CN201281735Y - Test device for semiconductor refrigeration component - Google Patents
Test device for semiconductor refrigeration component Download PDFInfo
- Publication number
- CN201281735Y CN201281735Y CNU2008202025643U CN200820202564U CN201281735Y CN 201281735 Y CN201281735 Y CN 201281735Y CN U2008202025643 U CNU2008202025643 U CN U2008202025643U CN 200820202564 U CN200820202564 U CN 200820202564U CN 201281735 Y CN201281735 Y CN 201281735Y
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- CN
- China
- Prior art keywords
- test
- semiconductor refrigerating
- refrigerating assembly
- water
- auxiliary reclay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Devices That Are Associated With Refrigeration Equipment (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a tester for a semiconductor cooling component, which comprises a test chamber, a water temperature regulation system, the semiconductor cooling component, a test controller, wherein, the test chamber accommodates water internally, the water temperature regulation system regulates the temperature of the water in the test chamber, the semiconductor cooling component is arranged inside the test chamber, and the test controller is connected with the water temperature regulation system and the semiconductor cooling component; the semiconductor cooling component is controlled within a temperature range by the water temperature regulation system; the test controller performs polarity switching, electrifying and electricity-failure cycle control on the semiconductor cooling component; and a computer tester is utilized to check test results. The utility model has the advantages of high reliability and accurate test results.
Description
Technical field
The utility model relates to a kind of test unit of semiconductor refrigerating assembly, more particularly relates to the test unit of the main electrical component of semiconductor freezer.
Background technology
For the semiconductor freezer household appliances, the fail-test of carrying out key components and parts is necessary.Whether test findings effectively depends on 3 aspects: the correctness of test method (the emulation degree determining method of many characteristics stress).The availability of research technique (automaticity of many characteristics stress, simulation precision decision research technique).The advanced degree of experimental technique (control device programmability, the automaticity of experimental observation, record).Common research technique has two kinds, and the one, adopt the semiconductor freezer overall test; The 2nd, directly carry out simulation test with semiconductor refrigerating assembly.
Semiconductor freezer overall test analog subscriber operating position, continuous refrigeration or pyrogenicity in particular environment rely on process of the test observed temperature power to judge the machine performance situation of change; The qualifications of hot-face temperature when testing for semiconductor refrigerating assembly≤80 ℃ is then protected by temperature limiter.Do not possess electric refrigeration, electric pyrogenicity alternation durability test, electrical endurance durability test condition:
1) the frequent in the short period of time change electric power polarity of semiconductor refrigerating assembly can make the temperature limiter on the heating radiator usually be in the overtemperature prote state, influences test effect.
2) with bigger heating radiator, hot-face temperature influences test effect equally less than 80 ℃.
3) semiconductor refrigerating assembly factory requires: under running parameter, the temperature in hot junction must be lower than 80 ℃, (contain change direction of current cold junction and become the hot junction).Otherwise, very easily cause device short circuit or disconnected cable that refrigerator is scrapped because hot-side temperature is too high.
The utility model content
At the shortcoming of prior art, the purpose of this utility model provides a kind of reliability height, the test findings test unit of semiconductor refrigerating assembly accurately.
For achieving the above object, the technical solution of the utility model is: a kind of test unit of semiconductor refrigerating assembly, the water test container is housed in comprising, the water temperature regulate and control system that the temperature of test chamber water is regulated and control, place the semiconductor refrigerating assembly in the test chamber, the test controller that is connected with water temperature regulate and control system and semiconductor refrigerating assembly, semiconductor refrigerating assembly during the water temperature regulate and control system will test is controlled in the temperature range, test controller carries out polarity to semiconductor refrigerating assembly and switches, energising and outage cycle control, and utilize an instrument with electronic brain to detect test findings.
This test controller comprises power supply, pulse signal source and auxiliary reclay, the positive pole of power supply is connected to the positive pole of semiconductor refrigerating assembly by the normally opened contact of an auxiliary reclay, the negative pole of semiconductor refrigerating assembly is connected to power cathode respectively and the normally opened contact by another auxiliary reclay is connected to positive source, and pulse signal source is used to control normally opened contact closed of auxiliary reclay or disconnects.
