CN201282134Y - Mechanical arm for transferring silicon wafer and plug-in sheet component for the same - Google Patents

Mechanical arm for transferring silicon wafer and plug-in sheet component for the same Download PDF

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Publication number
CN201282134Y
CN201282134Y CNU2008201101673U CN200820110167U CN201282134Y CN 201282134 Y CN201282134 Y CN 201282134Y CN U2008201101673 U CNU2008201101673 U CN U2008201101673U CN 200820110167 U CN200820110167 U CN 200820110167U CN 201282134 Y CN201282134 Y CN 201282134Y
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China
Prior art keywords
end positioning
positioning table
inserted sheet
mechanical arm
wafer
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Expired - Lifetime
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CNU2008201101673U
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Chinese (zh)
Inventor
万川
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Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Beijing Corp
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Priority to CNU2008201101673U priority Critical patent/CN201282134Y/en
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Publication of CN201282134Y publication Critical patent/CN201282134Y/en
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model discloses a mechanical arm for conveying a wafer. In the utility model, the single point fixation manner between a front end positioning station and an inset piece in the mechanical arm is changed into a two-point fixation manner, so that the rotary shift of the front end positioning station caused by the hit to the limit lug boss of the front end positioning station by the wafer can be avoided, and the change in partial shape and size in the circular limit area can be avoided, and further, the impact and the shattering of the wafer caused by sliding in the circular limit area are avoided. The utility model further discloses an insert piece component used in the mechanical arm for conveying wafer.

