CN201364055Y - Cooling device for silicon chip cutting fluid - Google Patents
Cooling device for silicon chip cutting fluid Download PDFInfo
- Publication number
- CN201364055Y CN201364055Y CNU2009200362469U CN200920036246U CN201364055Y CN 201364055 Y CN201364055 Y CN 201364055Y CN U2009200362469 U CNU2009200362469 U CN U2009200362469U CN 200920036246 U CN200920036246 U CN 200920036246U CN 201364055 Y CN201364055 Y CN 201364055Y
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- CN
- China
- Prior art keywords
- silicon chip
- cutting fluid
- cooling device
- mounting flange
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a cooling device for silicon chip cutting fluid, which has the advantages of uniform exchange effect, no dead angle, convenient cleaning, and the guarantee of cutting quality. The device comprises a casing, wherein the internal part of the casing is divided into a cutting fluid outlet cavity, a cutting fluid inlet cavity and a heat exchange cavity; and a cooling fluid inlet port and a cooling fluid outlet port are formed at the upper and the lower ends of the heat exchange cavity respectively. The device is characterized in that the cutting fluid outlet and inlet cavities are formed at the upper and the lower ends of the casing respectively, a cooling pipeline is arranged inside the heat exchange cavity at the middle part, and the cutting fluid outlet and inlet cavities are communicated through the cooling pipeline.
Description
(1) technical field
The utility model relates to silicon chip cutting technique field, is specially a kind of cooling device of silicon chip cutting fluid.
(2) background technology
In semicon industry and solar energy industry, silicon rod is processed into silicon chip and uses multi-line cutting machine more, the line of cut of multi-line cutting machine uses the stainless steel wire of copper coating, cutting liquid is flowed along steel wire by nozzle in cutting process, by steel wire cutting liquid is brought into cutting zone, the free abrasive of Steel Wire Surface carries out the cutting of silicon chip under the drive of the pressure of steel wire and speed.Cutting liquid after the cutting flows into hod recirculation and uses.The a large amount of heats of generation in the cutting process, the cutting liquid temp after the cutting raises, and the temperature to cutting fluid in the silicon chip cutting process has strict demand, therefore cuts liquid and must cool off back recirculation use.Because the viscosity of cutting liquid is big, silica flour in working angles, the abrasive dust of steel wire all can flow into cutting liquid, cooler adopted plate type heat exchanger in the past, had the dead angle easily, not easy to clean, the big particle of long formation easily of time, the size of silicon chip split requirement abrasive material within the specific limits, if any bulky grain, silicon chip surface forms mass defects such as stria.
(3) utility model content
At the problems referred to above, the utility model provides a kind of cooling device of silicon chip cutting fluid, and its exchange effect is even, does not have the dead angle, and it is convenient to clean, and has guaranteed cut quality.
Its technical scheme is such: it comprises housing, described enclosure interior is divided into cutting liquid and goes out sap cavity and admission chamber and heat exchanging chamber, described heat exchanging chamber upper end, lower end have cooling fluid inlet and liquid outlet, it is characterized in that: described cutting liquid goes out upper end, the lower end that sap cavity and admission chamber are separately positioned on housing, its inside of heat exchanging chamber that is positioned at the middle part is provided with cooling pipe, and described cutting liquid is gone out sap cavity to described cooling pipe and admission chamber is communicated with.
It is further characterized in that: described cutting liquid admission chamber and go out sap cavity and comprise mounting flange and end socket respectively; Described mounting flange is installed on described housing two ends; Be connected by adpting flange between described mounting flange and the described end socket; Be provided with pad between described adpting flange and the described mounting flange; The inlet that goes out the liquid outlet of sap cavity and admission chamber is arranged at the described end socket of corresponding end respectively; Have through hole on the described mounting flange, described pipeline is plugged in the described through hole of the described mounting flange in two ends respectively.
This device adopts tubular heat exchange, and the exchange effect is even, does not have the dead angle, and it is convenient to clean, and has guaranteed cut quality.
(4) description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is that the A-A of Fig. 1 is to cutaway view.
(5) specific embodiment
See Fig. 1, Fig. 2, the utility model comprises housing 4, housing 4 inside are divided into cutting liquid and go out sap cavity and admission chamber and heat exchanging chamber, heat exchanging chamber upper end, lower end have cooling water intake 12 and delivery port 6, cutting liquid goes out upper end, the lower end that sap cavity and admission chamber are separately positioned on housing 4, its inside of heat exchanging chamber that is positioned at the middle part is provided with cooling pipe 5, and cooling pipe 5 will cut liquid and go out sap cavity and admission chamber connection.Cutting liquid goes out sap cavity and admission chamber includes mounting flange 13,7 and end socket 10,2, and mounting flange 13,7 is installed on the two ends up and down of housing 5 respectively; Be connected by adpting flange 1,9 respectively between mounting flange 13,7 and the end socket 10,2; Be respectively arranged with pad 14,8 between adpting flange 1,9 and the mounting flange 13,7; Have inlet 11 and liquid outlet 3 on the end socket 10,2; Have through hole on the mounting flange 13,7; Pipeline 5 is inserted in the through hole; Pipeline 5 is provided with some.
The concrete course of work of the present utility model is described below: during work once, cutting liquid enters cutting liquid admission chamber from the inlet 11 of housing 4 lower ends, enter cutting liquid by pipeline 5 then and go out sap cavity, and flow out from the cutting liquid liquid outlet 3 of housing 4 upper ends, impurity particle in the cutting liquid is deposited in the admission chamber, can not recycle the cutting silicon chip, guarantee the cut quality of silicon chip with cutting liquid; Cooling fluid enters in the water cavity of housing 4 and pipeline 5 outer walls formation from inlet 12, flows out from liquid outlet 6 again, and cooling fluid is finished heat exchange with cutting liquid by the inside and outside wall of pipeline 5 like this.
Claims (7)
1, a kind of cooling device of silicon chip cutting fluid, it comprises housing, described enclosure interior is divided into cutting liquid and goes out sap cavity and admission chamber and heat exchanging chamber, described heat exchanging chamber upper end, lower end have cooling fluid inlet and liquid outlet, it is characterized in that: described cutting liquid goes out upper end, the lower end that sap cavity and admission chamber are separately positioned on housing, its inside of heat exchanging chamber that is positioned at the middle part is provided with cooling pipe, and described cutting liquid is gone out sap cavity to described cooling pipe and admission chamber is communicated with.
2, the cooling device of a kind of silicon chip cutting fluid according to claim 1 is characterized in that: described cutting liquid admission chamber and go out sap cavity and comprise mounting flange and end socket respectively.
3, the cooling device of a kind of silicon chip cutting fluid according to claim 2 is characterized in that: described mounting flange is installed on described housing two ends.
4, the cooling device of a kind of silicon chip cutting fluid according to claim 3 is characterized in that: be connected by adpting flange between described mounting flange and the described end socket.
5, the cooling device of a kind of silicon chip cutting fluid according to claim 4 is characterized in that: be provided with pad between described adpting flange and the described mounting flange.
6, the cooling device of a kind of silicon chip cutting fluid according to claim 5 is characterized in that: the inlet that goes out the liquid outlet of sap cavity and admission chamber is arranged at the described end socket of corresponding end respectively.
7, the cooling device of a kind of silicon chip cutting fluid according to claim 6 is characterized in that: have through hole on the described mounting flange, described pipeline is plugged in the described through hole of the described mounting flange in two ends respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200362469U CN201364055Y (en) | 2009-03-09 | 2009-03-09 | Cooling device for silicon chip cutting fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200362469U CN201364055Y (en) | 2009-03-09 | 2009-03-09 | Cooling device for silicon chip cutting fluid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201364055Y true CN201364055Y (en) | 2009-12-16 |
Family
ID=41474724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009200362469U Expired - Lifetime CN201364055Y (en) | 2009-03-09 | 2009-03-09 | Cooling device for silicon chip cutting fluid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201364055Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101504914B (en) * | 2009-03-09 | 2011-03-23 | 无锡开源太阳能设备科技有限公司 | Improved cooling apparatus for silicon chip cutting liquor |
| CN102252540A (en) * | 2011-08-23 | 2011-11-23 | 东南大学 | Heat exchanger of Cantor set fractal structure type |
-
2009
- 2009-03-09 CN CNU2009200362469U patent/CN201364055Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101504914B (en) * | 2009-03-09 | 2011-03-23 | 无锡开源太阳能设备科技有限公司 | Improved cooling apparatus for silicon chip cutting liquor |
| CN102252540A (en) * | 2011-08-23 | 2011-11-23 | 东南大学 | Heat exchanger of Cantor set fractal structure type |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20091216 Effective date of abandoning: 20090309 |