CN201242066Y - Backlight module unit and glue frame in backlight module unit - Google Patents

Backlight module unit and glue frame in backlight module unit Download PDF

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Publication number
CN201242066Y
CN201242066Y CNU2008201157880U CN200820115788U CN201242066Y CN 201242066 Y CN201242066 Y CN 201242066Y CN U2008201157880 U CNU2008201157880 U CN U2008201157880U CN 200820115788 U CN200820115788 U CN 200820115788U CN 201242066 Y CN201242066 Y CN 201242066Y
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China
Prior art keywords
led
groove
depressed part
glue frame
projection
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Expired - Lifetime
Application number
CNU2008201157880U
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Chinese (zh)
Inventor
肖尹
庹永华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Holitech Optoelectronics Co Ltd
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BYD Co Ltd
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Priority to CNU2008201157880U priority Critical patent/CN201242066Y/en
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Publication of CN201242066Y publication Critical patent/CN201242066Y/en
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Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a backlight module and a rubber frame in the backlight module. A convex area which is corresponding to an LED depressed part is arranged on the groove bottom surface of a lower crossbeam of the rubber frame. An LED is contained in a groove, the depressed part of the LED can be connected with the convex area on the groove bottom surface, thereby, the freedom degree of the LED on the groove width direction is limited by the convex area, which prevents the LED from generating slippage on the groove width direction and prevents an FPC with a golden finger from deviation on the groove width direction, the convex area on the groove bottom surface can support the LED on the direction which is directed to the reflecting plate bottom light incidence plane, which enables a light-emitting surface of the LED which is directed to the reflecting plate bottom light incidence plane to be close to the reflecting plate bottom light incidence plane as close as possible, thereby guaranteeing that luminous rays which are emitted by the LED light-emitting surface rip into a reflecting plate from the reflecting plate bottom light incidence plane wholly as much as possible and improving the brightness of the backlight module.

