CN201159445Y - 一种大功率led散热装置 - Google Patents
一种大功率led散热装置 Download PDFInfo
- Publication number
- CN201159445Y CN201159445Y CNU2008200828479U CN200820082847U CN201159445Y CN 201159445 Y CN201159445 Y CN 201159445Y CN U2008200828479 U CNU2008200828479 U CN U2008200828479U CN 200820082847 U CN200820082847 U CN 200820082847U CN 201159445 Y CN201159445 Y CN 201159445Y
- Authority
- CN
- China
- Prior art keywords
- power led
- heat
- radiator
- heat radiating
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011148 porous material Substances 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000004411 aluminium Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002207 thermal evaporation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200828479U CN201159445Y (zh) | 2008-01-31 | 2008-01-31 | 一种大功率led散热装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200828479U CN201159445Y (zh) | 2008-01-31 | 2008-01-31 | 一种大功率led散热装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201159445Y true CN201159445Y (zh) | 2008-12-03 |
Family
ID=40110029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008200828479U Expired - Fee Related CN201159445Y (zh) | 2008-01-31 | 2008-01-31 | 一种大功率led散热装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201159445Y (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102788334A (zh) * | 2012-07-23 | 2012-11-21 | 贵州光浦森光电有限公司 | 一种用于led灯泡的热管散热方法及热管型挤压散热器 |
CN103178164A (zh) * | 2011-12-20 | 2013-06-26 | 国研高能(北京)稳态传热传质技术研究院有限公司 | 制造相变太阳花散热装置的方法 |
CN103307579A (zh) * | 2013-06-13 | 2013-09-18 | 南京航空航天大学 | 提高led照明光源散热效率的方法及一体化散热器 |
CN104025323A (zh) * | 2011-12-21 | 2014-09-03 | 英特尔公司 | 用于发光二极管的热管理 |
-
2008
- 2008-01-31 CN CNU2008200828479U patent/CN201159445Y/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103178164A (zh) * | 2011-12-20 | 2013-06-26 | 国研高能(北京)稳态传热传质技术研究院有限公司 | 制造相变太阳花散热装置的方法 |
CN103178164B (zh) * | 2011-12-20 | 2016-03-23 | 国研高能(北京)稳态传热传质技术研究院有限公司 | 制造相变太阳花散热装置的方法 |
CN104025323A (zh) * | 2011-12-21 | 2014-09-03 | 英特尔公司 | 用于发光二极管的热管理 |
US9657931B2 (en) | 2011-12-21 | 2017-05-23 | Intel Corporation | Thermal management for light-emitting diodes |
CN102788334A (zh) * | 2012-07-23 | 2012-11-21 | 贵州光浦森光电有限公司 | 一种用于led灯泡的热管散热方法及热管型挤压散热器 |
CN103307579A (zh) * | 2013-06-13 | 2013-09-18 | 南京航空航天大学 | 提高led照明光源散热效率的方法及一体化散热器 |
CN103307579B (zh) * | 2013-06-13 | 2016-04-27 | 南京航空航天大学 | 提高led照明光源散热效率的方法及一体化散热器 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: ZHEJIANG GEMCORE TECHNOLOGY CO., LTD. Assignor: Zhu Jianping Contract record no.: 2011330001068 Denomination of utility model: High power LED (Light Emitting Diode) heat dissipation device Granted publication date: 20081203 License type: Exclusive License Record date: 20110812 |
|
ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG JUGUANG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHU JIANPING Effective date: 20150804 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150804 Address after: 325000, No. 1759, Binhai, Wenzhou Economic Development Zone, Wenzhou, Zhejiang Patentee after: FOCUSED PHOTONICS INC. Address before: 325000 No. 50 Jiulong Mountain Road, Wenzhou economic and Technological Development Zone, Zhejiang, China Patentee before: Zhu Jianping |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081203 Termination date: 20170131 |