CN201308993Y - Case powder injection forming mold of signal isolator - Google Patents
Case powder injection forming mold of signal isolator Download PDFInfo
- Publication number
- CN201308993Y CN201308993Y CNU2008202165418U CN200820216541U CN201308993Y CN 201308993 Y CN201308993 Y CN 201308993Y CN U2008202165418 U CNU2008202165418 U CN U2008202165418U CN 200820216541 U CN200820216541 U CN 200820216541U CN 201308993 Y CN201308993 Y CN 201308993Y
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- injection
- die cavity
- dynamic model
- runner
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
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Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202165418U CN201308993Y (en) | 2008-11-10 | 2008-11-10 | Case powder injection forming mold of signal isolator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNU2008202165418U CN201308993Y (en) | 2008-11-10 | 2008-11-10 | Case powder injection forming mold of signal isolator |
Publications (1)
Publication Number | Publication Date |
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CN201308993Y true CN201308993Y (en) | 2009-09-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU2008202165418U Expired - Fee Related CN201308993Y (en) | 2008-11-10 | 2008-11-10 | Case powder injection forming mold of signal isolator |
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CN (1) | CN201308993Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103357879A (en) * | 2012-03-29 | 2013-10-23 | 精工爱普生株式会社 | Forming die for metal powder injection formation |
CN103357871A (en) * | 2012-03-29 | 2013-10-23 | 精工爱普生株式会社 | Forming die for metal powder injection formation |
CN109014212A (en) * | 2018-08-15 | 2018-12-18 | 上海精科粉末冶金科技有限公司 | A kind of processing method of metal injection molding technology production 5G communication isolator |
-
2008
- 2008-11-10 CN CNU2008202165418U patent/CN201308993Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103357879A (en) * | 2012-03-29 | 2013-10-23 | 精工爱普生株式会社 | Forming die for metal powder injection formation |
CN103357871A (en) * | 2012-03-29 | 2013-10-23 | 精工爱普生株式会社 | Forming die for metal powder injection formation |
CN103357879B (en) * | 2012-03-29 | 2016-06-08 | 精工爱普生株式会社 | Metal powder injection molded shaping dies |
CN103357871B (en) * | 2012-03-29 | 2016-08-10 | 精工爱普生株式会社 | Metal powder injection molded shaping dies |
TWI611898B (en) * | 2012-03-29 | 2018-01-21 | Seiko Epson Corp | Forming mold for metal powder injection molding |
CN109014212A (en) * | 2018-08-15 | 2018-12-18 | 上海精科粉末冶金科技有限公司 | A kind of processing method of metal injection molding technology production 5G communication isolator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Changzhou Gian Technology Co., Ltd. Assignor: Wang Mingxi Contract record no.: 2010320000531 Denomination of utility model: Case powder injection forming mold of signal isolator Granted publication date: 20090916 License type: Exclusive License Record date: 20100506 |
|
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 213023, Hexi Road, Changzhou Economic Development Zone, Jiangsu, China, No. 16-8, Hexi Road Patentee after: Wang Mingxi Address before: 213023 Jiangsu province Changzhou City Zhonglou District Xinggang Road No. 65-8 Patentee before: Wang Mingxi |
|
ASS | Succession or assignment of patent right |
Owner name: CHANGZHOU GIAN TECHNOLOGY CO., LTD. Effective date: 20120504 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120504 Address after: 213023, Hexi Road, Changzhou Economic Development Zone, Jiangsu, China, No. 16-8, Hexi Road Patentee after: Changzhou Gian Technology Co., Ltd. Address before: 213023, Hexi Road, Changzhou Economic Development Zone, Jiangsu, China, No. 16-8, Hexi Road Patentee before: Wang Mingxi |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090916 Termination date: 20151110 |
|
EXPY | Termination of patent right or utility model |