Description

Glue frame in module backlight and the module backlight
Technical field
The utility model relates to light source technology, the glue frame in particularly a kind of module backlight and a kind of module backlight.
Background technology
Fig. 1 is the decomposition texture schematic diagram of existing module backlight.As shown in Figure 1, existing module backlight specifically comprises: glue frame 1, LGP 2, luminescence component 3, double faced adhesive tape 4, reflector plate 5, some blooming pieces 6, and shading patch 7.
Glue frame 1 is the framework of a rectangle, by two crossbeams up and down and about two longerons sealings form; The upper surface of glue frame 1 sill 10 has three grooves 13.
Reflector plate 5 is fixed in the back side of glue frame 1.
LGP 2 is for having the laminated structure of predetermined thickness, and it is that exiting surface, bottom surface are the incidence surface of LGP 2 for site face, another side simultaneously.The site face of LGP 2 towards reflector plate 5, as the bottom surface of incidence surface towards groove 13, in the front of glue frame 1 is embedded in glue frame 1, and the site face of LGP 2 and reflector plate 5 applyings.
Luminescence component 3 comprise flexible PCB (Flexible Printed Circuit, FPC) 32, (Surface Mount Technology SMT) is welded with three light emitting diodes (LED) 31 by surface mounting technology at the back side of FPC 32; And the lower limb of FPC 32 extends a golden finger 33.The front of glue frame 1 sill 10 is fixed at the back side of FPC 32 by double faced adhesive tape 4.Correspondingly, three LED 31 that are welded in FPC 32 fronts be contained in three grooves 13 of these sill 10 upper surfaces respectively and the light-emitting area of three LED 31 towards the incidence surface of LGP 2.
Wherein, LED 31 is the illuminated LED of side, referring to Fig. 3 a and Fig. 3 b, each LED 31 is a light-emitting area 310 towards the side of Fig. 3 a and Fig. 3 b top, and each LED 31 has depressed part 311 towards the another side of Fig. 3 a and Fig. 3 b below, and the another side with depressed part 311 contacts with the bottom surface of groove 13; And, only be to be example among Fig. 1 with three LED 31, three grooves 13, the LED 31 of any amount and the groove 13 identical with LED 31 quantity can be set in the practical application.
In addition, some blooming pieces 6 are fitted in the front of glue frame 1 is embedded in glue frame 1 and with the exiting surface of LGP 2 successively; Shading patch 7 then is pasted on the front outer surface of glue frame 1 and blooming piece 6 is fixed in the glue frame 1.
Like this, the light beam of light-emitting area 310 ejaculations of LED 31 is incident upon the inside of LGP 2 from LGP 2 incidence surfaces; Be incident upon the light beam of LGP 2 inside, can inject earlier after the site face is also broken up, the exiting surface by LGP 2 penetrates to blooming piece 6 again; Reflector plate 5 then is in the light reflected back LGP 2 that a part is penetrated from the site face, to improve the utilization rate of luminous energy; All penetrate to the light beam of blooming piece 6 and all can evenly penetrate from the one side of blooming piece 6 face away from light guide 2.
In the practical application, the light beam that penetrates for the light-emitting area 310 that guarantees LED 31 can all be incident upon the inside of LGP 2 from LGP 2 incidence surfaces, should make the light-emitting area of LED 31 closely contact with the incidence surface of LGP 2 bottoms.The rear view of the assembly structure of glue frame, luminescence component and LGP in the module existing backlight shown in Fig. 1 sees also Fig. 2.
Yet, in the prior art, in order to guarantee LED 31 relatively easily can be put into to groove 13 in the assembling process of module backlight, width and depth dimensions that groove 13 all can be set usually all are slightly larger than LED 31, promptly make LED 31 and groove 13 matched in clearance.Thus, will there be following problem:
If there is the gap with groove 13 in 1 LED 31 on groove 13 widths, then LED 31 may produce side-play amount on groove 13 widths, and because the FPC 32 at LED 31 places is fixed in sill 10 by double faced adhesive tape 4, thereby FPC 32 also can be in the side-play amount that produces under the drive of LED 31 on groove 13 widths, thereby causes the skew of the extended golden finger of FPC 32 lower limbs position;
If there is the gap with groove 13 in 2 LED 31 on groove 13 depth directions, then the light-emitting area 310 of LED 31 may and LGP 2 incidence surfaces between have big gap, the light beam that makes LED 31 light-emitting areas penetrate can't all be incident upon in the LGP 2 from LGP 2 incidence surfaces, thereby reduces the luminosity of module backlight.
The problems referred to above all can cause the yields of module backlight lower.
The utility model content
In view of this, the utility model provides the glue frame in a kind of module backlight and a kind of module backlight, can improve the yields of module backlight.
The module a kind of backlight that the utility model provides comprises: glue frame, luminescence component, LGP,
Described glue frame is a framework, and the upper surface of described glue frame sill has groove;
Described LGP is the laminated structure with predetermined thickness; Described LGP be embedded in the described glue frame and the incidence surface of its bottom towards the bottom surface of described groove;
Comprise FPC FPC in the described luminescence component, the edge of described FPC has golden finger, and the described FPC one side that is welded with LED is fixed in the front of described glue frame sill;
Described LED is contained in the described groove; The light-emitting area of described LED is towards the incidence surface of described LGP, and described LED has depressed part towards the one side of described groove;
The bottom surface of described groove has projection in the position of the described LED depressed part of correspondence, and described depressed part is connected in described projection.
Glue frame in the module a kind of backlight that the utility model provides, described glue frame is a framework, the sill upper surface of described glue frame has the groove that has the LED placement of depressed part for the one side towards described groove;
It is characterized in that,
The bottom surface of described groove has projection in the position of the described LED depressed part of correspondence, for described depressed part clamping.
As seen from the above technical solution, because the one side of LED face away from light guide incidence surface has depressed part, therefore, the utility model is provided with the projection of corresponding LED depressed part in the groove floor of glue frame sill.LED is contained in the groove, then the depressed part of LED can be connected in the projection of groove floor, thereby the free degree of LED on the recess width direction limited by this projection, make LED can on the recess width direction, not produce side-play amount, avoided having the skew of FPC on the recess width direction of golden finger; And, the projection of groove floor can be at the direction upper support LED towards LGP bottom incidence surface, make LED can be positioned as close to LGP bottom incidence surface towards the light-emitting area of LGP bottom incidence surface, thereby guarantee that the light beam that the LED light-emitting area penetrates all is incident upon in the LGP from the incidence surface of LGP bottom as much as possible, improves the luminosity of module backlight.Like this, just improved the yields of module backlight.
