CN201289747Y

CN201289747Y - Device for mounting wafer of mobile memory

Info

Publication number: CN201289747Y
Application number: CNU2008202032295U
Authority: CN
Inventors: 黄朝琮
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-11-11
Filing date: 2008-11-11
Publication date: 2009-08-12
Anticipated expiration: 2018-11-11

Abstract

The utility model relates to the technical field of mobile memory, particularly to a wafer installation device of a mobile memory. The wafer installation device comprises an insulation base which is connected on a circuit board in a dismountable way; an accommodating chamber for placing wafers is arranged on the insulation base; a through hole matching with the pins of the wafers is formed at the bottom of the insulation base; and the pins of the wafers pass through the through hole and are in close contact with a conductive connecting part on the circuit board. Wafers can be installed only by fixedly installing the insulation base on the circuit board so as to correspond the through hole on the insulation base and the conductive connecting part on the circuit board with each other; and placing the wafers inside the accommodating chamber, so as to allow the pins of the wafers to pass through the through hole and be in close contact with the conductive connecting part on the circuit board, thereby conduct the wafers and the circuit board. By using the wafer installation device, the wafers can be quickly installed on the circuit board, furthermore, welding is not required in the entire installation process, multiple wafers can be installed at any moment by the wafer installation device, and the use is convenient.

Description

The wafer erecting device of mobile memory

Technical field:

The utility model relates to the mobile memory technical field, particularly the wafer erecting device of mobile memory.

Background technology:

Along with the fast development of computer technology, the computer peripheral product is also grown up by drive.Mobile memory such as USB flash disk, portable hard drive is used widely owing to memory capacity is big, easy to use.Existing mobile memory includes circuit board and the wafer that is welded on the circuit board, the memory capacity of mobile memory is determined by wafer, mobile memory than large storage capacity need be installed a plurality of wafers, wafer is provided with pin, producer just directly is welded on the pin of wafer on the interface of circuit board reservation in process of production, making wafer be fixed on the circuit board and with circuit board is electrically connected, welding process is complicated, and the welding difficulty of wafer is very high, mobile memory just can't increase wafer voluntarily once producing the back, when needing to increase the memory capacity of mobile memory, can only realize by the mobile memory that more renews, so just cause the wasting of resources.

The utility model content:

The purpose of this utility model is to provide a kind of wafer erecting device that can conveniently wafer be installed in the mobile memory on the circuit board at the deficiencies in the prior art.

For achieving the above object, the utility model adopts following technical scheme:

The wafer erecting device of mobile memory, it includes the insulating base that is detachably connected on the circuit board, described insulating base is provided with the container cavity that is used to place wafer, the bottom of insulating base is provided with the through hole that cooperates with the pin of wafer, and the pin of wafer passes through hole and closely contacts with conductive connection part on the circuit board.

The bottom of described insulating base is provided with and is used for insulating base is fixed on fixture on the circuit board.

Described fixture is reference column or spear type pin.

Flexibly connect the lid that is useful on the tight container cavity of lid on the described insulating base.

The connected mode of described lid and insulating base is hinged.

The utility model beneficial effect is: the utility model includes the insulating base that is detachably connected on the circuit board, described insulating base is provided with the container cavity that is used to place wafer, the bottom of insulating base is provided with the through hole that cooperates with the pin of wafer, the pin of wafer passes through hole and closely contacts with conductive connection part on the circuit board, insulating base of the present utility model and circuit board removably connect, make things convenient for the fixing or partition of wafer erecting device and circuit board, during use, only need insulating base is fixedly mounted on the circuit board, through hole on the insulating base and the conductive connection part on the circuit board are mapped, again wafer is placed in the container cavity, making the pin of wafer pass through hole closely contacts with conductive connection part on the circuit board, thereby with wafer and circuit board conducting, promptly finish the installation process of wafer, wafer can be quick installed on the circuit board by the wafer erecting device, do not need welding in the whole erection process, can by the wafer erecting device a plurality of wafers be installed at any time as required, easy to use, after the memory capacity that increases mobile memory, mobile memory originally still can be utilized, and can not cause the wasting of resources.

Description of drawings:

Fig. 1 is a structural representation of the present utility model;

Fig. 2 is a decomposing schematic representation of the present utility model;

Fig. 3 is the structural representation of the utility model insulating base;

Fig. 4 is user mode figure of the present utility model.

