CN201199758Y

CN201199758Y - Structure for covering surface of electronic apparatus shell

Info

Publication number: CN201199758Y
Application number: CNU200820071683XU
Authority: CN
Inventors: 徐钲鉴
Original assignee: 徐钲鉴
Current assignee: SHANGHAI HUAN HSIN ELECTRONICS CO., LTD.
Priority date: 2008-04-14
Filing date: 2008-04-14
Publication date: 2009-02-25
Anticipated expiration: 2018-04-14

Abstract

The utility model relates to a surface cladding structure of the casing of an electronic device, which belongs to the mechanical and electrical field. The casing of the electronic device is a substrate, a sputtering coating is arranged on the surface of the substrate, and a coloring area is formed on the surface of the sputtering coating. The surface cladding structure has the advantages that since the sputtering coating is formed on the surface of the substrate, and the maximum thickness of the sputtering coating is 0.001mm; the sputtering coating can not disturb the transmission of the wireless signals, therefore, good communication quality can be maintained; in addition that the sputtering coating is formed on the surface of the substrate, the coloring area can be generated on the surface of the substrate by electric treating.

Description

The surperficial coating structure of electronic device housing

Technical field

The utility model relates to electrical category, particularly a kind of surperficial coating structure of electronic device housing.

Background technology

As everyone knows, general electronic installation is for lightweight and be convenient to the manufacturing, its shell adopts plastic cement or plastic material made mostly, but the shell of plastic cement material manufacturing, effect and texture when vision or touching are relatively poor, therefore, the dealer can have good visual sense of beauty and texture for the shell that makes the electronic installation plastic cement, just the mode of electroplating by plastic cement, on the shell of plastic cement material, produce metal level is arranged, and produce the mode of metal level on plastic shell surface with the plastic cement plating mode, such as United States Patent (USP) 6045866 exposure.

But only can be more inactive metals such as copper, nickel in the metal level that employed plastic cement plating mode is plated, and as desire when using on the plastic cement plating mode as more active metal such as aluminium, its degree of difficulty is higher; Again and this plastic cement plating mode itself the step of process comparatively complicated, loaded down with trivial details so that on producing the low and spent cost height of efficient.

For solving the problem of plastic cement plating mode, therefore No. 5660934 patents of United States Patent (USP) have disclosed a kind of by the thermal spraying mode, on plastic parts, be formed with metal level, and the metal level on this plastic parts is directly to contact with external environment, to such an extent as to easily with environment in dirt contact and corrosion-vulnerable.

Disclose to have a kind ofly forming layer of aluminum or aluminium alloy covered by the thermal spraying mode in No. 090127645 patent of Taiwan patent, and the plastic casing that this surface has an aluminum or aluminum alloy coating is carried out anode treatment on the plastic casing surface.

Yet still there is following point in modes such as above-mentioned thermal spraying or plating in use:

One, when using the thermal spraying mode, each thickness that is sprayed is about 0.1～0.4mm, and the thickness that forms on the plastic casing surface is the aluminum or aluminum alloy coating of 0.6～1.2mm, therefore, it is formed overweight coating on plastic casing, and can't reach aluminum or aluminum alloy filming on the plastic casing;

No matter two is modes such as thermal spraying or plating, only can on plastic cement material, produce metal-like, and along with the consumer demand difference, and along with the strong competition in electronic product market, the metal-like that simple gold, silvery white etc. are dull, can't satisfy the demands of consumers, also lose the competitiveness in market simultaneously gradually;

Three, in the electronic product, still have many electronic products must carry out the transmission of signal by antenna, particularly mobile phone or notebook computer etc., for volume little, in light weight, area is big, in light weight, the plate aerial of thin thickness so adopt, carrying out signal receives and transmission, after yet above-mentioned mode in plating or thermal spraying produces metal-like, be equivalent on plastic shell, cover and be covered with metal thin shell, this metal thin shell is for plate aerial, form the effect of shielding, thereby cause the reception signal decrease in efficiency of plate aerial or antenna, need be improved.

The utility model content

The purpose of this utility model is to provide a kind of surperficial coating structure of electronic device housing, has solved the overweight coating that modes such as thermal spraying commonly used or plating exist, and can't reach aluminum or aluminum alloy filming on the plastic casing; The metal-like that simple gold, silvery white etc. are dull can't satisfy the demands of consumers; Metal thin shell causes the problems such as reception signal decrease in efficiency of antenna.

The technical solution of the utility model is: electronic device housing is a ground, and surface of bottom material is provided with sputtered layer, and this sputtered layer surface is formed with pigmented section.

