CN201181387Y - Photo-etching machine silicon slice bench exchanging set adopting cross sliding rail - Google Patents
Photo-etching machine silicon slice bench exchanging set adopting cross sliding rail Download PDFInfo
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- CN201181387Y CN201181387Y CNU2007201873458U CN200720187345U CN201181387Y CN 201181387 Y CN201181387 Y CN 201181387Y CN U2007201873458 U CNU2007201873458 U CN U2007201873458U CN 200720187345 U CN200720187345 U CN 200720187345U CN 201181387 Y CN201181387 Y CN 201181387Y
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- silicon chip
- silicon wafer
- chip platform
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- electric motors
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 95
- 239000010703 silicon Substances 0.000 title claims abstract description 95
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 238000001259 photo etching Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001684 chronic effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The utility model relates to a dual-silicon wafer table switching device of a photoetching machine with a cross shaped guide track, which is mainly used in the semiconductor photoetching machine. The dual-silicon wafer table switching device comprises a silicon wafer table operating in a pretreatment position, a silicon wafer table operating in an exposure position, and two cross shaped guide track driving units. Each cross shaped guide track driving unit comprises an X-direction linear motor, a Y-direction linear motor and a push rod for pushing the silicon wafer tables to move. The cross shaped guide track driving units are sucked on the silicon wafer tables via vacuum bearings to drive the silicon wafer tables to perform large-range X-direction and Y-direction movement. The dual-silicon wafer table switching device adopts two dual-freedom driving units, so as to greatly simplify device structure and effectively reduce the requirements for synchronous control.
Description
Technical field
The utility model relates to a kind of photo-etching machine silicon chip platform double-platform switch, and this device is mainly used in the semiconductor lithography machine, belongs to semiconductor and makes the equipment technology field.
Background technology
In the production run of integrated circuit (IC) chip, the exposure transfer printing (photoetching) of the design configuration of chip on the silicon chip surface photoresist is one of most important operation wherein, and the used equipment of this operation is called litho machine (exposure machine).The resolution of litho machine and exposure efficiency affect the characteristic line breadth (resolution) and the throughput rate of integrated circuit (IC) chip greatly.And, determined the resolution and the exposure efficiency of litho machine again to a great extent as the kinematic accuracy and the work efficiency of the silicon chip ultraprecise motion positions device (being designated hereinafter simply as the silicon chip platform) of litho machine key device.
The advanced scanning projecting photoetching machine ultimate principle as shown in Figure 1.From the deep UV (ultraviolet light) of light source 45 see through mask 47, lens devices 49 with a part of pattern imaging on the mask on certain Chip of silicon chip 50.Mask and silicon chip oppositely are synchronized with the movement by certain speed proportional, and the whole pattern imagings on the mask are on the certain chip (Chip) of silicon chip the most at last.
The basic role of silicon chip platform motion positions device is exactly to carry silicon chip and by speed of setting and direction motion, to realize the accurate transfer in mask figure each zone on silicon chip in exposure process.Because the live width of chip very little (minimum feature has reached 45nm at present) for guaranteeing the alignment precision and the resolution of photoetching, just requires the silicon chip platform to have high motion positions precision; Because the movement velocity of silicon chip platform affects the throughput rate of photoetching to a great extent, from the angle of boosting productivity, requires the movement velocity of silicon chip platform to improve constantly again.
Traditional silicon chip platform, described as patent EP 0729073 and patent US 5996437, have only a silicon chip motion positions unit in the litho machine, i.e. a silicon chip platform.Preliminary works such as leveling and focusing all will be finished in the above, and required chronic of these work particularly aimed at, owing to require to carry out the high low-velocity scanning of precision (typical alignment scanning speed is 1mm/s), so required time is very long.And it is very difficult to reduce its working time.Like this, in order to improve the production efficiency of litho machine, just must improve constantly the movement velocity of the stepping and the exposure scanning of silicon chip platform.And the raising of speed will unavoidably cause the deterioration of device dynamic property, need take a large amount of technical measures guarantees and improve the kinematic accuracy of silicon chip platform, will improve greatly for keeping existing precision or reaching the cost that high precision more will pay.
Patent W098/40791 (open date: 1998.9.17; Country origin: Holland) described structure adopts two silicon chip platform structures, and exposure preliminary works such as sheet, prealignment, aligning are transferred on second silicon chip platform up and down, and with the while self-movement of exposure silicon chip platform.Under the prerequisite that does not improve silicon chip platform movement velocity, a large amount of preliminary work of exposure silicon chip platform is shared by second silicon chip platform, thereby has shortened the every working time of silicon chip on exposure silicon chip platform greatly, has increased substantially production efficiency.Yet the major defect that this device exists is the non-barycenter driving problems of silicon chip table apparatus.
