CN201198888Y - Memory alloy part composite damping device - Google Patents

Memory alloy part composite damping device Download PDF

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Publication number
CN201198888Y
CN201198888Y CNU2008200786438U CN200820078643U CN201198888Y CN 201198888 Y CN201198888 Y CN 201198888Y CN U2008200786438 U CNU2008200786438 U CN U2008200786438U CN 200820078643 U CN200820078643 U CN 200820078643U CN 201198888 Y CN201198888 Y CN 201198888Y
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CN
China
Prior art keywords
memory alloy
spring sheet
circuit board
vibration
damping device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008200786438U
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Chinese (zh)
Inventor
包锦忠
刘冬妹
姚芳
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Aerospace Dongfanghong Satellite Co Ltd
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Aerospace Dongfanghong Satellite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aerospace Dongfanghong Satellite Co Ltd filed Critical Aerospace Dongfanghong Satellite Co Ltd
Priority to CNU2008200786438U priority Critical patent/CN201198888Y/en
Application granted granted Critical
Publication of CN201198888Y publication Critical patent/CN201198888Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a memory alloy part combination damping device, comprising a memory alloy spring sheet (1) and a corner strip (3); the memory alloy spring sheet (1) and the corner strip (3) are arranged in a slot inside an electric case face to face; the damping device also comprises a supporting circuit board (2); the shape of the memory alloy spring sheet (1) is an arc-shaped spring sheet and one vertical side thereof is an installation surface; when the number of the memory alloy spring sheet (1) is more than 1, the installation surface can be a shared bar-shaped installation surface. The memory alloy part combination damping device can sufficiently play the characteristic of different springs by the spring combination damping of different types, mutually complements the advantages, and has better anti-vibration and damping effects, less installation space for anti-vibration and damping and lighter weight.

Description

Memory alloy spare combination vibration damping equipment
Technical field
The utility model relates to a kind of spring assembly vibration damping equipment, especially for the vibration damping and vibration isolation device little bulk of cabinet circuit board, the combination of inhomogeneity memory alloy spring.
Background technique
Functional for guaranteeing the electronic cabinet interior circuit board, the vibration isolation and damping of electronic cabinet is had relatively high expectations.General rigidity with metal framework intensifier circuit plate, with the vibratory response value of minimizing circuit board, but the weight of this device is bigger than normal, and effectiveness in vibration suppression is limited.Also have employing in the electronic cabinet slot skewback to be installed, the method that compresses circuit plugboard with the adjusting long bolt is come vibration damping, but the part that this vibration damping mode is used is on the high side, and because vibratory response is bigger, still has the possibility that makes electronic device lose efficacy or damage.Simultaneously, these two kinds of vibration damping equipments position that takes up room is bigger.When independent employing memory alloy spring vibration damping and vibration isolation, because chassis space is less, superelasticity vibration damping deformation space is limited, surpasses still might make the circuit board overload and electronic device was lost efficacy behind its curve platform to damage.
Domestic and international by retrieval pertinent literature is not seen and is utilized memory alloy spring to be combined in the report of the device and method of small space vibration damping.
The model utility content
Technology of the present utility model is dealt with problems and is: overcome the deficiencies in the prior art, a kind of memory alloy spare combination vibration damping equipment that uses in little space is provided.
Technical solution of the present utility model is: memory alloy spare combination vibration damping equipment, comprise memory alloy spring sheet and memory alloy angle bead composition, memory alloy spring sheet and memory alloy angle bead are installed in the interior slot of electronic cabinet in opposite directions, support the circuit board in the slot.
Described memory alloy spring sheet be shaped as arc-shaped spring piece, in its vertical side one attachment face is arranged.The quantity of described memory alloy spring sheet is during greater than one, and its attachment face is a shared bar shaped attachment face.
Working principle of the present utility model is: the vibration damping and vibration isolation installing space of cabinet slot interior circuit board is very little, and the damping effect space is littler.Memory alloy material has superelasticity and high damping, after external force arrives certain value, only increases displacement, active force does not increase, the support stiffness of circuit board is descended, and response frequency moves down and leaves the frequency zones of former peak value, can reach the final purpose of memory alloy spring vibration damping and vibration isolation.
Be contained in the slot with good, hyperelastic memory alloy arc-shaped spring piece of damping and amortization and memory alloy angle bead, dissimilar superelasticity spring assembly vibration dampings, guaranteed circuit board reliable mechanical loading condition in electronic cabinet.
The utility model advantage compared with prior art is:
1,, can give full play to the characteristic of different springs, complementary advantage, vibration damping and vibration isolation better effects if by adopting the memory alloy spring sheet and the spring assembly vibration damping of memory alloy angle bead at small spaces such as electronic cabinets.
2, adopt the little line segment contact circuit of arc memory alloy spring sheet plate, can play a part to support; The memory alloy angle bead has increased the local support rigidity of circuit board by line or face contact circuit plate, reduces magnification factor.
3, a plurality of memory alloy spring sheets and the installation that is connected as a single entity under the situation that does not take more useful spaces, have further strengthened effectiveness in vibration suppression.
Description of drawings
Fig. 1 is a memory alloy spring chip module of the present utility model;
Fig. 2 is a memory alloy angle bead of the present utility model;
Fig. 3 is the vertical installment state schematic representation of circuit board in slot;
Fig. 4 is circuit board horizontal installment state schematic representation that dissects in slot;
Fig. 5 is preceding low magnitude vibration response curve for the 0.7g circuit board shakes;
Fig. 6 is back low magnitude vibration response curve for the 0.7g circuit board shakes.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Memory alloy spare combination vibration damping equipment of the present utility model is made up of memory alloy spring sheet 1 and memory alloy angle bead 3.Memory alloy spring sheet 1 is an arc, is illustrated in figure 1 as the profile of a plurality of spring sheet combinations.Figure 2 shows that memory alloy angle bead 3, form by orthogonal two planes.
Among Fig. 3, circuit board 2 is vertically placed in slot, the circuit board 2 that spring sheet 1 and angle bead 3 support in the slot 4, and spring sheet 1 contacts with circuit board 2 lines, and angle bead 3 contacts with 2 of circuit boards or the line contact.Among Fig. 4, circuit board 2 is laterally placed in slot 4, the circuit board 2 that spring sheet 1 and angle bead 3 support in the slot 4, and spring sheet 1 contacts with circuit board 2 lines, and angle bead 3 contacts with 2 of circuit boards or the line contact.
Fig. 5 is the vibration response curve of the low magnitude of 0.7g, and Fig. 6 is the back vibration response curve that hangs down magnitude for 0.7g shakes.Curve A is the contrast by Fig. 5 and Fig. 6 among the figure, can see that big variation does not take place the vibratory response characteristic, illustrates that the rigidity of cabinet circuit board does not become, and has passed through vibration test.

