 32 and secondary winding 33 separated, the setting of right elementary winding 32 and secondary winding 33, do not exceed, can do different variation settings yet, but mainly be to need to cover metal forming 34 elementary winding 32 and secondary winding 33 are separated by two with described in the utility model.

Secondly, in the utility model, more be provided with two groups of syndetons 35 in surface-mounted integrated circuit 30 relative ends, both sides, to be positioned at two peripheries of covering the edge of metal forming 34 and being positioned at elementary winding 32 and secondary winding 33, and electrically connect two by two groups of syndetons 35 and cover metal forming 34, make two to cover metal forming 34 electrical communication mutually.In the utility model specific embodiment, as shown in the figure, two groups of syndetons 35 are respectively a plurality of connecting holes, and wear respectively to two and cover metal forming 34, and a plurality of conducting metal spares of being located at respectively in the connecting hole (not shown), it can be the conducting metal spare as scolding tin etc., use making two cover metal forming 34 can electrical communication; But two groups of syndetons also can be done different variations, Fig. 4 and shown in Figure 5 for example, these two groups of syndetons 35 ' are two conductivity connectors, utilization is separately positioned on relative 301,302 places, end, both sides of surface-mounted integrated circuit 30 in external mode, and connect two and cover metal forming 34, also can reach mutually purpose roughly the same.Further explanation, after surface-mounted integrated circuit 30 was finished, two sides that cover metal forming 34 can be revealed in the side of surface-mounted integrated circuit 30, therefore two groups of syndetons 35 ' can be arranged on respectively surface-mounted integrated circuit 30 side and with cover metal forming 34 and be connected.

Cover metal forming 34 and can be Copper Foil, its roughly similar one-tenth one C matrix body, thus have an opening port 341, if become the metal forming of a closed then not have the effect of shielding EMI.In addition, elementary winding 32, secondary winding 33 and two are covered the periphery that metal forming 34 is located in through hole 31.On the other hand, surface-mounted integrated circuit 30 is provided with a plurality of guide holes that run through 36 respectively at relative both ends, and elementary winding 32, secondary winding 33 and cover metal forming 34 and corresponding guide hole 36 links conduct with formation.

Conductive object 40 is arranged at surface-mounted integrated circuit 30 respectively, and the elementary winding 32 of surface-mounted integrated circuit 30 and secondary winding 33 respectively with corresponding conductive object 40 electrically connects, two cover 34 of metal formings and corresponding conductive object 40 electrically connects to form ground connection.

In the utility model, each conduction object 40 is a pin spare, the one end is fixedly arranged in the surface-mounted integrated circuit 30 corresponding guide holes 35, and the elementary winding 32 of surface-mounted integrated circuit 30 and secondary winding 33 respectively with corresponding conductive object 40 electrically connects, two cover metal forming 34 whiles and corresponding conductive object 40 electrically connects, thereby form the effect of ground connection.Yet, conductive object also can be done different variation designs, for example pour into tin etc. to constitute the conduction object in guide hole, make elementary winding, secondary winding and cover metal forming and conductive object forms electrically connect (present embodiment does not show graphic), meaning promptly is an employing SMT welding manner.

First magnetic core 21 of magnetic core set 20 and the relative up and down setting of second magnetic core 22, and surface-mounted integrated circuit 30 is arranged between first magnetic core 21 and second magnetic core 22, first of first magnetic core 21 and second magnetic core 22 stretches into portion 213 and second and stretches into portion 223 and promptly stretch into respectively in the surface-mounted integrated circuit 30, specifically implements relative being inserted in the through hole 31.In addition, first basal wall 211 of the surface-mounted integrated circuit 30 and first magnetic core 21 and second magnetic core 22 and second basal wall 221 are in a parallel set.

