CN201264016Y - Glue dropping device of die bonder - Google Patents
Glue dropping device of die bonder Download PDFInfo
- Publication number
- CN201264016Y CN201264016Y CNU200820131280XU CN200820131280U CN201264016Y CN 201264016 Y CN201264016 Y CN 201264016Y CN U200820131280X U CNU200820131280X U CN U200820131280XU CN 200820131280 U CN200820131280 U CN 200820131280U CN 201264016 Y CN201264016 Y CN 201264016Y
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- CN
- China
- Prior art keywords
- glue
- die bonder
- bonder device
- rubber moulding
- colloid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a die bonder dispenser which comprises a body, a dispensing die set, a fixed base, a measurement die set, a cylinder, a buffering unit and a colloid cleaning die set, wherein the dispensing die set stores a colloid body, the fixed base is connected with the body and fixes the dispensing die set, the measurement die set is arranged under the fixed base to measure the height of the dispensing die set, the cylinder is arranged under the fixed base, the buffering unit pushes the fixed base, and the colloid cleaning die set is connected with the body and used for bearing a residual colloid body to enable the dispensing amount of the dispensing die set to be uniform. The utility model can accurately measure the height of the dispensing die set and enables the dispensing amount to be uniform.
Description
Technical field
The utility model relates to a kind of dropping glue of die bonder device, particularly relates to a kind of accurately measuring point rubber moulding group height and makes a glue amount keep uniform dropping glue of die bonder device.
Background technology
At present, technical development along with light emitting diode (Light Emitting Diode), make LED be widely used on the daily life fields such as illumination, signal demonstration, and the also development thereupon of solid crystal technique, solid brilliant with elargol at present, eutectic (Eutectic) weld bonds and cover crystalline substance (Flip Chip) welding and wait three kinds to consolidate crystal techniques be large, wherein the solid crystalline substance of elargol is lower because of cost, is the encapsulation that is applicable to the low-power light emitting diode, therefore is extensive use of for industry.
Please refer to Fig. 1, it is the dropping glue of die bonder schematic representation of apparatus for existing known techniques.This dropping glue of die bonder device has a packing element 11 and a Glue dripping head 12.Packing element 11 is to store colloid 111.Glue dripping head 12 be an injecting glue body 111 in the accommodation space 131 of a wire support 13 (lead frame), and fix a crystal grain in accommodation space 131, to finish the solid brilliant operation that utilizes the solid crystal technique of elargol by a crystal solidifying apparatus 14.
Yet, the shortcoming of the dropping glue of die bonder device of existing known techniques is that it carries out after majority put the glue operation, because of gravity and capillary reciprocation, make on the tip of Glue dripping head 12 and build up residual colloid, and cause Glue dripping head 12 can't evenly put glue in accommodation space 131, and then the solid brilliant quality of influence.
Another shortcoming of the dropping glue of die bonder device of prior art is to be hoist point glue accuracy, and it is to launch laser beams with measuring point glue height by a laser ranging system 15, because of laser ranging system 15 involves great expense, causes production cost to improve.
This shows that above-mentioned existing dropping glue of die bonder device obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of dropping glue of die bonder device of new structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing dropping glue of die bonder device exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of dropping glue of die bonder device of new structure, can improve general existing dropping glue of die bonder device, make it have more practicality.Through constantly research, design, and, create the utility model that has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing dropping glue of die bonder device exists, and provide a kind of dropping glue of die bonder device of new structure, technical problem to be solved is to make it solve the uneven problem of some glue amount of existing known techniques dropping glue of die bonder device, is very suitable for practicality.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.A kind of dropping glue of die bonder device according to the utility model proposes comprises: a body; Some rubber moulding groups are to store colloid; One holder is to connect this body and fix this rubber moulding group; One measures module, is to be arranged at this holder below, in order to measure the height of this rubber moulding group; One cylinder is to be arranged at this holder below; And a buffer cell, be this holder of contact.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid dropping glue of die bonder device, it also comprises a gel resin module, is to connect this body and in order to carry a residual colloid.
Aforesaid dropping glue of die bonder device, wherein said gel resin module also comprise one and remove a glue unit and a discoid body, and should remove the glue unit is to fit this discoid body to remove this residual colloid.
Aforesaid dropping glue of die bonder device, wherein said measurement module has a contact, is to electrically conduct with this holder or electrically separate, to measure the height of this rubber moulding group.
Aforesaid dropping glue of die bonder device, wherein said buffer cell are to be a spring.
Aforesaid dropping glue of die bonder device, wherein said cylinder are for low friction cylinder, in up-and-down motion.
Aforesaid dropping glue of die bonder device, wherein said some rubber moulding group more comprises a glue injection units, is this colloid of notes.