Claims (3)

1. memory alloy spare makes up vibration damping equipment, it is characterized in that: comprise at least one memory alloy spring sheet (1) and memory alloy angle bead (3), memory alloy spring sheet (1) and memory alloy angle bead (3) are installed in the interior slot (4) of electronic cabinet in opposite directions, support the circuit board (2) in the slot (4).
2. according to the memory alloy spare of claim 1 combination vibration damping equipment, it is characterized in that: described memory alloy spring sheet (1) be shaped as arc-shaped spring piece, be attachment face in its vertical side.
3. according to the memory alloy spare of claim 2 combination vibration damping equipment, it is characterized in that: the quantity of described memory alloy spring sheet (1) is during greater than one, and the attachment face of its vertical side is a shared bar shaped attachment face.
CNU2008200786438U 2008-01-21 2008-01-21 Memory alloy part composite damping device Expired - Lifetime CN201198888Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200786438U CN201198888Y (en) 2008-01-21 2008-01-21 Memory alloy part composite damping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200786438U CN201198888Y (en) 2008-01-21 2008-01-21 Memory alloy part composite damping device

Publications (1)

Publication Number Publication Date
CN201198888Y true CN201198888Y (en) 2009-02-25

Family

ID=40450043

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200786438U Expired - Lifetime CN201198888Y (en) 2008-01-21 2008-01-21 Memory alloy part composite damping device

Country Status (1)

Country Link
CN (1) CN201198888Y (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102242792A (en) * 2011-07-14 2011-11-16 北京伟林科信科技有限公司 Six-degree-of-freedom balance buffer
CN103603442A (en) * 2013-11-25 2014-02-26 辽宁工业大学 Arch memory alloy leaf spring universal damper
CN106065914A (en) * 2016-08-19 2016-11-02 南京工业大学 Novel vibration isolation pad for precision instrument
CN108904133A (en) * 2018-05-30 2018-11-30 合肥市第二人民医院 A kind of adjusting buffer unit for tinnitus therapeutic apparatus
CN110905094A (en) * 2019-11-30 2020-03-24 南宁学院 Steel beam damping structure

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102242792A (en) * 2011-07-14 2011-11-16 北京伟林科信科技有限公司 Six-degree-of-freedom balance buffer
CN102242792B (en) * 2011-07-14 2013-03-27 北京新航智科技有限公司 Six-degree-of-freedom balance buffer
CN103603442A (en) * 2013-11-25 2014-02-26 辽宁工业大学 Arch memory alloy leaf spring universal damper
CN103603442B (en) * 2013-11-25 2015-12-30 辽宁工业大学 The universal damper of arc memory alloy spring sheet
CN106065914A (en) * 2016-08-19 2016-11-02 南京工业大学 Novel vibration isolation pad for precision instrument
CN106065914B (en) * 2016-08-19 2018-07-17 南京工业大学 Novel vibration isolation pad for precision instrument
CN108904133A (en) * 2018-05-30 2018-11-30 合肥市第二人民医院 A kind of adjusting buffer unit for tinnitus therapeutic apparatus
CN108904133B (en) * 2018-05-30 2020-06-05 合肥市第二人民医院 A adjust buffer for tinnitus therapeutic instrument
CN110905094A (en) * 2019-11-30 2020-03-24 南宁学院 Steel beam damping structure
CN110905094B (en) * 2019-11-30 2021-05-07 南宁学院 Steel beam damping structure

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CX01 Expiry of patent term

Granted publication date: 20090225

CX01 Expiry of patent term