8 auxiliary reclays are formed D0～D7 pulse distribution matrix, the quantity of semiconductor refrigerating assembly is 4, the positive pole of power supply is connected with the positive pole of semiconductor refrigerating assembly by the normally opened contact of auxiliary reclay D0～D3 respectively, the negative pole of semiconductor refrigerating assembly is connected to power cathode, and the negative pole of semiconductor refrigerating assembly also is connected with the positive pole of power supply by the normally opened contact of auxiliary reclay D4～D7 respectively.
This water temperature regulate and control system comprises well heater and the temperature sensor of being located in the test chamber, and this well heater and temperature sensor are connected with test controller.
This water temperature regulate and control system also comprises cooling water source and is located at the first interior water pump of cooling water source, this first water pump is communicated with test chamber by pipeline, and this first water pump is connected with test controller, and cooling water source is freezed to water in the refrigerator by the refrigeration system of reach in freezer self and the external evaporator that increases cold compressor and forms.
This test chamber also is provided with a water level switch that is connected with test controller, when this water level switch detects the test chamber lack of water, then starts the second water pump moisturizing of being located in the cooling water source.
Compared with prior art, test unit of the present utility model, behind the hot-face temperature of control semiconductor refrigerating assembly, make that the quick simulation fail-test condition of semiconductor refrigerating assembly is feasible, and utilize power supply, the pulse distribution matrix that pulse signal source and a plurality of auxiliary reclay are formed, the assembly forward is switched on, outage, oppositely energising again, outage, and circulation test of many times, thereby test controller can produce the different operating condition of test of temperature by the control to the water temperature regulate and control system, by adjusting the characteristic that pulse signal source sends the pulse width adjustment assembly polarity switching of signal, so this process of the test applicability is strong, have good control effect, test findings is accurate.
Description of drawings
Fig. 1 is the principle schematic of the utility model semiconductor refrigerating assembly Polarity Control;
Fig. 2 is the structural representation of the test unit of the utility model semiconductor refrigerating assembly.
Embodiment
Electric refrigeration of the present utility model, electric pyrogenicity alternation life test apparatus are by test condition power switching, the control of conduction time, the cycle index counting of polarity, the operating mode control of refrigerating assembly hot-face temperature.
As shown in Figures 1 and 2, a kind of test unit of semiconductor refrigerating assembly, the water temperature regulate and control system that the water test container is housed in comprising, the temperature of test chamber water is regulated and control, place the semiconductor refrigerating assembly in the test chamber, the test controller that is connected with water temperature regulate and control system and semiconductor refrigerating assembly, the water temperature regulate and control system is controlled in semiconductor refrigerating assembly in one temperature range, test controller carries out polarity to semiconductor refrigerating assembly and switches, switches on and the outage cycle control, and utilizes an instrument with electronic brain to detect test findings.。
This test controller comprises power supply, pulse signal source and a plurality of auxiliary reclay, the positive pole of power supply is connected to the positive pole of semiconductor refrigerating assembly by the normally opened contact of an auxiliary reclay, the negative pole of semiconductor refrigerating assembly is connected to power cathode respectively and the normally opened contact by another auxiliary reclay is connected to positive source, and pulse signal source is used to control opening or closing of auxiliary reclay.
8 auxiliary reclays are formed D0～D7 pulse distribution matrix, the quantity of semiconductor refrigerating assembly is 4, the positive pole of power supply is connected with the positive pole of semiconductor refrigerating assembly by the normally opened contact of auxiliary reclay D0～D3 respectively, the negative pole of semiconductor refrigerating assembly is connected to power cathode, and the negative pole of semiconductor refrigerating assembly also is connected with the positive pole of power supply by the normally opened contact of auxiliary reclay D4～D7 respectively.
This water temperature regulate and control system comprises well heater and the temperature sensor of being located in the test chamber, and this well heater and temperature sensor are connected with test controller.
This water temperature regulate and control system also comprises cooling water source and is located at first water pump in the cooling water source, and this first water pump is communicated with test chamber by pipeline, and this first water pump is connected with test controller,
Cooling water source is freezed to water in the refrigerator by the refrigeration system of reach in freezer self and the external evaporator that increases cold compressor and forms, and is used for guaranteeing that the temperature of cooling water source and test chamber water temperature have bigger temperature difference displacement space.
Test unit is to prevent to cause by the damage of test semiconductor refrigerating assembly because of container lack of water in the process of the test, this test chamber also is provided with a water level switch that is connected with test controller, when this water level switch detects the test chamber lack of water, then start the second water pump moisturizing of being located in the cooling water source, the water capacity in the warranty test container.
