CN201161439Y - Ultra-thin diamond saw bit - Google Patents

Ultra-thin diamond saw bit Download PDF

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Publication number
CN201161439Y
CN201161439Y CNU2007200093497U CN200720009349U CN201161439Y CN 201161439 Y CN201161439 Y CN 201161439Y CN U2007200093497 U CNU2007200093497 U CN U2007200093497U CN 200720009349 U CN200720009349 U CN 200720009349U CN 201161439 Y CN201161439 Y CN 201161439Y
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CN
China
Prior art keywords
saw blade
substrate
thickness
diamond
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007200093497U
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Chinese (zh)
Inventor
徐西鹏
韩权利
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Huaqiao University
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Huaqiao University
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Publication date
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Priority to CNU2007200093497U priority Critical patent/CN201161439Y/en
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Publication of CN201161439Y publication Critical patent/CN201161439Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses an ultra-thin diamond saw blade, comprising a circular saw blade substrate and diamond abrasives. The circular saw blade substrate is divided into an inner substrate and outer substrate along the radial direction of the circular saw blade substrate, the thickness of the outer substrate is smaller than that of the inner substrate, and the diamond abrasives are consolidated on the outer surface of the outer substrate. The ultra-thin diamond saw blade decreases the thickness of the outer substrate of the saw blade substrate without changing the diameter of the saw blade, and can realize reduction of thickness-to-diameter ratio between the outer substrate of the saw blade substrate and the saw blade substrate to produce the ultra-thin saw blade. The ultra-thin diamond saw blade further can directly consolidate the diamond abrasives at the thickness-reduced position of the outer substrate of the saw blade substrate, and utilizes the outer substrate of the saw blade substrate as segments with thickness confirmed according to processing requirements, thereby achieving the purpose of saving materials. Simultaneously, a time-consuming procedure of fixing the segments during the production process of the saw blade is omitted, which can realize simplification of manufacturing process of the saw blade.

Description

A kind of slim diamond blade
Technical field
The utility model relates to a kind of slim diamond blade.
Background technology
In the cutting field of hard crisp nonmetallic materials such as stone material, cement, extensively adopt the multi-block type diamond disc at present.
Existing multi-block type diamond saw blade, diamond block is connected with circular saw blade substrate, saw bit matrix drives the diamond motion to make the usefulness of cutting, its structure as shown in Figure 1, comprise diamond saw blade substrate 1 ' and outer surface sticking be provided with diamond abrasive grain 2 ' joint piece 3 ', described joint piece 3 ' be fixed in saw bit matrix 1 ' excircle, and joint piece 3 ' thickness e greater than matrix 1 ' thickness E.As, existing sintered type diamond saw blade, the thickness of saw bit matrix and diameter ratio are 3.6 * 10-3~7.2 * 10-3, the thickness of saw blade joint piece is 5.2 * 10-3~10.0 * 10-3 with saw bit matrix diameter ratio.In thin plate and the production of ultra-thin sheet material material, stock utilization is about 50%, causes huge natural resources waste.
The utility model content
The utility model purpose provides a kind of slim diamond blade, and it is remarkable that its material consumption reduces effect.
For achieving the above object, the technical solution adopted in the utility model is: a kind of slim diamond blade, comprise circular saw blade matrix and diamond abrasive, with above-mentioned circular saw blade matrix along its radial direction be divided into endobasal-body and outside matrix, the thickness of above-mentioned outer matrix is less than the thickness of above-mentioned endobasal-body, and above-mentioned diamond abrasive is consolidated on the outer surface of above-mentioned outer matrix.
The thickness of above-mentioned outer matrix be above-mentioned endobasal-body thickness 1/5~3/5.
The thickness of above-mentioned outer matrix be above-mentioned endobasal-body thickness 1/4~1/3.
Above-mentioned diamond abrasive is consolidated on two outer surfaces of above-mentioned outer matrix thickness direction by machinery or physico-chemical process.
By adopting the aforementioned techniques scheme, a kind of slim diamond blade of the utility model, under the situation that does not change the saw blade diameter, reduce the thickness of the outer matrix of saw bit matrix, can realize the reduction of thickness and saw bit matrix diameter ratio of the outer matrix of saw bit matrix, to make ultrathin saw bit.The utility model also can be at the direct consolidating material and diamond abrasive in outer matrix place of the saw bit matrix that reduces thickness, serves as the joint piece by the outer matrix of saw bit matrix, and its thickness can be determined according to process requirements, to reach the purpose of economical with materials; Simultaneously, omit the fixing operation consuming time of joint piece in the saw blade manufacture process, can realize the simplification of saw blade manufacturing process.
Description of drawings
Fig. 1 is the multi-block type diamond saw blade structural representation of commonly using.
Fig. 2 is the structural representation of circular saw blade matrix in the utility model.
Fig. 3 is the structural representation of the utility model embodiment.
Fig. 4 is the partial enlarged drawing of Fig. 3.
The specific embodiment
A kind of slim diamond blade of the utility model, its basal body structure as shown in Figure 2, circular saw blade matrix 1 along its radial direction be divided into endobasal-body 11 and outside matrix 12, by machining make the thickness e of outer matrix 12 be endobasal-body 11 thickness E 1/5~3/5,1/5~3/5 can optimize and selects 1/4~1/3 herein.
It is fixed that diamond abrasive grain adopts brazing mode among the embodiment of the present utility model, shown in Fig. 3,4, comprises circular saw blade matrix 1, diamond abrasive 2 and solder 3.Circular saw blade matrix 1 is divided into endobasal-body 11 and outer matrix 12 along its radial direction, and the thickness of endobasal-body 11 is 2.4mm, adopts the machining process handle thickness of outer matrix 12 to be processed as 0.8mm, and the radial depth of outer matrix 12 is 15mm.Solder 33 is coated on two outer surfaces of outer matrix 12 thickness directions, and diamond abrasive 2 sticking being located on the solder 33 are directly realized the fixing of diamond abrasive 2 by method for welding.

