CN201146178Y

CN201146178Y - Rectangle suction nozzle for encapsulation manufacturing process

Info

Publication number: CN201146178Y
Application number: CNU2007201998487U
Authority: CN
Inventors: 吴全忠; 游翔行; 王养苗; 英宗岳
Original assignee: WEIMI ELECTRONIC CO Ltd
Current assignee: WEIMI ELECTRONIC CO Ltd
Priority date: 2007-12-10
Filing date: 2007-12-10
Publication date: 2008-11-05
Anticipated expiration: 2017-12-10

Abstract

The utility model relates to a suction nozzle used for the packaging manufacture process, including a body and a suction nozzle structure arranged at one end of the body, wherein, the body is a rigid round tube with one end gradually and internally decreases the size in a rectangular section along the direction towards the endpoint to lead the end to form the suction nozzle structure with the rectangular section. The position in the middle of the end face of the suction nozzle structure is provided with a suction mouth corresponding to the appearance of the end face. Therefore, the suction nozzle is particularly suitable for absorbing strip shape light emitting diodes. The suction nozzle can not only prevent the surface structure of the strip shape light emitting diodes from being damaged effectively but also strengthen the suction effect so as to improve the accuracy of placing the strip shape light emitting diodes onto chip frames.

Description

The rectangle suction nozzle that is used for package fabrication process

Technical field

A kind of suction nozzle that is used for package fabrication process of the utility model design is especially drawn light-emitting diode, the rectangular suction nozzle in cross section about a kind of manufacture process that is used for.

Background technology

In the manufacture process of light-emitting diode, cause gripping to be difficult for because the half-finished size of wafer is too for a short time, and for fear of the wafer semi-finished product in human body contact causes all factors such as static injury, therefore, often need to adopt mode with absorption to take or to insert different workbenches.

Please refer to Fig. 4, it is existing one suction piece 60 that is installed in automatically working equipment, and an end of this suction piece 60 forms comparatively tiny and corresponding with LED wafer size suction nozzle head 62.When the other end of this suction piece 60 was connected with automatically working equipment, it can have been got near a LED wafer this suction nozzle head 62 with this wafer.

Yet, because the LED wafer that present light-emitting diode because the demand of optical wavelength, encapsulation sample attitude causes the size diversification of this LED wafer, causes the suction nozzle head 62 of original suction piece 60 can't mate some given shape fully.For example, please refer to Fig. 5, it is the elevational schematic view that this suction piece 60 is drawn a microscler LED wafer 70, as known in the figure, position, the stage casing local surfaces of this microscler LED wafer 70 is only contained in the end face part of this suction nozzle head 62, though and such state still can be drawn this microscler light-emitting diode 70 wafers smoothly, but will be because of 60 pairs of uneven structural deteriorations that cause these microscler light-emitting diode 70 surfaces of these microscler light-emitting diode 70 application of forces of this suction piece, for example, be located at packaging line (bonding wire) this problem of Chang Yinwei on these microscler light-emitting diode 70 surfaces and break.

In addition, as shown in Figure 6, for this suction nozzle head 62, its end face can not mate with this microscler light-emitting diode 70, to form a rectangular indenture at these suction nozzle head 62 end faces after using a period of time, this indenture may make this suction nozzle head 62 in that draw should be microscler during light-emitting diode 70, and this microscler light-emitting diode 72 can't be close to these suction nozzle head 62 end faces and produce gas leak phenomenon, and reduces the absorption effect.If suction force deficiency, after automatically working equipment is drawn this microscler light-emitting diode 70, when desiring to put it into a chip flame 80, result because of fast moving, Chang Rongyi causes wafer to drop or inclined position is not just waiting problem, make and when next process steps, take difficultly, and then reduce to produce yield and efficient.

Summary of the invention

For the suction nozzle end surface that solves aforesaid suction piece forms circle, and the problem that the light-emitting diode that makes itself and some distinctive appearance can not mate, the utility model forms this suction nozzle end surface rectangular-shaped, and one is drawn the profile that perforation also is formed at this suction nozzle end surface correspondence, make its can with the light-emitting diode cross-sections match of distinctive appearance, and when drawing, do not destroy its surface texture.