Test controller carries out button operation by being located at inner key scanning circuit, 8 light-emitting diode displays, and the input user presses the command function of test condition establishment; The water temperature control, the outside input of the sampling water level switch position signalling that are used in the test chamber by the outside input temp analog quantity of sampling are used for the control of test chamber water level.
In addition, the utility model also provides a kind of test method of semiconductor refrigerating assembly, and it may further comprise the steps:
A. semiconductor refrigerating assembly is placed and be equipped with in the water test container, utilize the water temperature regulate and control system that semiconductor refrigerating assembly is controlled in the temperature range;
B. utilizing test controller that semiconductor refrigerating assembly is carried out polarity switches, switches on and the outage cycle control;
Whether resistance, the maximum temperature difference variation range that c. detects semiconductor refrigerating assembly is less than or equal to 10% before the test, is then qualified, otherwise defective.
The temperature of above-mentioned semiconductor refrigerating assembly is controlled at 65 ℃～80 ℃, and the pulse distribution matrix that utilizes power supply, pulse signal source and a plurality of auxiliary reclay to form, and to the energising of assembly forward, outage, oppositely switch on, cut off the power supply, and circulation repeatedly.
The quantity of auxiliary reclay is 8, form D0～D7 pulse distribution matrix, utilize pulse signal source that middle relay D0～D7 is carried out sequence control, when to middle relay D0, D1, D2, during the D3 sequential control, correspond to semiconductor refrigerating assembly E1 respectively, E2, E3, E4 forward energising 6S, when to middle relay D4, D5, D6, during the D7 sequential control, be respectively semiconductor refrigerating assembly E1～E4 6S that oppositely switches on, assembly E1 is after forward under the auxiliary reclay D0 sequential control was switched on 6 seconds, at auxiliary reclay D1, D2, assembly E1 had a power failure 18 seconds during the D3 sequential control, after auxiliary reclay D4 oppositely switched on 6 seconds, at auxiliary reclay D5, D6, assembly E1 had a power failure 18 seconds again during the D7 sequential control, by that analogy assembly E2, E3, E4 is at auxiliary reclay D1, D2, D3 and auxiliary reclay D5, D6, finish a polarity switching cycle under the sequential control of D7.
Test controller is according to design temperature, by first water pump in the control cooling water source and the well heater in the test chamber, reaches that the hot-face temperature of semiconductor refrigerating assembly is controlled between 65 ℃～80 ℃ in the process of the test.In addition, also can understand the refrigerating assembly duty in the process of the test by observation to the refrigerating assembly electrical current.
Facts have proved by of the present utility model, the precise control of this device, and also test figure is true and reliable, and the fail-test means before the contrast have significant effect and outstanding progress.List the test findings of three kinds of conductor refrigeration products below, shown in table 1 and table 2, wherein table 1 is performance parameter contrast before and after the refrigeration of refrigerating assembly electricity, the electric pyrogenicity alternation durability test, and table 2 is a test findings.
Table 1
| Assembly | Assembly resistance (Ω) changes≤10% | Number of non-compliances | Maximum temperature difference variation range≤10% | Number of non-compliances |
| 12704 | 1.5％，2.8％，1.9％，1.6％ | 0 | 26.8％，0.44％，0.44％，0.44％ | 1 |
| 12705 | 3.3％，3.1％，0.8％，2.4％ | 0 | 2.7％，3.1％，26％，0.2％ | 1 |
| 12706 | 2.2％，3.2％，0.78％，1.2％ | 0 | 1.5％，0.7％，0.59％，1％ | 0 |
Table 2
The test findings maximum temperature difference variation range of 1#12704 refrigerating assembly equal test preceding 26.8%,, variation is greater than 10% acceptance criteria, and is defective.
Before the test findings maximum temperature difference variation range of 3#12705 refrigerating assembly equals to test 26% changes the acceptance criteria greater than 10%, and be defective.
12706 refrigerating assembly test findings maximum temperature difference variation ranges are less than or equal to 10% acceptance criteria, and are qualified.
Claims (6)
1, a kind of test unit of semiconductor refrigerating assembly, the water temperature regulate and control system that the water test container is housed in it is characterized in that comprising, the temperature of test chamber water is regulated and control, place the semiconductor refrigerating assembly in the test chamber, the test controller that is connected with water temperature regulate and control system and semiconductor refrigerating assembly, semiconductor refrigerating assembly during the water temperature regulate and control system will test is controlled in the temperature range, test controller carries out polarity to semiconductor refrigerating assembly and switches, switches on and the outage cycle control, and utilizes an instrument with electronic brain to detect test findings.