Embodiment:

Below in conjunction with accompanying drawing the utility model is further described, see Fig. 1～4, wafer 2 erecting devices of mobile memory, it includes the insulating base 1 that is detachably connected on the circuit board 4, described insulating base 1 is provided with the container cavity 11 that is used to place wafer 2, the bottom of insulating base 1 is provided with the through hole 12 that cooperates with the pin 21 of wafer 2, the pin 21 of wafer 2 passes through hole 12 and closely contacts with conductive connection part on the circuit board 4, wherein, the conductive connection part on the circuit board 4 can be gold-plated conductive contact blade electrical connectors such as (claiming golden finger again).

The bottom of insulating base 1 is provided with and is used for insulating base 1 is fixed on fixture 13 on the circuit board 4, described fixture 13 is a reference column, it matches with pilot hole on being opened in circuit board 4, insulating base 1 stably can be fixed on the circuit board 4, certainly, described fixture 13 can also be other fixtures 13 such as spear type pin, as long as it can stably be fixed on insulating base 1 on the circuit board 4.

Flexibly connect the lid 3 that is useful on the tight container cavity 11 of lid on the insulating base 1, lid 3 is used for wafer 2 is fastened on container cavity 11, lid 3 is hinged with the connected mode of insulating base 1, and lid 3 also can be other movable connection methods such as snapping with the connected mode of insulating base 1.When settling wafer 2, after lid 3 opened wafer 2 is put into container cavity 11, also can be on insulating base 1 side, to offer the slot (not shown) that communicates with container cavity 11 in addition, wafer 2 slot is from the side advanced in the container cavity 11, press down wafer 2 then, make the pin 21 of wafer 2 pass through hole 12 and contact with the conductive connection part of circuit board 4.

Insulating base 1 of the present utility model removably connects with circuit board 4, make things convenient for the fixing or partition of wafer 2 erecting devices and circuit board 4, during use, only need insulating base 1 is fixedly mounted on the circuit board 4, through hole 12 on the insulating base 1 is mapped with conductive connection part on the circuit board 4, again wafer 2 is placed in the container cavity 11, making the pin 21 of wafer 2 pass through hole 12 closely contacts with conductive connection part on the circuit board 4, thereby with wafer 2 and circuit board 4 conductings, promptly finish the installation process of wafer 2, wafer 2 can be quick installed on the circuit board 4 by wafer 2 erecting devices, do not need welding in the whole erection process, can by wafer 2 erecting devices a plurality of wafers 2 be installed at any time as required, easy to use; People can also buy the mobile memory that is reserved with the interface corresponding with wafer 2 erecting devices earlier, and then by wafer 2 erecting devices wafer 2 is installed voluntarily as required, after the memory capacity that increases mobile memory, mobile memory originally still can be utilized, and can not cause the wasting of resources.

The above only is a better embodiment of the present utility model, so all equivalences of doing according to the described structure of the utility model patent claim, feature and principle change or modify, is included in the utility model patent claim.

Claims

1, the wafer of mobile memory (2) erecting device, it is characterized in that: it includes the insulating base (1) that is detachably connected on the circuit board (4), described insulating base (1) is provided with the container cavity (11) that is used to place wafer (2), the bottom of insulating base (1) is provided with the through hole (12) that cooperates with the pin (21) of wafer (2), and the pin (21) of wafer (2) passes through hole (12) and closely contacts with conductive connection part on the circuit board (4).

2, the wafer of mobile memory according to claim 1 (2) erecting device is characterized in that: the bottom of described insulating base (1) is provided with and is used for insulating base (1) is fixed on fixture (13) on the circuit board (4).

3, the wafer of mobile memory according to claim 2 (2) erecting device is characterized in that: described fixture (13) is a reference column.

4, the wafer of mobile memory according to claim 2 (2) erecting device is characterized in that: described fixture (13) is the spear type pin.

5, the wafer of mobile memory according to claim 2 (2) erecting device is characterized in that: described insulating base (1) is gone up and is flexibly connected the lid (3) that is useful on the tight container cavity of lid (11).

6, the wafer of mobile memory according to claim 5 (2) erecting device is characterized in that: described lid (3) is hinged with the connected mode of insulating base (1).