CN201267055Y - Via hole structure of keyboard board - Google Patents
Via hole structure of keyboard board Download PDFInfo
- Publication number
- CN201267055Y CN201267055Y CNU2008201347866U CN200820134786U CN201267055Y CN 201267055 Y CN201267055 Y CN 201267055Y CN U2008201347866 U CNU2008201347866 U CN U2008201347866U CN 200820134786 U CN200820134786 U CN 200820134786U CN 201267055 Y CN201267055 Y CN 201267055Y
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- hole
- via hole
- conductor layer
- pcb
- welding resistance
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- Expired - Lifetime
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Abstract
The embodiment of the utility model discloses a keyboard through-hole structure applied to a through-hole of a printed circuit board (PCB). The side walls and the edges of the through-hole are provided with a conductor layer; the PCB around the conductor layer of the top surface of the through-hole is covered by a solder mask; and the conductor layer of the bottom surface of the through-hole and the PCB around the conductor layer are also covered by the solder mask and the solder mask passes the bottom side wall of the through-hole to enter the through-hole so as to form a solder window at the bottom of the through-hole; and the diameter of the solder window is less than that of the through-hole. In the keyboard through-hole structure, the adoption of the solder window can prevent the green oil in the front through-hole from impacting the contact with keys in the condition without hole-plugging. Moreover, two ends of the through-hole are not completely sealed and then the residual liquid which enters the through-hole during the PCB manufacturing process and the steam which enters the through-hole during the terminal use process can be discharged easily, thus guaranteeing the reliability of the terminal.
Description
Technical field
The utility model relates to communication technical field, relates in particular to a kind of via structure of finger-board.
Background technology
Normally used finger-board profile as shown in Figure 1 in the prior art.Its button PAD is made up of inside and outside two circles, because the PAD cylindrical forms a closed-loop, causes the outlet of interior circle not smooth, therefore needs to realize the interlayer circuit turn-on by dish mesopore mode.The keypad circuit is simpler, generally adopts common 2 laminates, and the dish mesopore is designed to the via hole that metallizes.
The principle of keypress function conduction mode as shown in Figure 2, the metal clips outer contacts with button PAD cylindrical, and behind the button pressurized, distortion is delivered on the metal clips, circle in the recessed contact of the metal clips center projections part PCB button PAD is with interior circle and the cylindrical conducting of button PAD.
When finger-board was installed in mobile phone, its back side was generally metallic shield, so the via hole back side needs insulation, and positive needed to guarantee that good electrical conductivity contacts with metal clips.
The structure in a kind of welding resistance lid hole is provided in the prior art, as shown in Figure 3A, has windowed, back side welding resistance 2 lid holes in positive welding resistance 2.This method requires need carry out the microetch operation before PCB (Print Circuit Board, the printed circuit board (PCB)) process of surface treatment, micro-corrosion liquid tool corrosivity, and corrosive liquids is difficult to clean up after entering via hole 1, may cause the hole wall corrosion in the residual pores.And for mobile phone products, receiver J-Horner, I/O mouth, MIC, keyboard and structure fit-up gap etc. all are that steam enters the passage in the casing, reciprocal effects such as mobile phone communication state oral cavity steam directly enters, mobile phone storage environment humidity, can make the stable higher levels of humidity that keeps in the handset shell, thereby accelerated corrosion is carried out, and may cause button loose contact or button short circuit.
A kind of structure of welding resistance consent also is provided in the prior art, shown in Fig. 3 B, has windowed back side welding resistance 2 consents in positive welding resistance 2.In this method, rabbet ink in the via hole 1 easily exceeds the button copper face, influencing metal clips contacts with button PAD, consent PCB processing procedure is that consent just carries out the welding resistance making later, rabbet ink hot curing when doing welding resistance, be difficult in the rabbet ink that copper face that the welding resistance stage will exceed has cured and develop and complete removing, therefore can't evade green oil exceeds the pad problem.
The designer finds that there is following problem in implementation of the prior art in realizing process of the present utility model: the Via Design scheme of the present finger-board of using always is easy to generate problems such as button loose contact or button short circuit.
The utility model content
Embodiment of the present utility model provides a kind of via structure of finger-board, with button point reliability in the raising equipment, avoids button loose contact or button short circuit.
Embodiment of the present utility model provides a kind of via structure of finger-board, is applied to the via hole on the printing board PCB, and the sidewall and the fringe region of described via hole have conductor layer:
PCB around the end face conductor layer of described via hole is covered by solder mask;
PCB around the bottom surface conductor layer of described via hole and the conductor layer is covered by solder mask, and described solder mask enters described via hole by the bottom sidewall of described via hole, form welding resistance in the bottom of described via hole and window, the diameter that described welding resistance is windowed is less than the diameter of described via hole.
Compared with prior art, embodiment of the present utility model has the following advantages:
By the mode of using welding resistance to window, under the situation of consent not, do not have the outstanding influence of green oil in the via hole of front by key contacts.In addition, because the via hole two ends do not have complete closed, enter the steam that enters in the via hole in residual liquid in the via hole and the terminal use in the PCB processing procedure and all be easier to discharge, can guarantee the reliability of terminal.