In addition, if each LED welding deflection in FPC front, after being mounted to the glue frame, the luminescence component that then will comprise FPC and LED can cause the luminous bad of module backlight, but in the utility model, owing to protruding existence makes the luminescence component of LED welding deflection can't be mounted to the glue frame, thereby can filter out the substandard products in the luminescence component easily, guarantee the yields of module backlight.
Description of drawings
Fig. 1 is the decomposition texture schematic diagram of existing module backlight.
Fig. 2 is the assembly structure rear view of glue frame, luminescence component and LGP in the existing module backlight.
Fig. 3 a is existing LED front view.
Fig. 3 b is the stereogram of existing LED.
Fig. 4 a is the glue frame rear view in the module backlight among the utility model embodiment.
Fig. 4 b is the glue frame stereogram in the module backlight among the utility model embodiment.
Fig. 5 a is the rear view of glue frame in the module backlight among the utility model embodiment, luminescence component and LGP.
Fig. 5 b is the assembly structure stereogram of glue frame in the module backlight among the utility model embodiment, luminescence component and LGP.
The specific embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
Referring to Fig. 3 a and Fig. 3 b; because existing LED 31 can have depressed part 311 usually in the one side of face away from light guide 2 bottom incidence surfaces; therefore; shown in Fig. 4 a and Fig. 4 b; with three LED 31, three grooves 13 is example, and the utility model is set up a projection 40 in each groove 13 bottom surface of glue frame 1 sill 10 upper surfaces.
Referring to Fig. 4 a and Fig. 4 b and in conjunction with Fig. 3 a and Fig. 3 b, be positioned at its situation for the depressed part 311 of LED31 towards center, one side, groove 13 bottom surfaces, groove 13 bottom surfaces correspondingly have projection 40 in the center.That is to say that groove 13 bottom surfaces have projection 40 in the position of corresponding LED 31 depressed parts 311.
Like this, referring to Fig. 5 a and Fig. 5 b, glue frame 1 is the framework of a rectangle, and the upper surface of glue frame 1 sill 10 has three grooves 13, and the bottom surface of each groove 13, has a projection 40 in the center of corresponding LED 31 depressed parts 311.
FPC in the luminescence component 3 32 back sides are fixed in the front of glue frame 1 sill 10; Three LED 31 that then are welded in FPC 32 back sides are contained in respectively in three grooves 13 of these sill 10 upper surfaces.
Wherein, the light-emitting area of each LED 31 is towards the incidence surface of LGP 2, and each LED 31 face away from light guide, 2 incidence surface and another side with depressed part 311 be towards groove 13 bottom surfaces, and depressed part 311 is connected in the projection 40 of respective slot 13 bottom surfaces.
Certainly, the foregoing description only is to be example with three LED 31, three grooves 13, and the LED 31 of any amount and the groove 13 identical with LED 31 quantity can be set in the practical application.
Specifically, in order to realize the clamping of depressed part 311 and projection 40, the size of projection 40 can satisfy following condition:
Too small and be difficult to supporting role on groove 13 depth directions for fear of projection 40, projection 40 is slightly larger than the degree of depth of depressed part 311 on groove 13 depth directions at the height on groove 13 depth directions, makes the light-emitting area 310 of LED 31 infinitely closely to contact near LGP 2 incidence surfaces even with LGP 2 incidence surfaces; Wherein, the difference that the gap equals the degree of depth of projection 40 height and depressed part 311 is d, and what 0<d≤Δ t, Δ t were the degree of depth of groove 13 and LED 31 perpendicular to the height on light-emitting area 310 directions is poor;
Too small and be difficult to play location and the restriction on groove 13 widths to LED 31 for fear of projection 40, the width bs of part on groove 13 widths that projection 40 is contained in depressed part 311 inside satisfy: (l-Δ l)<b≤l Max, poor, the l of the width that l is the width of depressed part 311 on groove 13 widths, Δ l is LED 31 and the width of groove 13 MaxThe interference fit full-size that depressed part 311 is allowed on its width.
Further, when satisfying above-mentioned condition, excessive and cause that LED 31 is difficult for putting into to groove 13 in the installation process of module backlight for fear of projection 40, alternatively, projection 40 parts that are contained in depressed part 311 inside are set are slightly less than the width l of depressed part 311 on groove 13 widths at the width b on groove 13 widths, i.e. (l-Δ l)<b<l is so that LED 31 can relatively easily put into to groove 13.
And for shape, then can satisfy under the prerequisite of size condition, decide according to the shape of the depressed part 311 of LED 31.Projection 40 preferably is set for ganoid hemispherical so that hemispheric protruding 40 can with tangent contact of the LED inner surface of 31 depressed parts 311 on all directions.Certainly, as long as can produce aforesaid effect, the shape that projection 40 also can be set to other, for example identical shape with depressed part 311.
As seen, because the depressed part 311 of LED 31 can be connected in the projection 40 of groove 13 bottom surfaces, thereby the free degree of LED 31 on groove 13 widths is by these projection 40 restrictions, make LED 31 can on groove 13 widths, not produce side-play amount, avoided having the skew of FPC 32 on the recess width direction of golden finger 33; And, the projection 40 of groove 13 bottom surfaces can be at the direction upper support LED 31 towards LGP 2 bottom incidence surfaces, make LED 31 can be positioned as close to this incidence surface even closely contact with this incidence surface towards the light-emitting area of LGP 2 bottom incidence surfaces, thereby guarantee light beam that LED 31 light-emitting areas penetrate as much as possible all the incidence surface from LGP 2 bottoms be incident upon in the LGP 2, to improve the luminosity of module backlight.
In addition, if each LED 31 welding deflection in FPC 32 fronts, after being mounted to glue frame 1, the luminescence component that then will comprise FPC 32 and LED31 can cause the luminous bad of module backlight, but in the utility model, existence owing to protruding 40 makes the luminescence component of LED 31 welding deflections can't be mounted to glue frame 1, thereby can filter out the substandard products in the luminescence component easily, guarantee the yields of module backlight.
The above is preferred embodiment of the present utility model only, is not to be used to limit protection domain of the present utility model.All within spirit of the present utility model and principle, any modification of being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.