The utility model compared with prior art has tangible advantage and beneficial effect.By technique scheme, the utility model dropping glue of die bonder device has following advantage and beneficial effect at least:
1) the utility model dropping glue of die bonder device can be by measuring equipment measuring point rubber moulding group height, to reach the effect of accurate glue.
2) the utility model dropping glue of die bonder device can be removed the residual colloid that is attached to a rubber moulding group by the gel resin module, makes a rubber moulding group can evenly put glue.
In sum, the utility model is relevant a kind of dropping glue of die bonder device, comprises a body, some rubber moulding groups, a holder, a measurement module, a cylinder, a buffer cell and a gel resin module.Point rubber moulding group is to store colloid.Holder is a fixing point rubber moulding group.Measuring module is to connect body, in order to the height of measuring point rubber moulding group.Cylinder is arranged at the holder below.Buffer cell is the contact holder.The gel resin module is to connect body and in order to carry a residual colloid, make the some glue amount energy homogenising of a rubber moulding group.The utlity model has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing dropping glue of die bonder device has the outstanding effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the dropping glue of die bonder schematic representation of apparatus of existing known techniques.
Fig. 2 is the stereogram of the utility model dropping glue of die bonder device preferred embodiment.
Fig. 3 is the cylinder and the buffer cell block position graph of a relation of the utility model dropping glue of die bonder device preferred embodiment.
11: packing element 111: colloid
12: Glue dripping head 13: wire support
131: accommodation space 14: crystal solidifying apparatus
15: laser ranging system 21: body
22: some rubber moulding group 221: glue injection units
222: colloid 23: holder
24: mobile module 25: measure module
251: contact 26: cylinder
27: buffer cell 28: the gel resin module
281: cylindrical body 282: discoid body
283: remove glue unit 284,29: motor
285: belt
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its specific embodiment of dropping glue of die bonder device, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
See also the 2nd figure and the 3rd figure, it is stereogram and cylinder and the buffer cell block position graph of a relation that is respectively the preferred embodiment of the utility model dropping glue of die bonder device.The dropping glue of die bonder device of the utility model preferred embodiment comprises a body 21, some rubber moulding groups 22, a holder 23, and moves module 24, and measure module 25, a cylinder 26, a buffer cell 27 and a gel resin module 28.
Above-mentioned holder 23 is connected with body 21, in order to fixing point rubber moulding group 22.
This rubber moulding group 22 is the cylinder bodily form, is placed in the holder 23, is to store solid crystalline substance colloid.Point rubber moulding group 22 comprises the glue injection units 221 of some injecting glue bodies.
Above-mentioned mobile module 24 is connected and fixed seat 23 and some rubber moulding group 22, drives a rubber moulding group 22 by the driving of motor 29 to rotatablely move in the horizontal direction, makes a rubber moulding group 22 can move to some glue position or and removes the glue position.
Above-mentioned measurement module 25 has a contact 251, is arranged at holder 23 belows.Contact 251 is to produce by separating with holder 23 electrically to separate signal, with the height of measuring point rubber moulding group 22.
Above-mentioned gel resin module 28 is arranged at body 21 belows, has a cylindrical body 281, a discoid body 282 and except that glue unit 283.Cylindrical body 281 drives a belt 285 drives by motor 284 and rotates, and discoid body 282 is arranged at cylindrical body 281 belows, rotates by discoid body 282 drives.Remove glue unit 283 and be attached at discoid body 282 tops.
Above-mentioned cylinder 26 is arranged at holder 23 belows, is that retaining contact 251 is combined closely with holder 23 when mobile module 24 rotates, and is clashed into because of vibrations to prevent contact 251.In the present embodiment, cylinder 26 is not have the low friction cylinder 26 that O type ring (O-Ring) designs and use at vertical direction high speed back and forth movement.
Above-mentioned buffer cell 27 is to be resisted against holder 23 belows, in order to alleviate putting heavily of a rubber moulding group 22.
When dropping glue of die bonder is installed on when carrying out a some glue operation at every turn, all need survey high operation, with the precision of hoist point glue operation.When surveying high operation, some rubber moulding group 22 moves to a glue position by the drive of mobile module 24.This time point glued membrane group 22 produces vertical displacement and holder 23 is separated with contact, electrically conduct state and export one and separate electrical signal to a processing unit (figure does not show) and make contact 251 be non-, processing unit calculates a rubber moulding group 22 height by separating electrical signal.Therefore the dropping glue of die bonder device is able to adjusting point glue height, makes a rubber moulding group 22 can accurately put glue.