Description

Be used for transmitting the mechanical arm of wafer and the inserted sheet assembly of this mechanical arm
Technical field
The utility model relates to mechanical installing area, particularly a kind ofly is used for transmitting the mechanical arm (ARM) of wafer (Wafer) and a kind of inserted sheet assembly of this mechanical arm.
Background technology
In semiconductor fabrication processes, wafer need be transmitted between each process procedure, and the transmission of wafer is all finished by a kind of mechanical arm usually.
Fig. 1 is the existing mechanical arm schematic perspective view that is used to transmit wafer.As shown in Figure 1, this mechanical arm comprises: arm body 10 and lift shaft 20.
Arm body 10 is installed on lift shaft 20, can move up and down along the axis of lift shaft 20 and can be around lift shaft 20 rotation.
Arm body 10 comprises the inserted sheet 11 and the slide rail 12 of U type again, and inserted sheet 11 is used to place wafer, and can move forward and backward along slide rail 12.
Like this, the wafer that is positioned over inserted sheet 11 can have a plurality of degrees of freedom of translation up and down, front and back translation and left rotation and right rotation, thereby can be convenient to the transmission on all directions.
In mechanical arm as shown in Figure 1, the front end of two bifurcateds of U type inserted sheet 11 is separately installed with a front end positioning table (Tip Guider) 13, the rear end then is equipped with a rear end positioning table (RearGuider) 14.The edge of wafer 100 lower surfaces contacts with two front end positioning tables 13 and a rear end positioning table 14 simultaneously, referring to Fig. 2 (because front end positioning table 13 is blocked by another, thereby described another front end positioning table 13 only is shown among Fig. 2), thus steadily be positioned on the inserted sheet 11.
Wherein, each front end positioning table 13 is installed on the front end of inserted sheet 11,14 rear ends that are installed on inserted sheet 11 by a plurality of bolts of rear end positioning table by a bolt.
In addition, two front end positioning tables 13 and a rear end positioning table 14 not only constitute supported at three point to the edge of wafer 100, also need to prevent wafer 100 landing in transport process.Therefore, still referring to Fig. 2, the outside of front end positioning table 13 and rear end positioning table 14 all has positive stop lug boss 15, and this positive stop lug boss 15 exceeds the plane that front end positioning table 13 and rear end positioning table 14 contact with wafer.
Like this, if wafer 100 slides towards any direction in transport process, then its edge can impinge upon positive stop lug boss 15 sidewalls of front end positioning table 13 and/or rear end positioning table 14, thereby in the plane that is parallel to inserted sheet 11, just wafer 100 is limited in the circular stop zone that is complementary with its geomery, makes it can't landing.For example, wafer is the circle of diameter 200mm, then the zone that is complementary with the crystal round fringes geomery can be the circular stop zone of diameter 300.4mm, promptly, between wafer 100 and positive stop lug boss 15 sidewalls, still keep certain clearance in order to avoid wafer 100 to be subjected to the extruding of positive stop lug boss 15 sidewalls.
Yet but there is following problem in said structure:
Referring to Fig. 3 a and Fig. 3 b, front end positioning table 13 is installed on inserted sheet 11 by a bolt 16, promptly adopts the single-point fixed form between front end positioning table 13 and the inserted sheet 11.Owing to have certain clearance between wafer and positive stop lug boss 15 sidewalls, if thereby wafer clashes into positive stop lug boss 15 sidewalls of front end positioning table 13 repeatedly owing to slide in transport process, then might make front end positioning table 13 around the axis rotation of bolt 16 and the occurrence positions skew.
Thus one, localized variation will take place the shape of circular stop zone or circular stop zone stretches out in the part, thereby increased the gap between crystal round fringes and each positive stop lug boss.Though wafer can landing in transport process, it can slide in circular stop zone, and can be with the sidewall of bigger momentum bump positive stop lug boss, thereby very easy fragmentation.
As seen, the existing mechanical arm that is used to transmit wafer causes the fragmentation of wafer in transport process easily, thereby the reliability that makes wafer transmit is not high.
The utility model content
In view of this, the utility model provides a kind of be used for the transmitting mechanical arm of wafer and a kind of inserted sheet assembly of this mechanical arm, can improve the reliability that wafer transmits.
A kind of mechanical arm that is used to transmit wafer that the utility model provides, this mechanical arm has the inserted sheet of U type, and the front end of two bifurcateds of described U type inserted sheet is separately installed with a front end positioning table that is used for supporting wafer, wherein,
Each front end positioning table passes through a bolt in described U type inserted sheet;
The lower surface of each front end positioning table has a groove;
Each bifurcated front end upper surface of described U type inserted sheet has a gim peg respectively;
The described groove of each front end positioning table is socketed on described gim peg.
Described gim peg is connected in described bifurcated front end upper surface.
The material of described gim peg is pottery or plastics.
Described groove and described gim peg interference fit.
The utility model provides a kind of inserted sheet assembly that is used for transmitting the mechanical arm of wafer comprises the inserted sheet body of U type, and the front end of two bifurcateds of described U type inserted sheet body is separately installed with a front end positioning table that is used for supporting wafer, wherein,
Each front end positioning table passes through a bolt in described U type inserted sheet;
The lower surface of each front end positioning table has a groove;
Each bifurcated front end upper surface of described U type inserted sheet body has a gim peg respectively;
The described groove of each front end positioning table is socketed on described gim peg.
Described gim peg is connected in described bifurcated front end upper surface.
The material of described gim peg is pottery or plastics.
Described groove and described gim peg interference fit.
As seen from the above technical solution, the utility model changes front end positioning table in the mechanical arm and the single-point fixed form between the inserted sheet into 2 fixed forms, to avoid the front end positioning table owing to its positive stop lug boss is rotated skew by bumped wafer, thereby avoid the local shape of circular stop zone and size to change, and then it is broken to avoid wafer to clash into owing to sliding in circular stop zone.
Description of drawings
Fig. 1 is the existing mechanical arm schematic perspective view that is used to transmit wafer.
Fig. 2 is the schematic diagram of front end positioning table and rear end positioning table supporting wafer in the existing machinery arm.
Fig. 3 a is the mounting structure cutaway view of front end positioning table in the existing machinery arm.
Fig. 3 b is the mounting structure upward view of front end positioning table in the existing machinery arm.
Fig. 4 a is the mounting structure decomposing schematic representation of front end positioning table in the mechanical arm of the present utility model.
Fig. 4 b is the mounting structure cutaway view of front end positioning table in the mechanical arm of the present utility model.
Fig. 4 c is the mounting structure upward view of front end positioning table in the mechanical arm of the present utility model.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
In the utility model, change the single-point fixed form between front end positioning table and the inserted sheet into 2 fixed forms, to avoid the front end positioning table owing to its positive stop lug boss is rotated skew by bumped wafer, thereby avoid the local shape of circular stop zone and size to change, and then it is broken to avoid wafer to clash into owing to sliding in circular stop zone.
Fig. 4 a is the mounting structure decomposing schematic representation of front end positioning table in the mechanical arm of the present utility model.Shown in Fig. 4 a, in the utility model, the lower surface of front end positioning table 13 has a groove 31, and groove 31 can be positioned at any direction (shown in Fig. 4 a is that groove 31 is positioned at screwed hole 17 rears) of the screwed hole 17 that is used for construction bolt 16, and and screwed hole 17 between have certain distance.
Correspondingly, the upper surface of the front end of 11 two bifurcateds of inserted sheet of U type difference clamping one gim peg 32.Certainly, in the practical application, also gim peg 32 can be adhered to the upper surface of front end.
In the practical application, inserted sheet 11 is generally ceramic material, therefore, in order to reduce the friction of gim peg 32 and inserted sheet 11 as far as possible, preferably, selecting the material of gim peg 32 for the situation of clamping is pottery or plastics, but by contrast, select plastics as the easier processing of the material of gim peg 32.
Fig. 4 b is the mounting structure cutaway view of front end positioning table in the mechanical arm of the present utility model.Fig. 4 c is the mounting structure upward view of front end positioning table in the mechanical arm of the present utility model.Shown in Fig. 4 b and Fig. 4 c, the groove 31 of each front end positioning table 13 lower surface is socketed on corresponding gim peg 32, and simultaneously, bolt 16 passes and is installed on the screwed hole 17 of front end positioning table 13 from the lower surface of inserted sheet 11.
Wherein, groove 31 is identical with the cross sectional shape of gim peg 32, for example circular, rectangle.Preferably, and the area of section of groove 31 is slightly less than gim peg 32, so that gim peg 32 and groove 31 interference fit.
Like this, just realized that the single-point fixed form between front end positioning table and the inserted sheet changes 2 fixed forms into.
Referring to Fig. 4 b, if wafer clashes into positive stop lug boss 15 sidewalls of front end positioning table 13 repeatedly in transport process, then because front end positioning table 13 is installed on inserted sheet 11 by bolt 16 and gim peg 32, thereby can be around the axis rotation skew of bolt 16.
Thus one, localized variation can not take place in the shape of circular stop zone, circular stop zone can not stretch out in the part yet, guaranteed that the gap between crystal round fringes and each positive stop lug boss can not increase, thereby wafer neither can landing in transport process, can in circular stop zone, not slide yet, thus can fragmentation with the sidewall of bigger momentum bump positive stop lug boss.
The above is preferred embodiment of the present utility model only, is not to be used to limit protection range of the present utility model.All within spirit of the present utility model and principle, any modification of being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims (8)