Description of drawings
Fig. 1 is the schematic diagram of finger-board profile in the prior art;
Fig. 2 is the principle of keypress function conduction mode in the prior art
Fig. 3 A is the structural representation in welding resistance lid hole in the prior art;
Fig. 3 B is the structural representation of welding resistance consent in the prior art;
Fig. 4 is the via structure schematic diagram of finger-board among the embodiment of the present utility model.
Embodiment
Among the embodiment of the present utility model, provide a kind of via structure of finger-board, be applied to the via hole on the printing board PCB, the sidewall and the fringe region of described via hole have conductor layer, and the PCB around the end face conductor layer of described via hole is covered by solder mask; PCB around the bottom surface conductor layer of described via hole and the conductor layer is covered by solder mask, and described solder mask enters described via hole by the bottom sidewall of described via hole, form welding resistance in the bottom of described via hole and window, the diameter that described welding resistance is windowed is less than the diameter of described via hole.
Among another embodiment of the present utility model, the via structure of finger-board as shown in Figure 4: pcb board 3 is provided with via hole 1, and the fringe region up and down of the sidewall of via hole 1 is coated with copper layer 4.Pcb board 3 around the end face copper layer 4 of via hole is covered by welding resistance 2.For the pcb board 3 around the bottom surface copper layer 4 of via hole, adopt the mode of welding resistance lid orifice ring, solder mask enters via hole 1 by the bottom sidewall of this via hole 1, forming welding resistance in the bottom of via hole 1 windows, make welding resistance 2 aperture of windowing more smaller than the aperture of via hole 1, window pore size than the little 4mil in via hole 1 aperture (mil) as welding resistance 2, promptly 0.004 inch, approximate 0.1016mm.Whole via hole welding resistance nature hand-holes, limit, via bottom hole does not have dew copper, and welding resistance covers orifice ring but incomplete consent.
By control, under the situation of consent not, do not have the outstanding influence of green oil in the via hole of front by key contacts to welding resistance.In addition, because the via hole two ends do not have complete closed, enter the steam that enters in the via hole in residual liquid in the via hole and the terminal use in the PCB processing procedure and all be easier to discharge, can guarantee the reliability of terminal.At last, back side welding resistance covers orifice ring fully, can prevent the generation of button short circuit or loose contact.
More than disclosed only be several specific embodiment of the present utility model, still, the utility model is not limited thereto, any those skilled in the art can think variation all should fall into protection range of the present utility model.
Claims (2)
1, a kind of via structure of finger-board is applied to the via hole on the printing board PCB, and the sidewall and the fringe region of described via hole have conductor layer, it is characterized in that:
PCB around the end face conductor layer of described via hole is covered by solder mask;
PCB around the bottom surface conductor layer of described via hole and the conductor layer is covered by solder mask, and described solder mask enters described via hole by the bottom sidewall of described via hole, form welding resistance in the bottom of described via hole and window, the diameter that described welding resistance is windowed is less than the diameter of described via hole.
2, the via structure of finger-board according to claim 1 is characterized in that the diameter that described welding resistance is windowed is compared with the diameter of described via hole, than the little 4mil of diameter of described via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201347866U CN201267055Y (en) | 2008-09-10 | 2008-09-10 | Via hole structure of keyboard board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201347866U CN201267055Y (en) | 2008-09-10 | 2008-09-10 | Via hole structure of keyboard board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201267055Y true CN201267055Y (en) | 2009-07-01 |
Family
ID=40833426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201347866U Expired - Lifetime CN201267055Y (en) | 2008-09-10 | 2008-09-10 | Via hole structure of keyboard board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201267055Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102795006A (en) * | 2012-08-09 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN107529281A (en) * | 2017-09-30 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN107750090A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method |
| CN107750091A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN108353508A (en) * | 2016-02-10 | 2018-07-31 | 名幸电子股份有限公司 | The manufacturing method of substrate and substrate |
-
2008
- 2008-09-10 CN CNU2008201347866U patent/CN201267055Y/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102795006A (en) * | 2012-08-09 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN102795006B (en) * | 2012-08-09 | 2015-07-08 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN108353508A (en) * | 2016-02-10 | 2018-07-31 | 名幸电子股份有限公司 | The manufacturing method of substrate and substrate |
| CN108353508B (en) * | 2016-02-10 | 2021-03-12 | 名幸电子股份有限公司 | Substrate and method for manufacturing substrate |
| CN107529281A (en) * | 2017-09-30 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN107750090A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method |
| CN107750091A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN107529281B (en) * | 2017-09-30 | 2019-09-20 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN107750090B (en) * | 2017-09-30 | 2019-11-05 | 生益电子股份有限公司 | A kind of production method of PCB |
| CN107750091B (en) * | 2017-09-30 | 2020-01-17 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HUAWEI DEVICE CO., LTD. Free format text: FORMER NAME: SHENZHEN HUAWEI TECHNOLOGY CO. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee after: Huawei Device Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Shenzhen Huawei Communication Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171109 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: HUAWEI terminal (Dongguan) Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090701 |