Conductive object 40 can be used for being connected with connection gasket and ground mat (not shown) etc. on the system circuit board (as the system circuit board of LCD), by this, can utilize the electromagnetic coupled effect of 33 of the elementary winding 32 of first magnetic core 21 and second magnetic core 22 and surface-mounted integrated circuit 30 and secondary winding, to reach the purpose of voltage transitions.On the other hand, the metal forming of covering that the electromagnetic wave that is produced can be integrated in the circuit board 30 shields, and reaches the purpose of covering electromagnetic interference.Further explanation, become two metal formings 34 of covering that are provided with at interval to have and cover into the vertical noise of dispersing, more couple together to cover metal forming 34 two by syndeton 35, and be positioned at two edges that cover metal forming 34, and be positioned at elementary winding 32 and secondary winding 33 peripheries, and then make and to cover the noise of dispersing that metal forming 34 has the level of covering into, use the purpose of reaching the EMI shielding.

Comprehensive above-mentioned explanation, the utility model is by being provided with the design of covering metal forming 34 and syndeton 35 to form the purpose of electromagnetic interference shield (EMI Shielding) in surface-mounted integrated circuit 30, thereby has the effect that anti electromagnetic wave disturbs, to prevent that high frequency from using down, is interfered accurate electronic building brick.

The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.

Claims

1. a flat surface transformer is characterized in that, comprising:

One magnetic core set has one first magnetic core and one second magnetic core that are oppositely arranged, and this first magnetic core has one first and stretches into portion and this second magnetic core and have one second and stretch into portion;

One surface-mounted integrated circuit is arranged between this first magnetic core and this second magnetic core, and first second portion of stretching into that stretches into portion and this second magnetic core of this first magnetic core stretches into respectively in this surface-mounted integrated circuit, is formed with elementary winding and secondary winding in this surface-mounted integrated circuit;

Two metal formings of covering with opening port, being arranged in this surface-mounted integrated circuit at interval, these two cover metal forming and separate this elementary winding and this secondary winding;

Two groups of syndetons are arranged at the relative end, both sides of this surface-mounted integrated circuit, and being positioned at this two edges that cover metal forming, and these two groups of syndetons electrically connect these two and cover metal forming, make these two to cover the metal forming electrical communication; And

A plurality of conductive object are arranged at this surface-mounted integrated circuit, and this elementary winding and this secondary winding respectively with corresponding conductive object electrically connect, and these two cover metal forming and corresponding conductive object electrically connect with formation ground connection.

2. flat surface transformer as claimed in claim 1, it is characterized in that, this first magnetic core has one first basal wall and two the first side walls that are connected in these first basal wall both sides, this first stretches into portion and extends from the central portion of this first basal wall and form, this second magnetic core has one second basal wall and two second sidewalls that are connected in these second basal wall both sides, this second stretches into portion and extends from the central portion of this second basal wall and form, this surface-mounted integrated circuit is provided with a through hole that runs through, and this first stretches into portion and this second portion of stretching into is inserted in the through hole of this surface-mounted integrated circuit.

3. flat surface transformer as claimed in claim 2 is characterized in that, this surface-mounted integrated circuit becomes parallel setting with this first basal wall and this second basal wall.

4. flat surface transformer as claimed in claim 2 is characterized in that, the elementary winding of this surface-mounted integrated circuit, this secondary winding and these two are covered the periphery that metal forming is located in this through hole.

5. flat surface transformer as claimed in claim 1 is characterized in that, these two groups of syndetons are respectively a plurality of connecting hole and a plurality of conducting metal spares of being located at respectively in a plurality of connecting holes that cover metal forming to these two of wearing.

6. flat surface transformer as claimed in claim 1 is characterized in that, these two groups of syndetons are respectively two conductivity connectors, the end, both sides that is separately positioned on this surface-mounted integrated circuit that these two conductivity connectors are external, and connect these two and cover metal forming.

7. flat surface transformer as claimed in claim 1, it is characterized in that, this surface-mounted integrated circuit is provided with a plurality of guide holes that run through respectively at relative both ends, this elementary winding, this secondary winding and these two are covered metal forming and are linked with corresponding guide hole and conduct with formation, and an end of each conduction object is fixedly arranged in the guide hole of this surface-mounted integrated circuit correspondence.