The applicant is at utility model patent " the two chaptrels of stepping projection mask aligner change exposure ultraprecise location the silicon chip devices " (number of patent application: ZL03156436.4) disclose a kind of two silicon chip platform switching fabrics with the double-side straight-line guide rail of application in 2003, this pair silicon chip table apparatus does not exist overlapping on work space, therefore need not adopt the crash protection device.But also there are some problems in this pair silicon chip table apparatus, the one, and the guide rail merging precision that this matching requirements is high; The 2nd, this device bilateral guide rail has only a side space to be utilized simultaneously, causes this silicon chip table apparatus physical dimension bigger, and this semi-conductor chip factory that space availability ratio is had relatively high expectations seems very important undoubtedly.The 3rd, need adopt the bridge-set of being with drive unit during this device silicon chip platform exchange, increased the complicacy of device.
The applicant is at utility model patent " a kind of photo-etching machine silicon chip platform double-platform switch " (number of patent application: 200710119275.7) disclose a kind of structure that is realized the silicon slice bench double-bench exchange by 4 groups of double freedom driver elements of application in 2007, advantages such as this device has simple in structure, and physical dimension is less.Yet,, therefore install synchro control had relatively high expectations because the motion of silicon chip platform is by realizations that be synchronized with the movement of two adjacent double freedom driver elements.
The utility model content
The utility model proposes a kind of photo-etching machine silicon chip platform double-platform switch that adopts cross guide rail at above-mentioned utility model application complex structure and to installing deficiency and the defective that synchro control is had relatively high expectations
The technical solution of the utility model is as follows:
A kind of photo-etching machine silicon chip platform double-platform switch that adopts cross guide rail, this device contains the silicon chip platform that runs on the pre-service station and runs on the silicon chip platform of exposure station, described two silicon chip platforms are arranged on the base station, and be suspended in the base station surface by air-bearing, it is characterized in that: this device adopts two cross guide rail driver elements, be separately positioned on the edge on the relative both sides of base station, each cross guide rail driver element comprises X to linear electric motors, Y is to linear electric motors and push rod, X is installed in the groove at base station edge to the stator of linear electric motors, and mover is installed in the lower bottom part of cross guide rail driver element; Y to linear electric motors and X to the linear electric motors stacked, and with X to the linear electric motors quadrature; Hold by vacuum operating bearing between described cross guide rail driver element and the silicon chip platform, vacuum operating bearing is arranged in the side of push rod and silicon chip platform.
The utility model and the photo-etching machine silicon chip platform double-platform switch (application number: 200710119275.7) compare of the applicant in first to file, reduced by two cover double freedom driver elements, apparatus structure is simplified greatly, effectively reduced the requirement of synchro control.
Description of drawings
Fig. 1 has shown the advanced scanning projecting photoetching machine basic functional principle.
Fig. 2 is the motion positions device of single silicon-chip platform.
Fig. 3 is two silicon chip platform motion positions devices that the utility model provides.
Fig. 4 a shown in the cross guide rail driver element X to the installation site of Y to linear electric motors.
Fig. 4 b is the structural representation of push rod.
Fig. 5 a, Fig. 5 b and Fig. 5 c have represented the view in two silicon chip platform exchange process respectively.
Among the figure:
1-silicon chip platform; 4-cross guide rail driver element; 5-X is to linear electric motors; 7-Y is to linear electric motors; The 8-push rod; The 11-base station; The 45-light source; The 47-mask; The 49-lens devices; The 50-silicon chip.
Embodiment
Traditional advanced scanning projecting photoetching machine silicon chip platform has only a silicon chip motion positions device as shown in Figure 2 in the litho machine, promptly have only a silicon chip platform.Preliminary works such as leveling, focusing and aligning all will be finished on same silicon chip platform, required chronic of these work, particularly aim at, owing to require to carry out the high low-velocity scanning of precision (typical alignment scanning speed is 1mm/s), so required time is very long.In order to improve the exposure efficiency of litho machine, a kind of photo-etching machine silicon chip platform simple in structure described in the utility model is rotated exposure device, exposure preliminary works such as leveling, focusing and aligning are transferred on the silicon chip platform of pre-service station, and work alone simultaneously with the silicon chip platform of exposure station, thereby shorten the working time of silicon chip on exposure silicon chip platform greatly.