Claims (10)

1, a kind of module backlight comprises: glue frame (1), luminescence component (3), LGP (2),
Described glue frame (1) is a framework, and the upper surface of described glue frame (1) sill (10) has groove (13);
Described LGP (2) is for having the laminated structure of predetermined thickness; Described LGP (2) be embedded in the described glue frame (1) and the incidence surface of its bottom towards the bottom surface of described groove (13);
Comprise FPC FPC (32) in the described luminescence component (3), the edge of described FPC (32) has golden finger (33), and described FPC (32) one side that is welded with LED (31) is fixed in the front of described glue frame (1) sill (10);
Described LED (31) is contained in the described groove (13);
The light-emitting area of described LED (31) is towards the incidence surface of described LGP (2), and described LED (31) has depressed part (311) towards the one side of described groove (13);
It is characterized in that,
The bottom surface of described groove (13) has projection (40) in the position of the described LED of correspondence (31) depressed part (311), and described depressed part (311) is connected in described projection (40).
2, module backlight as claimed in claim 1 is characterized in that,
The height of described projection (40) is greater than the degree of depth of described depressed part (311), and the degree of depth of the height of described projection (40) and described depressed part (311) is poor, poor smaller or equal to the height of the degree of depth of described groove (13) and described LED (31);
The width of described projection (40) is greater than the poor of the width of the width of described LED (31) and described groove (13) and the interference fit full-size that allowed on width smaller or equal to described depressed part (311).
3, module backlight as claimed in claim 2 is characterized in that, the width of described projection (40) is greater than the poor of the width of the width of described LED (31) and described groove (13) and less than the width of described depressed part (311).
4, as any described module backlight in the claim 1 to 3, it is characterized in that,
Described depressed part (311) is positioned at the center of described LED (31) towards described groove (13) one side;
Described projection (40) is positioned at the center of described groove (13) bottom surface.
As any described module backlight in the claim 1 to 3, it is characterized in that 5, the shape of described projection (40) is identical with described depressed part (311) or be hemispherical.
6, the glue frame in a kind of module backlight, described glue frame is a framework, the sill of described glue frame (10) upper surface has the groove (13) that has LED (31) placement of depressed part (311) for the one side towards described groove (13);
It is characterized in that,
The bottom surface of described groove (13) has projection (40) in the position of the described LED of correspondence (31) depressed part (311), for described depressed part (311) clamping.
7, glue frame as claimed in claim 6 is characterized in that,
The height of described projection (40) is greater than the degree of depth of described depressed part (311), and the degree of depth of the height of described projection (40) and described depressed part (311) is poor, poor smaller or equal to the height of the degree of depth of described groove (13) and described LED (31);
The width of described projection (40) is greater than the poor of the width of the width of described LED (31) and described groove (13) and the interference fit full-size that allowed on described width smaller or equal to described depressed part (311).
8, glue frame as claimed in claim 7 is characterized in that, the width of described projection (40) is greater than the poor of the width of the width of described LED (31) and described groove (13) and less than the width of described depressed part (311).
9, as any described glue frame in the claim 6 to 8, it is characterized in that,
Described depressed part (311) is positioned at the center of described LED (31) towards described groove (13) one side;
Described projection (40) is positioned at the center of described groove (13) bottom surface.
As any described glue frame in the claim 6 to 8, it is characterized in that 10, the shape of described projection (40) is identical with described depressed part (311) or be hemispherical.
CNU2008201157880U 2008-07-30 2008-07-30 Backlight module unit and glue frame in backlight module unit Expired - Lifetime CN201242066Y (en)