Wherein, ground is non-metallic material or non-conductive materials such as plastic cement, rubber or timber;

Ground also can be metal material or conductive material such as iron, red metal or titanium alloy;

The sputtered surfaces material of sputtered layer is conducting metal materials such as red metal, brass, titanium alloy or aluminium;

The sputtered surfaces material of sputtered layer is non-conductive metal material;

Surface of bottom material is handled by sputter and is produced sputtered layer;

Sputter be treated to vacuum splashing and plating, plane two plate sputter, three-pole sputter, magnetic control sputtering plating or reaction sputter, radio frequency sputter or relevant sputter treatment technology one of them;

Sputtered layer by electricity handle to produce pigmented section;

Electricity handle can be that cation electrodeposition, anionic electrodeposition or associated electrical treatment technology one of them.

Advantage of the present utility model is: handle forming sputtered layer on surface of bottom material via sputter, and the thickness of sputtered layer is 0.001mm to the maximum, has the metal-like of high compaction film to make surface of bottom material; The sputtered layer of surface of bottom material is in the sputter process, sputtered surfaces material during its sputter can be non-conductive metal material, therefore, when ground is the shell of electronic installation of mobile phone, notebook computer, wireless router, tool Mobile Communications function, the sputtered layer of surface of bottom material can not interfere with the transmission of wireless signal, keeps the good communication quality; Surface of bottom material is except having sputtered layer, also can be by electricity handle to produce pigmented section, therefore, ground is except producing metal-like and the metal effect by sputtered layer, can also produce the pattern and the aesthetic feeling of different colours by pigmented section, mat makes the effect that produces different aspects on the sputtered layer, the ice-cold negative impression that the metal effect of can forgoing makes us producing.

Description of drawings:

Fig. 1 is a schematic perspective view of the present utility model;

Fig. 2 is a cross-sectional schematic of the present utility model;

Fig. 3 is a flow chart of the present utility model;

Fig. 4 is a schematic flow sheet of the present utility model.

Embodiment:

Shown in accompanying drawing 1 and accompanying drawing 2, the utility model electronic installation E shell is made as a ground A, via after the sputter processing, be provided with sputtered layer B, and the sputtered surfaces material B1 of sputtered layer B can be conducting metal material or non-conductive metal material on the ground A surface; Moreover, on the sputtered layer B on the surface of ground A, via electricity handle after, be provided with pigmented section C, by this, electronic installation E surface is except metal-like with high compaction film and can not interfere with the signal transmission, also has the aesthetic of color and pattern, and this sputtered layer B can be conducting metal materials such as red metal, brass, titanium alloy, aluminium one of them.

Shown in accompanying drawing 3 and accompanying drawing 4, surface layer coated structure is carried out according to the following step:

10, carrying out sputter on the ground A surface handles;

11, on ground A surface, be formed with sputtered layer B;

12, this sputtered layer B is carried out electricity and processing;

13, produce pigmented section C at sputtered layer B.

When above-mentioned steps is carried out, at first carry out sputter at ground A surface and handle, the ground A after sputter is handled just can form the sputtered layer B with metal-like and metal effect on the surface of ground A, in the process that sputter is handled, include non-conductive metal material B1 in the sputtered layer B simultaneously; Continuous sputtered layer B with ground A carries out electricity and processing, can produce pigmented section C on the sputtered layer B after electricity processing.

In the sputter of above-mentioned

steps

10,11 was handled, this sputter processing can be sputter treatment technologies such as vacuum splashing and plating, plane two plate sputter, three-pole sputter, magnetic control sputtering plating, reaction sputter, radio frequency sputter and form sputtered layer B on ground A surface.

At the electricity of above-mentioned

steps

12,13 and to handle, this electricity handle can be that cation electrodeposition, anionic electrodeposition or associated electrical treatment technology one of them;

Above-mentioned ground A can be non-metallic material or non-conductive materials such as plastic cement, rubber, timber, also can be metal material or conductive material such as iron, red metal, titanium alloy; The sputtered surfaces material B1 of sputtered layer B can be non-metallic material or non-conductive material, and perhaps the sputtered surfaces material B1 of sputtered layer B is metal material or conductive material.

Claims

1. the surperficial coating structure of an electronic device housing, it is characterized in that: electronic device housing is a ground, and surface of bottom material is provided with sputtered layer, this sputtered layer surface is formed with pigmented section.

2. the surperficial coating structure of electronic device housing according to claim 1, it is characterized in that: described ground is non-metallic material or non-conductive material, and this non-metallic material or non-conductive material are plastic cement, rubber or timber.

3. the surperficial coating structure of electronic device housing according to claim 1, it is characterized in that: described ground is metal material or conductive material, this metal material or conductive material are iron, red metal or titanium alloy.

4. the surperficial coating structure of electronic device housing according to claim 1, it is characterized in that: the sputtered surfaces material of described sputtered layer is the conducting metal material, this conducting metal material is red metal, brass, titanium alloy or aluminium.

5. the surperficial coating structure of electronic device housing according to claim 1, it is characterized in that: the sputtered surfaces material of described sputtered layer is non-conductive metal material.