CN201321701Y - Compound wood floor - Google Patents

Compound wood floor Download PDF

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Publication number
CN201321701Y
CN201321701Y CNU2008200515366U CN200820051536U CN201321701Y CN 201321701 Y CN201321701 Y CN 201321701Y CN U2008200515366 U CNU2008200515366 U CN U2008200515366U CN 200820051536 U CN200820051536 U CN 200820051536U CN 201321701 Y CN201321701 Y CN 201321701Y
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China
Prior art keywords
substrate
layer
wood floor
damp
surface layer
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Expired - Fee Related
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CNU2008200515366U
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Chinese (zh)
Inventor
涂登云
于学利
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Individual
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Individual
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Priority to CNU2008200515366U priority Critical patent/CN201321701Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a compound wood floor, which comprises a surface layer, a baseplate, a damp-proof layer and a mother groove. The compound wood floor is characterized in that the surface layer and the baseplate have the same grain direction and are glued into a whole; the damp-proof layer and the baseplate are glued into a whole; the mother groove is arranged on one side of the baseplate; the surface layer is a heat-treated wood plate layer; the damp-proof layer is an elastic material layer; and the elastic material layer can be attached to the mother groove. The compound wood floor of the utility model is paved without hitting keel (an earthworm) and nailing, and has the advantages of automatic leveling, convenient installation, free disassembly, reusability, low cost, environmental protection, good flexibility, silence, sound insulation, shock absorption, moisture prevention, insect prevention and the like.

Description

A kind of compoiste wood floor
Technical field
The utility model relates to a kind of wood flooring, particularly a kind of compoiste wood floor.
Background technology
Wooden floor is natural, environmental protection, noble graceful, use comfortablely, but price height, timber resources are in short supply, and not humidity, arch camber easily, distortion, cracking when using, not insect protected, install complicated, easy-maintaining not.Complex class floor in the market mostly is consolidated floor and solid wooden compound floor.The consolidated floor feel is poor, have that formaldehyde discharges, visual effect nature; But price is low, can utilize resourceful fast growing wood, and installation, maintenance is convenient, not yielding during use, cracking, easy to maintenance.Solid wooden compound floor is taken into account the advantage of wooden floor and consolidated floor simultaneously, it is substrate that present solid wooden compound floor adopts veneer, board structure is that crisscross mode is compound, and 7 layers, 9 layers of the numbers of plies could be used solid wooden compound floor to have and stablize indeformable characteristics.Present solid wooden compound floor is because the number of plies is many, and resin added is big, so formaldehyde release is also bigger.
The utility model content
At existing wooden floor price height, shortcoming such as humidity, burst size of methanal be not big, the purpose of this utility model is to provide a kind of compoiste wood floor with new function.
The utility model adopts following technical scheme in order to realize above-mentioned technical purpose:
A kind of compoiste wood floor of the present utility model, comprise surface layer, substrate, damp-proof course and female groove, it is characterized in that: described surface layer and described substrate are one with the grain direction gummed, described damp-proof course and described base plate bonding are one, described female groove is in substrate one side, described surface layer is heat treated plank layer, and described substrate is heat treated plank layer, and described damp-proof course is an elastomeric layer.
Female groove posts elastomeric layer.
Surface layer is a 120-260 ℃ of heat treated plank layer, can be in balsam wood beans, teak, heavy ant wood or the oak any one.The thickness of surface layer is 0.5-6mm.
Substrate is a 120-260 ℃ of heat treated plank layer.Can be for softwood substrate or fast growing wood substrate, as pinus sylvestris var. mongolica, larch, China fir, pine etc.Substrate thickness is 6-20mm.
The thickness of damp-proof course is 0.3-10mm.
Problems such as compared with prior art, the utility model has solved the solid wooden compound floor processed complex, and glue-line is easily peeled off, and burst size of methanal is big.The surface layer of a kind of compoiste wood floor of the present utility model is any one in face cream pigeonpea, teak, heavy ant wood or the oak that passes through high-temperature heat treatment; Because high-temperature heat treatment can make wood preservation from decay, anti-rotting, surface layer adopts the timber of high-temperature heat treatment, makes it have moisture resistance, thus with back side damp-proof course symmetry.Substrate is for through heat treated cheap softwood or fast growing wood, solves the stability of substrate by high-temperature heat treatment, has at wet condition not expand, do not shrink at drying condition, can make the floor to have to stablize indeformable, insect protected, anti-function such as rot.Damp-proof course is as the back side, its material moisture, sound insulation, damping, has elasticity.Adopt environmental-protection type adhesive that surface layer timber and damp-proof course and substrate timber are glued together with grain direction.Female groove of wood flooring posts elastomeric layer, and the damp-proof course at the back side adopts elasticity, sound insulation, barrier material, can make the floor have functions such as protection against the tide, good springiness, quiet, sound insulation, damping.Need not to beat keel (earthworm) so a kind of compoiste wood floor of the present utility model has to mat formation, need not ailing, can Automatic Levelling, easy for installation, freely dismantle, reusable, price is low; Also have advantages such as environmental protection, good springiness, quiet, sound insulation, damping, protection against the tide, insect protected simultaneously.
Description of drawings
Fig. 1 is the structural representation of first preferred embodiment of a kind of compoiste wood floor of the present utility model;
Fig. 2 is the structural representation of second preferred embodiment of a kind of compoiste wood floor of the present utility model;
Fig. 3 is the structural representation of the 3rd preferred embodiment of a kind of compoiste wood floor of the present utility model.
The specific embodiment
Referring to Fig. 1, the structure of first preferred embodiment of a kind of compoiste wood floor of the present utility model comprises surface layer 1, substrate 2 and damp-proof course 3.Surface layer 1 is one with substrate 2 with the grain direction gummed, and damp-proof course 3 is one with substrate 1 gummed.Damp-proof course 3 is one with substrate 2 gummeds, and surface layer 1 is heat treated plank layer, and substrate 2 is heat treated plank layer, and damp-proof course 3 is an elastomeric layer.Female groove 4 is in a side of substrate 2.
Surface layer 1 is any one timber in 200 ℃ of heat treated face cream pigeonpeas, teak, heavy ant wood or the oak, and thickness is 1mm.Substrate 2 is 210 ℃ of heat treated softwood substrates.Substrate 2 thickness are 15mm.Damp-proof course 3 thickness are 2mm.
Referring to Fig. 2, the structure of second preferred embodiment of a kind of compoiste wood floor of the present utility model comprises surface layer 1, substrate 2 and damp-proof course 3.Surface layer 1 is one with substrate 2 with the grain direction gummed, and damp-proof course 3 is one with substrate 1 gummed.Damp-proof course 3 is one with substrate 2 gummeds, and surface layer 1 is heat treated plank layer, and substrate 2 is heat treated plank layer, and damp-proof course 3 is an elastomeric layer.Female groove 4 posts elastomeric layer in a side of substrate 2 around female groove 4.
Surface layer 1 is heat-treated at 120 ℃, adopts teak, and its thickness is 0.5mm.Substrate 2 is heat-treated at 120 ℃, adopts the fast growing wood substrate, and thickness is 20mm.Damp-proof course thickness is 0.3mm.
Fig. 3 comprises surface layer 1, substrate 2 and damp-proof course 3 for the structure of the 3rd preferred embodiment of a kind of compoiste wood floor of the present utility model.Surface layer 1 is one with substrate 2 with the grain direction gummed, and damp-proof course 3 is one with substrate 1 gummed.Damp-proof course 3 is one with substrate 2 gummeds, and surface layer 1 is heat treated plank layer, and substrate 2 is heat treated plank layer, and damp-proof course 3 is an elastomeric layer.Female groove 4 is in a side of substrate 2, and the side of having only of female groove 4 is posted elastomeric layer.
Surface layer 1 is heat-treated under 260 ℃, adopts heavy ant wood, also can adopt oak, and thickness is 6mm.Substrate 2 is heat-treated under 260 ℃, adopts the softwood substrate, and thickness is 6mm.Damp-proof course thickness is 6mm.
Above disclosed only is the preferred embodiment of a kind of compoiste wood floor of the utility model, certainly can not limit interest field of the present utility model with this, therefore the equivalent variations of being done according to the utility model claim still belongs to the scope that the utility model is contained.