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Application Number Priority Date Filing Date Title
CNU2008201157880U CN201242066Y (en) 2008-07-30 2008-07-30 Backlight module unit and glue frame in backlight module unit

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Application Number Priority Date Filing Date Title
CNU2008201157880U CN201242066Y (en) 2008-07-30 2008-07-30 Backlight module unit and glue frame in backlight module unit

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103148399A (en) * 2011-12-06 2013-06-12 深圳市德仓科技有限公司 Assembling method of backlight module
CN103323904A (en) * 2013-06-21 2013-09-25 北京京东方光电科技有限公司 Light guide plate, backlight module and display device including same
WO2016150067A1 (en) * 2015-03-26 2016-09-29 京东方科技集团股份有限公司 Backlight source and display device
CN107270180A (en) * 2017-06-28 2017-10-20 维沃移动通信有限公司 A kind of backlight module, display module and mobile terminal
CN108254826A (en) * 2018-03-23 2018-07-06 东莞市博辉光电科技有限公司 Both sides plece-cliped type backlight assembly semi-finished product and its packaging technology, assembled fixture
US10338293B2 (en) 2015-03-26 2019-07-02 Boe Technology Group Co., Ltd. Backlight source and display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103148399A (en) * 2011-12-06 2013-06-12 深圳市德仓科技有限公司 Assembling method of backlight module
CN103323904A (en) * 2013-06-21 2013-09-25 北京京东方光电科技有限公司 Light guide plate, backlight module and display device including same
WO2016150067A1 (en) * 2015-03-26 2016-09-29 京东方科技集团股份有限公司 Backlight source and display device
US10338293B2 (en) 2015-03-26 2019-07-02 Boe Technology Group Co., Ltd. Backlight source and display device
CN107270180A (en) * 2017-06-28 2017-10-20 维沃移动通信有限公司 A kind of backlight module, display module and mobile terminal
CN108254826A (en) * 2018-03-23 2018-07-06 东莞市博辉光电科技有限公司 Both sides plece-cliped type backlight assembly semi-finished product and its packaging technology, assembled fixture

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C14 Grant of patent or utility model
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ASS Succession or assignment of patent right

Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD.

Free format text: FORMER OWNER: BIYADI CO., LTD.

Effective date: 20150901

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150901

Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee after: Shenzhen BYD Electronic Component Co., Ltd.

Address before: 518118 Pingshan Road, Pingshan Town, Shenzhen, Guangdong, No. 3001, No.

Patentee before: Biyadi Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20090520

CX01 Expiry of patent term