Specifically, the utility model provides a kind of rectangle suction nozzle that is used for package fabrication process, it comprises: a body and is located at the nozzle structure of this body one end, this body is a body, one end face of this nozzle structure forms long rectangle, and this end face is offered a suction inlet corresponding with this end face profile, and the inner flow passage of this suction inlet forms with the inner flow passage of this body and is communicated with.

Wherein, this body is preferably the rounded rigidity body in cross section.

Wherein, this suction inlet is preferably a round rectangle;

Wherein preferably, an end of this body contracts in the size with the square-section gradually towards its end points, and making its this end form the cross section is this rectangular-shaped nozzle structure.

Below in conjunction with structure the beneficial effects of the utility model are described: nozzle structure of the present utility model forms rectangle and its suction inlet forms the round rectangle corresponding with this nozzle structure cross section, make the utility model be specially adapted to draw the light-emitting diode of strip, not only can effectively avoid destroying the LED surface structure of this strip, also can strengthen drawing effect and promote the accuracy that is positioned over chip flame.

Description of drawings

Fig. 1 is a preferred embodiment stereogram of the present utility model.

Fig. 2 draws the elevational schematic view of a LED wafer for preferred embodiment of the present utility model.

Fig. 3 places the schematic diagram of a framework for LED wafer of the present utility model.

Fig. 4 is the stereogram of an existing suction piece.

Fig. 5 draws the elevational schematic view of a microscler LED wafer for this suction piece.

Fig. 6 inserts the schematic top plan view of a chip flame for draw this microscler LED wafer with this suction piece.

[main element symbol description]

10 bodies

12 nozzle structures

122 suction inlets

20 LED wafer

30 frameworks

60 suction pieces

62 suction nozzle heads

70 microscler LED wafer

80 chip flames

Embodiment

Please refer to Fig. 1 and Fig. 2, it is used for the preferred embodiment of the rectangle suction nozzle of package fabrication process for the utility model, and it comprises the nozzle structure 12 that a body 10 and is located at these body 10 1 ends.Wherein, this body 10 is a rigidity pipe body, the one end contracts in the size with the square-section gradually towards its end points, making its this end form the cross section is this rectangular-shaped nozzle structure 12, wherein, a suction inlet 122 corresponding with this end face profile offered in the end face middle part of this nozzle structure 12, and the suction inlet 122 of this preferred embodiment is to form a round rectangle.The inner flow passage of this suction inlet 122 forms with this body 10 and is communicated with, when making the other end of this body 10 be connected in an automation suction device (not shown), this automation suction device can be by contacting these nozzle structure 12 end faces one LED wafer 20 and can draw this LED wafer 20, as shown in Figure 2.Because this nozzle structure 12 and this suction inlet 122 are corresponding with the cross-sectional shape of these light-emitting diode 20 wafers, and because the position, stage casing of this light-emitting diode 20 often is provided with the structure that influences its luminous efficacy (for example packaging line etc.), therefore, since this preferred embodiment in suction inlet 122 form corresponding with these LED wafer 20 profiles, it not only can effectively draw this light-emitting diode 20, also can avoid destroying the important structure on these LED wafer 20 surfaces.

Please refer to Fig. 3, because this nozzle structure 12, this suction inlet 122 and the corresponding coupling of these light-emitting diode 20 profiles, can effectively strengthen drawing effect, make this automation suction device between different station, when this light-emitting diode 20 is put into a framework 30, can put into the middle part of this framework 30 comparatively accurately, with save this automation suction device in next station required to bit time.

Claims

1, a kind of rectangle suction nozzle that is used for package fabrication process, it is characterized in that, comprise a body and and be located at the nozzle structure of this body one end, this body is a body, one end face of this nozzle structure forms long rectangle, and this end face is offered a suction inlet corresponding with this end face profile, and the inner flow passage of this suction inlet forms with the inner flow passage of this body and is communicated with.

2, the rectangle suction nozzle that is used for package fabrication process according to claim 1 is characterized in that, this body is the rounded rigidity body in cross section.

3, the rectangle suction nozzle that is used for package fabrication process according to claim 1 and 2 is characterized in that, this suction inlet is a round rectangle.

4, the rectangle suction nozzle that is used for package fabrication process according to claim 1 and 2 is characterized in that, an end of this body contracts in the size with the square-section gradually towards its end points, and making its this end form the cross section is this rectangular-shaped nozzle structure.