Described silicon slice bench double-bench switch as shown in Figure 3, this device comprises the silicon chip platform 1 and the silicon chip platform 1 that runs on the exposure station that run on the pre-service station, described two silicon chip platforms 1 are arranged on the base station 11, and are suspended in base station 11 surfaces by air-bearing.Air-bearing is arranged on the bottom surface of silicon chip platform 1, and the gravity in order to balance silicon chip platform 1 is suspended in silicon chip platform 1 on the base station 11.Base station 11 upper surfaces are as air bearing surface, the flatness of having relatively high expectations.Air-bearing only plays balance silicon chip platform 1 gravity, and silicon chip platform 1 leans on the promotion of cross guide rail driver element 4 or pulling to realize in the motion of base station 11 upper surfaces.
Silicon chip platform 1 is driven by 2 cross guide rail driver elements 4, and each cross guide rail driver element 4 is made up of to linear electric motors 7 and push rod 8 to linear electric motors 5 and Y X.Linear electric motors comprise stator and mover.X is installed in the edge groove of base station 11 to the stator of linear electric motors 5, and mover is positioned at the bottom of cross guide rail driver element 4 lower floors.Y to linear electric motors 7 and X to linear electric motors 5 stacked, and with X to linear electric motors 5 quadratures.Its stator is positioned at the bottom on cross guide rail driver element 4 upper stratas, and mover is installed in order in the push rod 8 that promotes the motion of silicon chip platform.Cross guide rail driver element 4 is arranged on 11 liang of opposed edges of base station.
Hold by vacuum operating bearing between cross guide rail driver element 4 and the silicon chip platform 1, vacuum operating bearing is arranged in the side of push rod 8 and silicon chip platform 1.Unless need exchange, hold all the time between push rod 8 and the silicon chip platform 1, cross guide rail driver element 4X to linear electric motors 5 and Y under linear electric motors 7 effects, drive that silicon chip platform 1 is made on a large scale directions X or the Y direction is moved.
The vacuum operating bearing source of the gas cuts off during exchange, unclamps between push rod 8 and the silicon chip platform 1.
The silicon slice bench double-bench exchange process as shown in Figure 8.Finish exposure preliminary works such as leveling, focusing and aligning when silicon chip platform 1 after, silicon chip platform 1 moves to base station 11 middle positions side by side, cut off the vacuum operating bearing source of the gas this moment, unclamp between push rod 8 and the silicon chip platform 1, cross guide rail driver element 4 moves to another silicon chip platform 1 side, hold by vacuum operating bearing once more between the two, thereby drive another silicon chip platform 1 motion, finish two platform exchanges.
Claims (1)
1. photo-etching machine silicon chip platform double-platform switch that adopts cross guide rail, this device contains the silicon chip platform (1) that runs on the pre-service station and runs on the silicon chip platform (1) of exposure station, described two silicon chip platforms are arranged on the base station (11), and be suspended in the base station surface by air-bearing, it is characterized in that: this device adopts two cross guide rail driver elements (4), be separately positioned on the edge on the relative both sides of base station (11), each cross guide rail driver element (4) comprises X to linear electric motors (5), Y is to linear electric motors (7) and push rod (8), X is installed in the groove at base station edge to the stator of linear electric motors (5), and mover is installed in the lower bottom part of cross guide rail driver element; Y to linear electric motors (7) and X to linear electric motors (5) stacked, and with X to linear electric motors (5) quadrature; Hold by vacuum operating bearing between described cross guide rail driver element and the silicon chip platform, vacuum operating bearing is arranged in the side of push rod and silicon chip platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201873458U CN201181387Y (en) | 2007-12-21 | 2007-12-21 | Photo-etching machine silicon slice bench exchanging set adopting cross sliding rail |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201873458U CN201181387Y (en) | 2007-12-21 | 2007-12-21 | Photo-etching machine silicon slice bench exchanging set adopting cross sliding rail |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201181387Y true CN201181387Y (en) | 2009-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201873458U Expired - Lifetime CN201181387Y (en) | 2007-12-21 | 2007-12-21 | Photo-etching machine silicon slice bench exchanging set adopting cross sliding rail |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201181387Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110436203A (en) * | 2019-08-16 | 2019-11-12 | 吉林华微电子股份有限公司 | Pass piece system and litho machine |
-
2007
- 2007-12-21 CN CNU2007201873458U patent/CN201181387Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110436203A (en) * | 2019-08-16 | 2019-11-12 | 吉林华微电子股份有限公司 | Pass piece system and litho machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20071221 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |