CN201255562Y - Device for heating flexible printed circuit board substrate - Google Patents
Device for heating flexible printed circuit board substrate Download PDFInfo
- Publication number
- CN201255562Y CN201255562Y CNU2008201511841U CN200820151184U CN201255562Y CN 201255562 Y CN201255562 Y CN 201255562Y CN U2008201511841 U CNU2008201511841 U CN U2008201511841U CN 200820151184 U CN200820151184 U CN 200820151184U CN 201255562 Y CN201255562 Y CN 201255562Y
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- Prior art keywords
- copper foil
- heating
- casing
- foil rolls
- foil volume
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Abstract
The utility model relates to a device used for heating substrate of flexible printed circuit, which comprises a box body; wherein, one side of the box body is provided with a sealed door; the box body is internally provided with a shaft used for sleeving copper foil rolls on the shaft, a power supply device with two electrodes which are respectively connected with an internal end and an external end of the copper foil rolls, and a control unit which controls the temperatures of the copper foil rolls. By making use of the principle of heat and hotness of copper foil rolls with uniform resistance after being electrified, the utility model greatly shortens the heating speed and improves the production efficiency. In addition, the control unit is used for controlling the temperature and time needed in the heating of the copper foil rolls and a swing mechanism is used to drive the shaft to swing so as to cause the relaxed copper foil rolls to be uniformly heated. Therefore, the device causes the copper foil rolls not to be twisted and deformed because of different expansive degrees of the copper foil rolls in the heating process; besides, the swing mechanism causes the shaft to swing, which is good for the full volatilization of propellants of adhesives at the central areas of the flexible printed circuits.
Description
Technical field
The utility model relates to a kind of device that is used for heating flexible substrate for printed circuit board, refers in particular to a kind ofly directly flexible substrate for printed circuit board to be heated so that stick together the heater of glue drying in the flexible substrate for printed circuit board production process.
Background technology
Flexible printed wiring board (FPC) is widely used in the pivot joint part of mobile phone, digital camera, printer etc., and the chamber of commerce of digital product manufactory buys a large amount of flexible substrate for printed circuit board to flexible substrate for printed circuit board production firm and makes digital product.This flexible substrate for printed circuit board has one deck Copper Foil, the one side of this Copper Foil is sticked together the plastic sheeting that has as insulating barrier, the composition of this plastic sheeting is generally polyimides (Polyimide, hereinafter to be referred as PI), the one side that relevant dealer is sticked together Copper Foil and PI film usually is called the face of sticking together, and another side is called glassy surface.Usually, to stick together glue as the intermediate layer, it is binded mutually between PI film and the Copper Foil, another kind of optionally scheme is, on the direct coated copper foil of PI glue.Transport flexible substrate for printed circuit board for the ease of flexible substrate for printed circuit board production firm to digital product manufacturer, be beneficial to digital product manufacturer simultaneously and carry out following process, flexible substrate for printed circuit board is made the form of whole volume usually by flexible substrate for printed circuit board production firm, the Copper Foil that is otherwise known as volume.
Flexible substrate for printed circuit board production firm makes the Copper Foil volume by following steps at present: glue is sticked together in the one side coating that will have the Copper Foil of uniform thickness earlier; Then the PI film is entirely fitted in and stick together on the glue, the PI film is by sticking together on bonding of glue and Copper Foil or the direct coated copper foil of PI glue to make flexible substrate for printed circuit board; Again the flexible substrate for printed circuit board of making is wrapped on the core pipe, during winding the glassy surface of Copper Foil inwardly, stick together face outside, thereby form the Copper Foil volume.
Yet, because being bonded with the Copper Foil volume of PI film has tens of centimeters width and Copper Foil circumvolution usually and takes up reality, so the volatilizer that sticks together among the glue near Copper Foil volume both sides edge area is easier to be volatilized by the edge, and Copper Foil volume is not easy volatilization near the volatilizer that sticks together among the glue of middle section, thereby causes near descend unfavorable following process+even influence the problem of product quality of the Copper Foil of middle section and PI film degree of adhesion.
Therefore, in order to address this problem, prior art is to adopt the mode of heating to come the glue that sticks together of Copper Foil volume is carried out drying, because oxidation can take place in Copper Foil under the condition of high temperature, so prior art be will loosen the Copper Foil volume be placed in the baking oven that is full of nitrogen Copper Foil involved in capable hot blast heating, utilize heat exchange pattern to accelerate to stick together in the Copper Foil volume volatilizer volatilization of glue.Yet, the back confirms that the temperature of heating Copper Foil volume need reach the volatilizer that can allow Copper Foil volume middle section stick together glue more than 300 degrees centigrade and volatilize fully after deliberation, but adopt the hot blast mode of heating that the Copper Foil volume is heated to this temperature and keeps the required time of this temperature very long, generally need more than 10 hours, therefore production efficiency is very low, has influenced the producer's economic benefit.Moreover, adopt heat exchange pattern, the operator is difficult to accurately control the Copper Foil volume and evenly heats, the temperature in the common zone that keeps to the side when heating rises very fast and slower near the temperature rising of middle section, because temperature contrast makes close Copper Foil volume both sides reach the Copper Foil degrees of expansion difference near central authorities, if the excessive Copper Foil torsional deformation that very easily causes of temperature contrast can only slowly heat up when therefore carrying out heat drying with prior art, and can't promote production efficiency.
In view of prior art Copper Foil is rolled up the problem that heat drying grows, easily causes the Copper Foil torsional deformation required heat time heating time, therefore be necessary to provide a kind of improved technology to overcome above-mentioned shortcoming.
Summary of the invention
Main purpose of the present utility model is to provide a kind of device that is used for heating flexible substrate for printed circuit board, it can directly heat Copper Foil by electric current, voltage, reaches to make to shorten dramatically heat time heating time, make Copper Foil to be heated evenly the effect that is difficult for torsional deformation in heating process.
For reaching the above object, major technique means of the present utility model are: a kind of device that is used for heating flexible substrate for printed circuit board is provided, it comprises a casing, side in described casing is provided with hermatic door, described box house is provided with and utilizes Copper Foil volume heating power principle to make the Copper Foil volume produce the supply unit of heat, the two poles of the earth of described supply unit are connected with the inside and outside two ends of Copper Foil volume respectively, and described device also is provided with monitoring Copper Foil volume temperature controlling unit.
By technique scheme, the present invention utilizes the even resistance of Copper Foil self, and the promptly rapid and evenly heating in energising back can be volatilized the volatilizer between copper foil layer and the PI thin layer fast fully, rolls up the required time thereby shorten the heating Copper Foil effectively.
Further, described control module comprises and is used to measure the temperature sensing device of Copper Foil volume temperature and is used to regulate the register of Copper Foil volume temperature, described register comprises processor and electronics electric control circuit, is set with control heating-up temperature and the automatically controlled programming mode of heat time heating time in described processor.By above-mentioned steps, can thereby being twisted in, Copper Foil be difficult for the distortion that is distorted in the heating process according to predefined pattern to the evenly heating step by step of Copper Foil volume.
Further, in described casing, be provided with and be used for Copper Foil is rolled up sheathed axle thereon, first end of described axle is rotatably mounted on the sidewall relative with hermatic door in the casing, second end is unsettled to hermatic door opening direction horizontal-extending, and first end of described axle penetrates and outwards protrudes out formation one convex extension part from the sidewall of casing, this convex extension part is connected with a swing mechanism, described swing mechanism comprises a motor and two connecting rods, one end of two connecting rods interconnects, and the other end is connected with described motor and described convex extension part respectively.Thereby turning gear is swung back and forth the Copper Foil volume that loosens is heated evenly, in heating process, is difficult for causing torsional deformation because of Copper Foil degrees of expansion difference by swing mechanism; And make in the middle of turning gear swings back and forth at swing mechanism, can help the volatilizer that the flexible printed wiring board middle section sticks together glue and volatilize fully.