After a rubber moulding group 22 is carried out a glue operation, because of gravity and capillary reciprocation in the tip of glue injection units 221 along with an increase of glue operation number of times builds up a residual colloid 222.Crossing senior generals when residual colloid 222 causes the injecting glue amount of glue injection units 221 can't be even.For fear of this problem, some rubber moulding group 22 is moved to except that the glue position by a glue position by mobile module 24 in the some glue operation of carrying out certain number of times or in the certain hour interval.Contact with discoid body 282 in the rotation by the tip of glue injection units 221, residual colloid 222 is attached on the discoid body 282 gradually.The residual colloid 222 that is attached to discoid body 282 is removed by removing glue unit 283, makes discoid body 282 can continue performance and removes effectiveness.
Wherein, above-mentioned some rubber moulding group 22 is to be a packing element, and glue injection units 221 is to be a Glue dripping head, and buffer cell 27 is to be a spring, and removing glue unit 283 is to be a cotton.
Indulge the above, the effect of dropping glue of die bonder device of the present utility model is to measure module 25, cylinder 26 and buffer cell 27 by being provided with, can avoid contact 251 to be collided and damage, and the height of accurate measuring point rubber moulding group 22, and it is cheap that existing known techniques is utilized laser ranging system, thereby reduces production costs.
Another effect of dropping glue of die bonder device of the present utility model is can carry and remove residual colloid 22 by gel resin module 28 is set, and makes glue injection units 221 stablize injecting glue.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (7)
1, a kind of dropping glue of die bonder device is characterized in that comprising:
One body;
Some rubber moulding groups are to store colloid;
One holder is to connect this body and fix this rubber moulding group;
One measures module, is to be arranged at this holder below, in order to measure the height of this rubber moulding group;
One cylinder is to be arranged at this holder below; And
One buffer cell is this holder of contact.
2, dropping glue of die bonder device according to claim 1 is characterized in that it also comprises a gel resin module, is to connect this body and in order to carry a residual colloid.
3, dropping glue of die bonder device according to claim 2 is characterized in that wherein said gel resin module also comprises one and removes a glue unit and a discoid body, and should remove the glue unit is to fit this discoid body to remove this residual colloid.
4, dropping glue of die bonder device according to claim 1 is characterized in that wherein said measurement module has a contact, is to electrically conduct with this holder or electrically separate, to measure the height of this rubber moulding group.
5, dropping glue of die bonder device according to claim 1 is characterized in that wherein said buffer cell is to be a spring.
6, dropping glue of die bonder device according to claim 1 is characterized in that wherein said cylinder is for low friction cylinder, in up-and-down motion.
7, dropping glue of die bonder device according to claim 1 is characterized in that wherein said some rubber moulding group more comprises a glue injection units, is this colloid of notes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820131280XU CN201264016Y (en) | 2008-08-07 | 2008-08-07 | Glue dropping device of die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820131280XU CN201264016Y (en) | 2008-08-07 | 2008-08-07 | Glue dropping device of die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201264016Y true CN201264016Y (en) | 2009-07-01 |
Family
ID=40830362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820131280XU Expired - Fee Related CN201264016Y (en) | 2008-08-07 | 2008-08-07 | Glue dropping device of die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201264016Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347249A (en) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | Head exchange mechanism for bonding slice bonding head |
| CN102368523A (en) * | 2011-11-10 | 2012-03-07 | 东莞市凯格精密机械有限公司 | Fully-automatic patch-type LED die bonder with new operation flows |
| CN104889035A (en) * | 2014-10-09 | 2015-09-09 | 苏州富强科技有限公司 | Curve dispensing device |
| CN104889003A (en) * | 2014-10-17 | 2015-09-09 | 苏州富强科技有限公司 | A glue cleaning method |
-
2008
- 2008-08-07 CN CNU200820131280XU patent/CN201264016Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347249A (en) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | Head exchange mechanism for bonding slice bonding head |
| CN102347249B (en) * | 2010-08-02 | 2014-02-05 | 北京中电科电子装备有限公司 | Head exchange mechanism for bonding slice bonding head |
| CN102368523A (en) * | 2011-11-10 | 2012-03-07 | 东莞市凯格精密机械有限公司 | Fully-automatic patch-type LED die bonder with new operation flows |
| CN104889035A (en) * | 2014-10-09 | 2015-09-09 | 苏州富强科技有限公司 | Curve dispensing device |
| CN104889003A (en) * | 2014-10-17 | 2015-09-09 | 苏州富强科技有限公司 | A glue cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YOUNG TEK ELECTRONICS CORP. Free format text: FORMER OWNER: WECON AUTOMATIZATION MACHINERY CO., LTD. Effective date: 20150610 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150610 Address after: Taiwan, China Hsinchu Po Pu Pu Pu Road, Lane 99, No. 127 Patentee after: Jiuyuan Electronic Co., Ltd. Address before: Hsinchu City, Taiwan, China Patentee before: Wecon Automatic Machinery Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20160807 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |