CN201163612Y - 晶圆传输盒上电子标签的辅助固定元件 - Google Patents
晶圆传输盒上电子标签的辅助固定元件 Download PDFInfo
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- CN201163612Y CN201163612Y CNU2008200550317U CN200820055031U CN201163612Y CN 201163612 Y CN201163612 Y CN 201163612Y CN U2008200550317 U CNU2008200550317 U CN U2008200550317U CN 200820055031 U CN200820055031 U CN 200820055031U CN 201163612 Y CN201163612 Y CN 201163612Y
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNU2008200550317U CN201163612Y (zh) | 2008-01-24 | 2008-01-24 | 晶圆传输盒上电子标签的辅助固定元件 |
Applications Claiming Priority (1)
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CNU2008200550317U CN201163612Y (zh) | 2008-01-24 | 2008-01-24 | 晶圆传输盒上电子标签的辅助固定元件 |
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CN201163612Y true CN201163612Y (zh) | 2008-12-10 |
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CNU2008200550317U Expired - Lifetime CN201163612Y (zh) | 2008-01-24 | 2008-01-24 | 晶圆传输盒上电子标签的辅助固定元件 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107533816A (zh) * | 2016-02-19 | 2018-01-02 | 斯特凡诺.尼克里斯 | 用于支撑电子标签的设备 |
WO2022193336A1 (zh) * | 2021-03-19 | 2022-09-22 | 台湾积体电路制造股份有限公司 | 晶圆载具标识牌更换装置 |
-
2008
- 2008-01-24 CN CNU2008200550317U patent/CN201163612Y/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107533816A (zh) * | 2016-02-19 | 2018-01-02 | 斯特凡诺.尼克里斯 | 用于支撑电子标签的设备 |
WO2022193336A1 (zh) * | 2021-03-19 | 2022-09-22 | 台湾积体电路制造股份有限公司 | 晶圆载具标识牌更换装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130220 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130220 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20081210 |