CN201351180Y - Electroplating mould device of rectangular cylinder paste point nickel mesh - Google Patents
Electroplating mould device of rectangular cylinder paste point nickel mesh Download PDFInfo
- Publication number
- CN201351180Y CN201351180Y CNU2009200372297U CN200920037229U CN201351180Y CN 201351180 Y CN201351180 Y CN 201351180Y CN U2009200372297 U CNU2009200372297 U CN U2009200372297U CN 200920037229 U CN200920037229 U CN 200920037229U CN 201351180 Y CN201351180 Y CN 201351180Y
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- China
- Prior art keywords
- mesh
- nickel
- mould device
- light
- copper layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an electroplating mould device of a rectangular cylinder paste point nickel mesh, which comprises shaft heads (1), a base pipe (2), a copper layer (3), a nickel layer (4) and light-sensitive glue mesh points (5). Two (left and right) shaft heads (1) are respectively arranged at the two ends of the base pipe (2), the copper layer (3) is compounded at the outer surface of the base pipe (2), and the nickel layer (4) is compounded at the outer surface of the copper layer (3); mesh-point type cavities (4.1) which are arranged in a radial manner are densely distributed at the outer surface of the nickel layer (4), and the light-sensitive glue mesh points (5) are embedded in the mesh-point type cavities (4.1). The electroplating mould device is characterized in that the arraying and distributing of the light-sensitive glue mesh points (5) at the outer surface of a mould present the shape of a rectangle. The electroplating mould device can produce the rectangular nickel mesh, so as to cater to the market demand for various flower types of different size. Moreover, the distribution of the light-sensitive glue mesh points is dense and uniform, the hole-opening rate of the produced nickel mesh is high, the hole opening is uniform, the flexibility and elasticity are good, and the light transmission is uniform; therefore, the electroplating mould device can effectively prevent the printing color difference, lead uniform wall thickness, and improve the printing quality.
Description
(1) technical field
The utility model relates to a kind of cylinder slurry point nickel screen production unit.Especially relate to a kind of rectangle cylinder slurry point nickel screen plating mould device.Belong to the textile manufacturing machine equipment technical field.
(2) background technology
A cylinder slurry point nickel screen is the master unit that textile printing and dyeing, non-woven fabrics slurry point, wallpaper manufacturer must be used.Present existing cylinder slurry point nickel screen plating mould, the photoresists site type of array that set on its surface is single, can not satisfy the diversified demand of nickel screen series product.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of rectangle cylinder slurry point nickel screen plating mould device that can satisfy nickel screen series product diversified demand is provided.
The purpose of this utility model is achieved in that a kind of rectangle cylinder slurry point nickel screen plating mould device, comprise spindle nose, parent tube, copper layer, nickel dam and photoresists site, described spindle nose has two, about each one, be installed on the two ends of parent tube, the copper layer is compound in the parent tube outside surface, nickel dam is compound in copper layer outside surface, the nickel dam outside surface is densely covered with the site die cavity that is provided with by radially, sets the photoresists site in the die cavity of site, is characterized in that the photoresists site is rectangle in the mold outer surface arranged.
The utility model can be produced the rectangle nickel screen, has catered to the market demand of various different size flower lap waste types.And the photoresists site is arranged intensive, even, the nickle mesh open percentage height of production, and perforate is even, toughness, good springiness, printing opacity is even, can effectively prevent the stamp aberration, and the wall thickness uniformity can improve printing quality.
(4) description of drawings
Fig. 1 is an overall structure synoptic diagram of the present utility model.
Fig. 2 is the I enlarged view of Fig. 1.
Fig. 3 is the II enlarged view of Fig. 1.
(5) embodiment
As Fig. 1~3, the utility model is a kind of rectangle cylinder slurry point nickel screen plating mould device.Mainly form by spindle nose 1, parent tube 2, copper layer 3, nickel dam 4 and photoresists site 5.Described spindle nose 1 has two, about each one, be installed on the two ends of parent tube 2 respectively, copper layer 3 is compound in parent tube 2 outside surfaces, nickel dam 4 closes in copper layer 3 outside surface, and nickel dam 4 outside surfaces are densely covered with the site die cavity 4.1 by radially roll forming, set photoresists site 5 in the site die cavity 4.1.Photoresists site 5 is rectangle in the mold outer surface arranged.
Claims (1)
1, a kind of rectangle cylinder slurry point nickel screen plating mould device, comprise spindle nose (1), parent tube (2), copper layer (3), nickel dam (4) and photoresists site (5), described spindle nose (1) has two, about each one, be installed on the two ends of parent tube (2) respectively, copper layer (3) is compound in parent tube (2) outside surface, nickel dam (4) is compound in copper layer (3) outside surface, nickel dam (4) outside surface is densely covered with the site die cavity (4.1) by radial arrangement, set photoresists site (5) in the site die cavity (4.1), it is characterized in that photoresists site (5) is rectangle in the mold outer surface arranged.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009200372297U CN201351180Y (en) | 2009-02-17 | 2009-02-17 | Electroplating mould device of rectangular cylinder paste point nickel mesh |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009200372297U CN201351180Y (en) | 2009-02-17 | 2009-02-17 | Electroplating mould device of rectangular cylinder paste point nickel mesh |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201351180Y true CN201351180Y (en) | 2009-11-25 |
Family
ID=41374566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2009200372297U Expired - Fee Related CN201351180Y (en) | 2009-02-17 | 2009-02-17 | Electroplating mould device of rectangular cylinder paste point nickel mesh |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201351180Y (en) |
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2009
- 2009-02-17 CN CNU2009200372297U patent/CN201351180Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091125 Termination date: 20130217 |