CN201257682Y - 夹具及其切割装置 - Google Patents
夹具及其切割装置 Download PDFInfo
- Publication number
- CN201257682Y CN201257682Y CNU2008201516417U CN200820151641U CN201257682Y CN 201257682 Y CN201257682 Y CN 201257682Y CN U2008201516417 U CNU2008201516417 U CN U2008201516417U CN 200820151641 U CN200820151641 U CN 200820151641U CN 201257682 Y CN201257682 Y CN 201257682Y
- Authority
- CN
- China
- Prior art keywords
- clamping plate
- support membrane
- diameter
- clamping
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201516417U CN201257682Y (zh) | 2008-08-05 | 2008-08-05 | 夹具及其切割装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201516417U CN201257682Y (zh) | 2008-08-05 | 2008-08-05 | 夹具及其切割装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201257682Y true CN201257682Y (zh) | 2009-06-17 |
Family
ID=40771912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008201516417U Expired - Lifetime CN201257682Y (zh) | 2008-08-05 | 2008-08-05 | 夹具及其切割装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201257682Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109358380A (zh) * | 2018-11-07 | 2019-02-19 | 天津工业大学 | 一种短路匝角度传感器导磁环成型工装 |
CN113561264A (zh) * | 2021-07-12 | 2021-10-29 | 西安奕斯伟硅片技术有限公司 | 一种用于将原材料加工成为成品的装置 |
-
2008
- 2008-08-05 CN CNU2008201516417U patent/CN201257682Y/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109358380A (zh) * | 2018-11-07 | 2019-02-19 | 天津工业大学 | 一种短路匝角度传感器导磁环成型工装 |
CN109358380B (zh) * | 2018-11-07 | 2024-04-12 | 天津工业大学 | 一种短路匝角度传感器导磁环成型工装 |
CN113561264A (zh) * | 2021-07-12 | 2021-10-29 | 西安奕斯伟硅片技术有限公司 | 一种用于将原材料加工成为成品的装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106346184B (zh) | 一种汽车零部件焊接工作台 | |
CN201181654Y (zh) | 弹簧夹持夹具 | |
CN202200071U (zh) | 一种夹具压紧装置 | |
CN201257682Y (zh) | 夹具及其切割装置 | |
CN201856163U (zh) | 一种硅片的加工夹具 | |
CN201326035Y (zh) | 硅棒胶接机 | |
CN201856162U (zh) | 一种硅片的研磨夹具 | |
CN110695844A (zh) | 双面抛光机用衬底片夹具及其抛光方法 | |
CN115662940A (zh) | 氮化镓晶圆xrd测试固定装置及其使用方法 | |
CN201501830U (zh) | 一种镜片切割时的上盘夹具 | |
CN211414771U (zh) | 双面抛光机用衬底片夹具 | |
CN108098567A (zh) | 抛光用压力缓冲垫、抛光装置及抛光工艺 | |
CN221416321U (zh) | 一种减薄砂轮的粘齿夹具 | |
CN102581974B (zh) | 一种晶体切割定位粘接台 | |
JP2012028702A (ja) | 半導体結晶固定治具 | |
CN108394091B (zh) | 一种四周贴膜机 | |
CN201291385Y (zh) | 一种车床专用支座 | |
CN109513807A (zh) | 一种冲孔用夹紧装置 | |
CN203062495U (zh) | 研磨硅片用夹具 | |
CN217434008U (zh) | 一种晶圆抛光设备 | |
CN203062494U (zh) | 一种硅片的加工夹具 | |
CN214600159U (zh) | 一种点胶机夹持旋转机构 | |
CN103029036A (zh) | 一种硅片的加工夹具 | |
CN219837554U (zh) | 一种平磨机 | |
CN202499806U (zh) | 无极灯灯管截断夹具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130111 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130111 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20090617 |