Description of drawings
Fig. 1 is the side sectional view of the utility model preferred embodiment; And
Fig. 2 is the front section view of the utility model preferred embodiment.
The specific embodiment
As Fig. 1, Figure 2 shows that an embodiment of the device that is used for heating flexible substrate for printed circuit board, it has a casing 10, be provided with an openable hermatic door 11 in the front side of this casing 10, in this casing 10, be provided with trunnion axis 12, this first end of 12 is rotatably mounted in the casing on the rear wall relative with hermatic door 11, second end is unsettled to front seal door 11 opening direction horizontal-extendings, casing 10 is equipped with the sealing ring (not shown) on every side with the joint portion of axle 12, this first end of 12 penetrates from the sidewall of casing 10 and protrudes out casing 10 outsides and form convex extension part 121, this convex extension part 121 is connected with a swing mechanism 20, this swing mechanism 20 comprises a motor 21 and two connecting rods 22,22 ', two connecting rods 22,22 ' an end interconnect by an active connection 23, the other end is connected with the convex extension part 121 of motor 21 and axle 12 respectively, on casing 10 left side walls, be equipped with exhaust tube 13 (four exhaust tubes are arranged) in the embodiment shown in the figure, outside top at this casing 10 is provided with a Pressure gauge 14 and a pressure vacuum gauge 15, be equipped with a gas tube 16 in the left side wall place near these casing 10 bottoms, also be provided with a supply unit (not shown) and a control device (not shown) in these casing 10 inside, two electrodes of this power supply link to each other with the Copper Foil two ends respectively, thereby Copper Foil is involved in the row heating, further, this power supply can adopt low-voltage, high electric current, this control module comprises the register (not shown) that is used to measure the temperature sensing device (not shown) of Copper Foil volume temperature and is used to regulate Copper Foil volume temperature, and this register comprises an electronics electric control circuit (not shown) and a processor (not shown).
The above-mentioned device that is used for heating flexible substrate for printed circuit board cooperates a vavuum pump (not shown) and an inflated with nitrogen device (not shown) to use usually, during use vavuum pump is connected with above-mentioned gas tube 16 with above-mentioned exhaust tube 13 respectively with the inflated with nitrogen device.Because in heating process, the High Temperature Gas of heater inside is known from experience by being drawn out of in the exhaust tube 13, and make vavuum pump be easy to damage, so also can be used a heat-exchange device (not shown) in addition, it is arranged between exhaust tube 13 and the vavuum pump, and can allow the hot-air of extracting out in the heater enter among the vavuum pump again after the cooling in advance, because this vavuum pump, heat-exchange device and inflated with nitrogen device belong to prior art, those skilled in the art can understand and implement at an easy rate, so do not add to give unnecessary details.
When using the above-mentioned device heating Copper Foil that is used for heating flexible substrate for printed circuit board to roll up, earlier Copper Foil is involved in capable loose winding, again the Copper Foil volume is placed on this axle 12 from a unsettled end of axle 12 is sheathed, 10 inner close Copper Foil volume places are provided with a temperature sensing device at casing, and the Copper Foil innermost layer linked to each other with an electrode of this supply unit near core Guan Yiduan, the outermost end of Copper Foil is linked to each other with another electrode of supply unit, and the exportable low-voltage of this supply unit, high electric current come Copper Foil volume energising heating.Because core pipe in the Copper Foil volume and the PI film on the Copper Foil are insulating materials and Copper Foil to be involved in and has gone the loose winding processing, so after connecting electrode, between Copper Foil volume and the core pipe, generally can not produce short circuit between each layer Copper Foil of rolling up of Copper Foil.Close hermatic door 11, open vavuum pump and inflated with nitrogen device.Opening power device switch makes the device be used for heating flexible substrate for printed circuit board begin the heating of Copper Foil volume, continues in casing 10 inflated with nitrogen in heating process, vacuumizes.When temperature sensing device detects Copper Foil volume temperature and rises to 350 degrees centigrade, keep beginning cooling behind this temperature appropriate time.When temperature sensing device detects Copper Foil volume temperature and reduces to 70 degrees centigrade, feed pressure-airs exhausts simultaneously to casing 10, and quicken cooling Copper Foil volume.When temperature sensing device detected Copper Foil volume temperature and continues to reduce to 40 degrees centigrade, vavuum pump stopped exhaust and the device of cutting off the electricity supply.
