CN201360002Y - Device for solving coplanarity in lead frame of large scale integrated circuit - Google Patents

Device for solving coplanarity in lead frame of large scale integrated circuit Download PDF

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Publication number
CN201360002Y
CN201360002Y CN 200920301154 CN200920301154U CN201360002Y CN 201360002 Y CN201360002 Y CN 201360002Y CN 200920301154 CN200920301154 CN 200920301154 CN 200920301154 U CN200920301154 U CN 200920301154U CN 201360002 Y CN201360002 Y CN 201360002Y
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CN
China
Prior art keywords
air
cavity
head
lead frame
flattening
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Expired - Fee Related
Application number
CN 200920301154
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Chinese (zh)
Inventor
孙冠鸣
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Individual
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Individual
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Priority to CN 200920301154 priority Critical patent/CN201360002Y/en
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Publication of CN201360002Y publication Critical patent/CN201360002Y/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model discloses a device for solving lead coplanarity in a lead frame of a large scale integrated circuit, which comprises a lower die and an upper die corresponding to the lower die. The device is characterized in that the upper die is provided with a negative air device which is used for independently supplying air and the negative air device comprises a cavity that is communicated up and down, a flattening head installed under the cavity, a cylinder cover arranged on the cavity, an air chamber positioned between the flattening head and the cylinder cover, an air inlet channel communicated with the air chamber as well as a pressure regulating valve and air pressure gauges that are arranged in front of the air inlet channel, wherein the air pressure gauges are connected with each other in series, and the lower end surface of the flattening head coincides with flattening heads of the dies. In the utility model, principle of negative air is adopted and a set of independent air supply device is added on the original die, the flattening head floats on a stripper plate, and the pressure of compressed air is regulated to press the flattening head, so that the force of the compressed air is not influenced by the force of a punch and is directly controlled by stable air pressure, and the purpose of flattening the lead frame can be achieved.

Description

A kind of device that solves coplanarity of large-scale integrated circuit lead frames
Technical field
The utility model relates to a kind of circuit lead frame, relates in particular to large-scale integrated circuit lead frame.
Background technology
Along with the development of ic manufacturing technology, large scale integrated circuit is broken through by China.But his lead frame needs import always, and a handful of joint venture produces some comparatively low-grade products by introducing the mould introducing equipment.Generally all monopolized by foreign capitals at 64 lead frames more than the lead-in wire.Its main cause is the plane consistency problem (being commonly called as " coplanarity ") that can't solve multilead.Its requirement is within 0.02mm.
How be so abroad to solve Coplanarity Problems?
Its equipments machining die all is world-class, and its production equipment also is world-class, and its control personnel also are the unusual scholars of specialty.Usually solve these facilities, should not comprise that also personnel introduce in the expense more than 100,000,000.Domestic two complete equipments of introducing in the nineties, because the corresponding talent and control problem also can only be produced some low-grade products, " coplanarity " at 40 following multileads of lead-in wire solves by the punching out mould usually.Why so difficult? with regard to 64 lead frames, it needs the progressive die of 40 multistation, and length is about 1 meter.Usually will come punching out with 80 tons of import punch presses, after product was rushed out, lead-in wire was not in one plane.General import mould by the sharpening combination after all more than 0.006mm.Along with the increase of sharpening number of times, the plane can not strengthened again and again.Though it has leveling head to flatten, because the leveling head is to be assembled on the stripper of mould, with the decline of the punch press leveling that descends.Its raised face can't change owing to the continuous variation on support lead plane thereupon, and that can press sometimes is too light, and that presses sometimes is too heavy, thereby causes the instability of product lead-in wire coplanarity, causes waste product.Because punching out all is at a high speed, yields is difficult to control.Domestic enterprise much all attempted.Have at last give foreign side with the market of large-scale integrated circuit lead frame.
Summary of the invention
The utility model main purpose is: by adopting common equipments machining die and production equipment, develop a kind of large-scale integrated circuit lead frame lead coplane device, to separate the plane consistency problem of lead frame multilead.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of large-scale integrated circuit lead frame lead coplane device, comprise counterdie and with the corresponding patrix of counterdie, it is characterized in that: the negative device of gas that independent gas supply is housed at patrix, the negative device of described gas comprises the cavity that is communicated with up and down, be installed in the smooth head below the cavity, be installed in the cylinder head above the cavity, between smooth head and cylinder head, be provided with air chamber, described air chamber is connected with inlet channel, the air gauge that described inlet channel front is equipped with voltage regulator and is interconnected; The lower surface of described smooth head coincides with a leveling position that was installed on the mould stripper originally.
The technical solution of the utility model can also be further perfect, as preferably, the up big and down small ladder-type structure of described smooth head for matching with cavity has the lower seal pad between smooth head and cavity composition surface, between described seal cover and the cavity composition surface last gasket seal is arranged.
The beneficial effects of the utility model are: the utility model adopts the negative principle of gas, install one additional at the patrix of original mould and overlap independently feeder, smooth head is floated on the stripper, push down smooth head with compressed air by pressure regulation, make his power not influenced by the power of punch press, be not subjected to smooth head process to go out the influence of the variation at position yet, directly control, reach smooth purpose by stable air pressure.The flatness of lead frame can be controlled within the 0.02mm, have clear superiority than imported product.
Description of drawings
Accompanying drawing 1 is patrix stripper and the particular location front schematic view of the utility model in stripper;
Accompanying drawing 2 is the utility model a kind of structure side views in patrix.
Embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment:
Shown in Figure 1,1 is the particular location of the utility model in patrix 2 strippers, is the pairing service position of expression the utility model.
As shown in Figure 2, have a cavity that is communicated with up and down on the leveling position of patrix 2 strippers being installed in originally, be equipped with smooth 4 below cavity, the smooth head up big and down small ladder-type structure for matching with cavity has lower seal pad 6 between smooth 4 and cavity composition surface; Cylinder head 5 is installed, gasket seal 7 on having between cylinder head and the cavity composition surface above the cavity; Between smooth head and cylinder head 5, air chamber is arranged.Air chamber is connected with inlet channel 8, and mount pad 12 is equipped with in the inlet channel front, and inlet suction port 9 is housed on the mount pad, pressure regulating valve 11 and air gauge 10.After installing, the logical pressure air of examination is also pressed smooth head, has floating sense to get final product.Regulate air pressure, floating sense increases and decreases thereupon, can use.
The concrete course of work is as follows: patrix moves downward when work, smooth the 4 lead-in wire face that can touch lead frame 1 earlier with stripper, moving up and down along with punch press like this, can once flatten each lead-in wire face for smooth 4, the size of flattening pressure is observed with air gauge 10, and, reach " coplanarity " requirement, fixed air pressure then until product lead-in wire face with the size that adjuster valve 11 is regulated pressure.The utility model reaches qualified product by the operation of this device, and highly stable, and yields is all more than 98%.