2, the test unit of semiconductor refrigerating assembly according to claim 1, it is characterized in that: this test controller comprises power supply, pulse signal source and auxiliary reclay, the positive pole of power supply is connected to the positive pole of semiconductor refrigerating assembly by the normally opened contact of an auxiliary reclay, the negative pole of semiconductor refrigerating assembly is connected to power cathode respectively and the normally opened contact by another auxiliary reclay is connected to positive source, and pulse signal source is used to control normally opened contact closed of auxiliary reclay or disconnects.
3, the test unit of semiconductor refrigerating assembly according to claim 2, it is characterized in that: 8 auxiliary reclays are formed D0～D7 pulse distribution matrix, the quantity of semiconductor refrigerating assembly is 4, the positive pole of power supply is connected with the positive pole of semiconductor refrigerating assembly by the normally opened contact of auxiliary reclay D0～D3 respectively, the negative pole of semiconductor refrigerating assembly is connected to power cathode, and the negative pole of semiconductor refrigerating assembly also is connected with the positive pole of power supply by the normally opened contact of auxiliary reclay D4～D7 respectively.
4, the test unit of semiconductor refrigerating assembly according to claim 1 is characterized in that: this water temperature regulate and control system comprises well heater and the temperature sensor of being located in the test chamber, and this well heater and temperature sensor are connected with test controller.
5, the test unit of semiconductor refrigerating assembly according to claim 4, it is characterized in that: this water temperature regulate and control system also comprises cooling water source and is located at the first interior water pump of cooling water source, this first water pump is communicated with test chamber by pipeline, and this first water pump is connected with test controller, and cooling water source is freezed to water in the refrigerator by the refrigeration system of reach in freezer self and the external evaporator that increases cold compressor and forms.
6, the test unit of semiconductor refrigerating assembly according to claim 1, it is characterized in that: this test chamber also is provided with a water level switch that is connected with test controller, when this water level switch detects the test chamber lack of water, then start the second water pump moisturizing of being located in the cooling water source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202025643U CN201281735Y (en) | 2008-10-28 | 2008-10-28 | Test device for semiconductor refrigeration component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202025643U CN201281735Y (en) | 2008-10-28 | 2008-10-28 | Test device for semiconductor refrigeration component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201281735Y true CN201281735Y (en) | 2009-07-29 |
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ID=40928608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202025643U Expired - Lifetime CN201281735Y (en) | 2008-10-28 | 2008-10-28 | Test device for semiconductor refrigeration component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201281735Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101387678B (en) * | 2008-10-28 | 2011-07-06 | 海信科龙电器股份有限公司 | Test device for semiconductor refrigeration assembly and test method thereof |
| CN102339076A (en) * | 2011-07-29 | 2012-02-01 | 上海理工大学 | Microelectronic processing platform water cooling temperature control system and power regulating and energy saving method adopting same |
| CN103353564A (en) * | 2013-07-08 | 2013-10-16 | 工业和信息化部电子第五研究所 | Intermittent life testing device |
| CN112612307A (en) * | 2020-12-18 | 2021-04-06 | 北京京仪自动化装备技术有限公司 | Linkage control system and method for special temperature control equipment and load device for semiconductor |
-
2008
- 2008-10-28 CN CNU2008202025643U patent/CN201281735Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101387678B (en) * | 2008-10-28 | 2011-07-06 | 海信科龙电器股份有限公司 | Test device for semiconductor refrigeration assembly and test method thereof |
| CN102339076A (en) * | 2011-07-29 | 2012-02-01 | 上海理工大学 | Microelectronic processing platform water cooling temperature control system and power regulating and energy saving method adopting same |
| CN103353564A (en) * | 2013-07-08 | 2013-10-16 | 工业和信息化部电子第五研究所 | Intermittent life testing device |
| CN103353564B (en) * | 2013-07-08 | 2015-07-15 | 工业和信息化部电子第五研究所 | Intermittent life testing device |
| CN112612307A (en) * | 2020-12-18 | 2021-04-06 | 北京京仪自动化装备技术有限公司 | Linkage control system and method for special temperature control equipment and load device for semiconductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20090729 Effective date of abandoning: 20081028 |