In heating process, utilize control module to regulate control Copper Foil volume temperature, specifically, the temperature data that records according to the temperature sensing device of this control module, control Copper Foil volume heating-up temperature and time by the electronics electric control circuit of register, further, can be before heating Copper Foil volume, in the processor of adjusting device, preestablish an automatically controlled programming mode, make the electronics electric control gear according to this automatically controlled programming mode work, thereby reach according to preestablishing the purpose that pattern evenly heats step by step to the Copper Foil volume.
Preferably, utilize an electric resistance measuring apparatus (not shown) that the Copper Foil volume after fixing is measured its resistance value, if measured resistance is shown as zero, prove that there is short circuit in tested Copper Foil volume, then check the situation of Copper Foil volume loose winding, retighten then, show that until the Copper Foil volume that is fixed resistance value is a non-zero.In addition, in Copper Foil volume heating process, also can monitor Copper Foil volume two ends electric current simultaneously and whether strengthen unusually, then stop immediately the heating of Copper Foil volume, and can before heating Copper Foil volume, preestablish the max-thresholds of electric current if current anomaly strengthens.
By above-mentioned steps, the operator can use the above-mentioned device heating Copper Foil volume that is used for heating flexible substrate for printed circuit board.
Be understandable that the detailed description of the foregoing description is in order to set forth and explain principle of the present invention rather than to the qualification of protection scope of the present invention.All other do not break away under the prerequisite of purport of the present invention and technical spirit, and the equalization finished changes and modifies change, all should be included in the scope of the claim that the utility model contains.
Claims (10)
1. device that is used for heating flexible substrate for printed circuit board, comprise a casing, side in described casing is provided with hermatic door, it is characterized in that: described box house is provided with and utilizes Copper Foil volume heating power principle to make the Copper Foil volume produce the supply unit of heat, the two poles of the earth of described supply unit are connected with the inside and outside two ends of Copper Foil volume respectively, and described device also is provided with monitoring Copper Foil volume temperature controlling unit.
2. device as claimed in claim 1 is characterized in that: described control module comprises and is used to measure the temperature sensing device of Copper Foil volume temperature and is used to regulate the register of Copper Foil volume temperature.
3. device as claimed in claim 2 is characterized in that: described register comprises processor and electronics electric control circuit, is set with control heating-up temperature and the automatically controlled programming mode of heat time heating time in described processor.
4. device as claimed in claim 3 is characterized in that: described supply unit adopts low-voltage, high electric current.
5. as each described device in the claim 1 to 4, it is characterized in that: the sidewall of described casing is equipped with exhaust tube and gas tube.
6. device as claimed in claim 5 is characterized in that: in described casing, be provided be used for Copper Foil roll up sheathed thereon the axle.
7. device as claimed in claim 6 is characterized in that: described axle first end is rotatably mounted on the sidewall relative with hermatic door in the casing, and second end is unsettled to hermatic door opening direction horizontal-extending.
8. device as claimed in claim 7 is characterized in that: first end of described axle penetrates and outwards protrudes out formation one convex extension part from the sidewall of casing, and this convex extension part is connected with a swing mechanism.
9. device as claimed in claim 8 is characterized in that: described swing mechanism comprises a motor and two connecting rods, and an end of two connecting rods interconnects, and the other end is connected with described motor and described convex extension part respectively.
10. device as claimed in claim 9 is characterized in that: described axle is equipped with sealing ring on every side with the joint portion of described wall box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201511841U CN201255562Y (en) | 2008-07-24 | 2008-07-24 | Device for heating flexible printed circuit board substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201511841U CN201255562Y (en) | 2008-07-24 | 2008-07-24 | Device for heating flexible printed circuit board substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201255562Y true CN201255562Y (en) | 2009-06-10 |
Family
ID=40738885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201511841U Expired - Lifetime CN201255562Y (en) | 2008-07-24 | 2008-07-24 | Device for heating flexible printed circuit board substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201255562Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101586435B (en) * | 2009-06-19 | 2011-05-11 | 江苏出入境检验检疫局工业产品检测中心 | Device for sealing volatile substance releasing cabin door |
| CN103383178A (en) * | 2013-07-20 | 2013-11-06 | 芜湖鑫泰铜业有限公司 | Metal wire heating and drying device |
| CN104219888A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT (bismaleimide triazine) board cutting process |
| CN104272048A (en) * | 2012-02-01 | 2015-01-07 | 振兴电子有限责任公司 | Methods and apparatuses for drying electronic devices |
| US9746241B2 (en) | 2012-02-01 | 2017-08-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9970708B2 (en) | 2012-02-01 | 2018-05-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10240867B2 (en) | 2012-02-01 | 2019-03-26 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10690413B2 (en) | 2012-02-01 | 2020-06-23 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10876792B2 (en) | 2012-02-01 | 2020-12-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
-
2008
- 2008-07-24 CN CNU2008201511841U patent/CN201255562Y/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101586435B (en) * | 2009-06-19 | 2011-05-11 | 江苏出入境检验检疫局工业产品检测中心 | Device for sealing volatile substance releasing cabin door |
| US9746241B2 (en) | 2012-02-01 | 2017-08-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| CN104272048A (en) * | 2012-02-01 | 2015-01-07 | 振兴电子有限责任公司 | Methods and apparatuses for drying electronic devices |
| CN104272048B (en) * | 2012-02-01 | 2017-01-18 | 振兴电子有限责任公司 | Methods and apparatuses for drying electronic devices |
| US9816757B1 (en) | 2012-02-01 | 2017-11-14 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9970708B2 (en) | 2012-02-01 | 2018-05-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10240867B2 (en) | 2012-02-01 | 2019-03-26 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10690413B2 (en) | 2012-02-01 | 2020-06-23 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10876792B2 (en) | 2012-02-01 | 2020-12-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10928135B2 (en) | 2012-02-01 | 2021-02-23 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| CN103383178A (en) * | 2013-07-20 | 2013-11-06 | 芜湖鑫泰铜业有限公司 | Metal wire heating and drying device |
| CN104219888A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT (bismaleimide triazine) board cutting process |
| CN104219888B (en) * | 2014-08-15 | 2017-07-28 | 安徽广德威正光电科技有限公司 | A kind of BT plates sheet material sawing sheet technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: ALLSTAR TECH (ZHONGSHAN) CO., LTD. Effective date: 20140304 Owner name: YANGCHENG (FOSHAN) TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHANGHAI YANGCHENG TECHNOLOGY CO., LTD. Effective date: 20140304 |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201818 JIADING, SHANGHAI TO: 528100 FOSHAN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140304 Address after: Leping Town, Sanshui District, Guangdong city of Foshan Province Yue Road 528100 No. 1 Patentee after: Yang Cheng (Foshan) Technology Co., Ltd. Address before: 201818 Xingping road Shanghai city Jiading District Fuhua High-tech Park No. 569 Patentee before: Shanghai Yangcheng Technology Co., Ltd. Patentee before: Allstar Electronic Material (Zhongshan) Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090610 |