Claims (9)

1, a kind of compoiste wood floor, comprise surface layer, substrate, damp-proof course and female groove, it is characterized in that: described surface layer and described substrate are one with the grain direction gummed, described damp-proof course and described base plate bonding are one, described female groove is in a side of described substrate, described surface layer is heat treated plank layer, and described substrate is heat treated plank layer, and described damp-proof course is an elastomeric layer.
2, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described female groove posts elastomeric layer.
3, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described surface layer is a 120-260 ℃ of heat treated plank layer.
4, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described surface layer is any one in face cream pigeonpea, teak, heavy ant wood or the oak.
5, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described surface thickness is 0.5-6mm.
6, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described substrate is a 120-260 ℃ of heat treated plank layer.
7, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described substrate is softwood substrate or fast growing wood substrate.
8, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described substrate thickness is 6-20mm.
9, a kind of compoiste wood floor as claimed in claim 1 is characterized in that, described damp-proof course thickness is 0.3-10mm.
CNU2008200515366U 2008-07-30 2008-07-30 Compound wood floor Expired - Fee Related CN201321701Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200515366U CN201321701Y (en) 2008-07-30 2008-07-30 Compound wood floor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200515366U CN201321701Y (en) 2008-07-30 2008-07-30 Compound wood floor

Publications (1)

Publication Number Publication Date
CN201321701Y true CN201321701Y (en) 2009-10-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200515366U Expired - Fee Related CN201321701Y (en) 2008-07-30 2008-07-30 Compound wood floor

Country Status (1)

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CN (1) CN201321701Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101914985A (en) * 2010-08-09 2010-12-15 庄启程 Novel low-carbon floor
CN104153527A (en) * 2014-08-19 2014-11-19 浙江红利富实木业有限公司 Moisture-proof wood floor
CN108590089A (en) * 2018-05-03 2018-09-28 浙江粤强家具科技有限公司 Moisture-proof sound insulation solid wooden floor board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101914985A (en) * 2010-08-09 2010-12-15 庄启程 Novel low-carbon floor
CN104153527A (en) * 2014-08-19 2014-11-19 浙江红利富实木业有限公司 Moisture-proof wood floor
CN108590089A (en) * 2018-05-03 2018-09-28 浙江粤强家具科技有限公司 Moisture-proof sound insulation solid wooden floor board

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091007

Termination date: 20110730