CN201333783Y - Improved structure of USB interface mold - Google Patents
Improved structure of USB interface mold Download PDFInfo
- Publication number
- CN201333783Y CN201333783Y CNU2009200009123U CN200920000912U CN201333783Y CN 201333783 Y CN201333783 Y CN 201333783Y CN U2009200009123 U CNU2009200009123 U CN U2009200009123U CN 200920000912 U CN200920000912 U CN 200920000912U CN 201333783 Y CN201333783 Y CN 201333783Y
- Authority
- CN
- China
- Prior art keywords
- usb interface
- mold
- model
- terminal
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an improved structure of a USB interface mold, which comprises a male mold, a female mold and a mold cavity. The mold cavity is arranged between the male mold and the female mold, and a terminal and a contact plate are fixedly arranged in the mold cavity. The improved structure of the USB interface mold is characterized in that the terminal and the contact plate are welded as a whole body, and the female mold is provided with a concave space which is used for holding the contact plate. The utility model can speed up the USB interface production, and greatly improve the yield.
Description
Technical field
The utility model relates to mould, relates in particular to a kind of USB interface die modifications structure.
Background technology
Existing USB interface production method is that the terminal that will have joining piece is placed in the die cavity, injects plastic cement then in die cavity, the heating injection mo(u)lding.Obtain the semi-finished product of USB interface after the hot briquetting, by manually-operated contact being packed into obtains the finished product USB interface in the groove of USB interface semi-finished product setting again.
This mould is produced USB interface need be divided into two steps, and the pin of the artificial contact of installing distance is not of uniform size, causes the signal bad connection, and yields is low.
The utility model content
The utility model provides a kind of USB interface die modifications structure at the above-mentioned defective of prior art, to improve the yields that USB interface is produced.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions:
A kind of USB interface die modifications structure comprises the die cavity between male model, master mold and male model and the master mold, and terminal and contact are fixed in the die cavity, and terminal and contact are welded as a whole, and the recessed space of ccontaining contact is set on the master mold.
As can be seen from the above technical solutions, the utility model is welded as a whole terminal and contact, and the recessed space of ccontaining contact is set on master mold, the sheet metal that welding is good is placed in the die cavity with the plastic cement injection mo(u)lding, is suitability for industrialized production because terminal adopts, and speed of production is fast, each PIN pin spacing equilibrium, the also just balanced unanimity of corresponding electric shock spacing, and terminal and contact be welded as a whole, and terminal and contact electrically contact well, and yields significantly improves.
Description of drawings
Fig. 1 is the utility model mould structure cutaway view;
Fig. 2 is the utility model finished product USB interface front view;
Fig. 3 is Fig. 2 left view;
Fig. 4 is terminal is connected one with contact a front view;
Fig. 5 is Fig. 4 left view.
The specific embodiment
Below in conjunction with the specific embodiment the utility model is described in further detail.
To shown in Figure 5, the utility model comprises male model 1, master mold 2 referring to Fig. 1, and the space between male model 1 and the master mold 2 forms die cavity 3, and terminal 4 and contact 5 fixed placement are in die cavity 3.Terminal 4 connects as one with contact 5, and master mold 2 is recessed, and this concave shape and contact 5 coincide.In die cavity 3, inject plastic cement, plastic cement and heat injection mo(u)lding together by the sheet metal that terminal 4 and contact 5 are linked to be and to obtain finished product usb 10.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (1)
1, a kind of USB interface die modifications structure comprises the die cavity between male model, master mold and male model and the master mold, and terminal and contact are fixed in the die cavity, it is characterized in that: terminal and contact are welded as a whole, and the recessed space of ccontaining contact is set on the master mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200009123U CN201333783Y (en) | 2009-01-19 | 2009-01-19 | Improved structure of USB interface mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200009123U CN201333783Y (en) | 2009-01-19 | 2009-01-19 | Improved structure of USB interface mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201333783Y true CN201333783Y (en) | 2009-10-28 |
Family
ID=41285425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009200009123U Expired - Fee Related CN201333783Y (en) | 2009-01-19 | 2009-01-19 | Improved structure of USB interface mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201333783Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922668A (en) * | 2012-11-01 | 2013-02-13 | 东莞劲胜精密组件股份有限公司 | Waterproof silica gel injection mold structure |
-
2009
- 2009-01-19 CN CNU2009200009123U patent/CN201333783Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922668A (en) * | 2012-11-01 | 2013-02-13 | 东莞劲胜精密组件股份有限公司 | Waterproof silica gel injection mold structure |
| CN102922668B (en) * | 2012-11-01 | 2015-05-13 | 东莞劲胜精密组件股份有限公司 | Waterproof silica gel injection mold structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20100220 |