1, a kind of mechanical arm that is used to transmit wafer, this mechanical arm has the inserted sheet of U type, and the front end of two bifurcateds of described U type inserted sheet is separately installed with a front end positioning table that is used for supporting wafer, wherein,
Each front end positioning table passes through a bolt in described U type inserted sheet;
It is characterized in that,
The lower surface of each front end positioning table has a groove;
Each bifurcated front end upper surface of described U type inserted sheet has a gim peg respectively;
The described groove of each front end positioning table is socketed on described gim peg.
2, mechanical arm as claimed in claim 1 is characterized in that, described gim peg is connected in described bifurcated front end upper surface.
3, mechanical arm as claimed in claim 2 is characterized in that, the material of described gim peg is pottery or plastics.
4, as any described mechanical arm in the claim 1 to 3, it is characterized in that described groove and described gim peg interference fit.
5, a kind of inserted sheet assembly that is used for transmitting the mechanical arm of wafer comprises the inserted sheet body of U type, and the front end of two bifurcateds of described U type inserted sheet body is separately installed with a front end positioning table that is used for supporting wafer, wherein,
Each front end positioning table passes through a bolt in described U type inserted sheet;
It is characterized in that,
The lower surface of each front end positioning table has a groove;
Each bifurcated front end upper surface of described U type inserted sheet body has a gim peg respectively;
The described groove of each front end positioning table is socketed on described gim peg.
6, inserted sheet assembly as claimed in claim 5 is characterized in that, described gim peg is connected in described bifurcated front end upper surface.
7, inserted sheet assembly as claimed in claim 6 is characterized in that, the material of described gim peg is pottery or plastics.
8, as any described inserted sheet assembly in the claim 5 to 7, it is characterized in that described groove and described gim peg interference fit.
CNU2008201101673U 2008-09-09 2008-09-09 Mechanical arm for transferring silicon wafer and plug-in sheet component for the same Expired - Lifetime CN201282134Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201101673U CN201282134Y (en) 2008-09-09 2008-09-09 Mechanical arm for transferring silicon wafer and plug-in sheet component for the same

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Application Number Priority Date Filing Date Title
CNU2008201101673U CN201282134Y (en) 2008-09-09 2008-09-09 Mechanical arm for transferring silicon wafer and plug-in sheet component for the same

Publications (1)

Publication Number Publication Date
CN201282134Y true CN201282134Y (en) 2009-07-29

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367213A (en) * 2012-03-26 2013-10-23 上海宏力半导体制造有限公司 Hot plate and device and method for automatic positioning of hot plate wafer
CN111319047A (en) * 2018-12-13 2020-06-23 上海新昇半导体科技有限公司 Wafer clamping manipulator arm assembly
CN111681982A (en) * 2020-06-18 2020-09-18 芯米(厦门)半导体设备有限公司 Wafer transfer device and photoresist coating and developing equipment with same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367213A (en) * 2012-03-26 2013-10-23 上海宏力半导体制造有限公司 Hot plate and device and method for automatic positioning of hot plate wafer
CN103367213B (en) * 2012-03-26 2016-06-29 上海华虹宏力半导体制造有限公司 A kind of hot plate and for the wafer self locating device of this hot plate and method
CN111319047A (en) * 2018-12-13 2020-06-23 上海新昇半导体科技有限公司 Wafer clamping manipulator arm assembly
CN111681982A (en) * 2020-06-18 2020-09-18 芯米(厦门)半导体设备有限公司 Wafer transfer device and photoresist coating and developing equipment with same

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Granted publication date: 20090729