Claims (4)

1, a kind of slim diamond blade, comprise circular saw blade matrix and diamond abrasive, it is characterized in that: with above-mentioned circular saw blade matrix along its radial direction be divided into endobasal-body and outside matrix, the thickness of above-mentioned outer matrix is less than the thickness of above-mentioned endobasal-body, and above-mentioned diamond abrasive is consolidated on the outer surface of above-mentioned outer matrix.
2, a kind of slim diamond blade according to claim 1 is characterized in that: the thickness of above-mentioned outer matrix be above-mentioned endobasal-body thickness 1/5~3/5.
3, a kind of slim diamond blade according to claim 2 is characterized in that: the thickness of above-mentioned outer matrix be above-mentioned endobasal-body thickness 1/4~1/3.
4, according to each described a kind of slim diamond blade of claim 1-3, it is characterized in that: above-mentioned diamond abrasive is consolidated on two outer surfaces of above-mentioned outer matrix thickness direction by machinery or physico-chemical process.
CNU2007200093497U 2007-12-28 2007-12-28 Ultra-thin diamond saw bit Expired - Lifetime CN201161439Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200093497U CN201161439Y (en) 2007-12-28 2007-12-28 Ultra-thin diamond saw bit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200093497U CN201161439Y (en) 2007-12-28 2007-12-28 Ultra-thin diamond saw bit

Publications (1)

Publication Number Publication Date
CN201161439Y true CN201161439Y (en) 2008-12-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200093497U Expired - Lifetime CN201161439Y (en) 2007-12-28 2007-12-28 Ultra-thin diamond saw bit

Country Status (1)

Country Link
CN (1) CN201161439Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102555086A (en) * 2012-01-18 2012-07-11 浙江勒托能源科技有限公司 Stainless steel band-saw blade with alternatively arranged large and small carborundum saw teeth
CN106042200A (en) * 2016-07-21 2016-10-26 中国有色桂林矿产地质研究院有限公司 Diamond inner circle cutting blade and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102555086A (en) * 2012-01-18 2012-07-11 浙江勒托能源科技有限公司 Stainless steel band-saw blade with alternatively arranged large and small carborundum saw teeth
CN106042200A (en) * 2016-07-21 2016-10-26 中国有色桂林矿产地质研究院有限公司 Diamond inner circle cutting blade and preparation method thereof
CN106042200B (en) * 2016-07-21 2018-07-06 中国有色桂林矿产地质研究院有限公司 Inner diamond slicing blade and preparation method thereof

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Granted publication date: 20081210