Claims (2)

1. device that solves large-scale integrated circuit lead frame lead coplanarity, comprise counterdie and with the corresponding patrix of counterdie, it is characterized in that: the negative device of gas that independent gas supply is housed at patrix, the negative device of described gas is by the cavity that is communicated with up and down, be installed in the smooth head (4) below the cavity, be installed in the cylinder head (5) above the cavity, between smooth head (4) and cylinder head (5), be provided with air chamber, described air chamber is connected with inlet channel (8), the air gauge (10) that described inlet channel (8) front is equipped with voltage regulator (11) and is interconnected; The lower surface of described smooth head (4) and the leveling position on the mould stripper coincide.
2. the device of large-scale integrated circuit lead frame lead coplanarity according to claim 1, it is characterized in that: the up big and down small ladder-type structure of described smooth head (4) for matching with cavity, between smooth head (4) and cavity composition surface, lower seal pad (6) is arranged, last gasket seal (7) is arranged between described cylinder head (5) and the cavity composition surface.
CN 200920301154 2009-03-09 2009-03-09 Device for solving coplanarity in lead frame of large scale integrated circuit Expired - Fee Related CN201360002Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200920301154 CN201360002Y (en) 2009-03-09 2009-03-09 Device for solving coplanarity in lead frame of large scale integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200920301154 CN201360002Y (en) 2009-03-09 2009-03-09 Device for solving coplanarity in lead frame of large scale integrated circuit

Publications (1)

Publication Number Publication Date
CN201360002Y true CN201360002Y (en) 2009-12-09

Family

ID=41425768

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200920301154 Expired - Fee Related CN201360002Y (en) 2009-03-09 2009-03-09 Device for solving coplanarity in lead frame of large scale integrated circuit

Country Status (1)

Country Link
CN (1) CN201360002Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103464608A (en) * 2013-09-27 2013-12-25 铜陵丰山三佳微电子有限公司 High-speed progressive die for correcting coplanarity of lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103464608A (en) * 2013-09-27 2013-12-25 铜陵丰山三佳微电子有限公司 High-speed progressive die for correcting coplanarity of lead frame

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Zhejiang Huajin Microelectronics Co., Ltd.

Assignor: Sun Guanming

Contract record no.: 2011330000186

Denomination of utility model: Device for solving coplanarity in lead frame of large scale integrated circuit

Granted publication date: 20091209

License type: Exclusive License

Record date: 20110401

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091209

Termination date: 20130309