CN201144503Y - Novel heating floor - Google Patents

Novel heating floor Download PDF

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Publication number
CN201144503Y
CN201144503Y CNU200720187091XU CN200720187091U CN201144503Y CN 201144503 Y CN201144503 Y CN 201144503Y CN U200720187091X U CNU200720187091X U CN U200720187091XU CN 200720187091 U CN200720187091 U CN 200720187091U CN 201144503 Y CN201144503 Y CN 201144503Y
Authority
CN
China
Prior art keywords
heating
floor
heat insulation
insulation layer
top plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU200720187091XU
Other languages
Chinese (zh)
Inventor
王其坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Diyuan Energy Environment Co., Ltd.
Original Assignee
HANGZHOU GROUND SOURCE AIR-CONDITIONING RESEARCH INSTITUTE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU GROUND SOURCE AIR-CONDITIONING RESEARCH INSTITUTE Co Ltd filed Critical HANGZHOU GROUND SOURCE AIR-CONDITIONING RESEARCH INSTITUTE Co Ltd
Priority to CNU200720187091XU priority Critical patent/CN201144503Y/en
Application granted granted Critical
Publication of CN201144503Y publication Critical patent/CN201144503Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a novel heating floor which is composed of an upper layer board and a lower heat insulation layer which are bonded with each other. The thickness of the upper layer board is larger than the thickness of the lower heat insulation layer. The bonding surface of the upper layer board is vertically equipped with a plurality of pipe channels. Heating pipes are arranged in the pipe channels. The lower heat insulation layer is bonded with the upper layer board which is equipped with the heating pipes through adhesives. The heating pipes are arranged on the lower side of the thickness midline of the heating board. Thus, the strength of the heating board can not be lowered, which is beneficial to the decoration construction of the board. During the decoration process, the heating pipes are colluded into a loop. An inlet and an outlet are arranged on proper positions which are communicated with a heating pipe or an air-conditioning pipe.

Description

Novel heating floor
Technical field
The utility model relates to a kind of floor, specifically relates to a kind of novel heating floor.
Background technology
In the prior art, mostly the floor of daily life of a family finishing usefulness is wooden, or stone material, have some moist occasions need use macromolecular material floors such as plastics, existing these floors all are not provided with the heating pipe yet, and mostly the ground heating system is to refill behind ground cement cast heating coil pipe repaiies the floor, the construction working amount is very big like this, and thick mixed earth and the floor of alternating floor above the heating coil pipe, reduced the efficient of heating, improved use cost.
Summary of the invention
The utility model mainly is to solve above-mentioned existing in prior technology technical problem, and a kind of novel heating floor is provided.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of novel heating floor, constitute by top plate and lower floor's heat insulation layer are bonding mutually, vertically offer some tube seats on the bonding plane of top plate, put the heating pipe in the tube seat of top plate, lower floor's heat insulation layer bonds together by adhesive with the top plate of having put the heating pipe.
As preferably, the thickness of described top plate is greater than the thickness of lower floor's heat insulation layer, and the heating pipe is installed in and departs from the downward side of heating floor thickness center line, can not reduce the intensity of heating floor like this, is beneficial to the decoration construction on floor.
The tube seat of top plate is type semienclosed (the most of sealing of tube seat), the heating pipe close of not filling the heating medium makes the heating medium be full of heating pipe (the heating pipe is in artesian condition) back again and fully contacts fixing with the lower floor heat insulation layer by filling adhesive in the cavity of tube seat.The heating pipe is the high nonmetal or metal material of small-bore heat transfer efficiency, and the material on upper strata can be wood flooring, nonmetals (as macromolecular material etc.) or stone material etc.
In the fitment process, the heating pipe is ganged up into a loop, an import and an outlet are set in position, be connected with the caliduct or the air-conditioning heating pipe of heating.Adopt technique scheme, make to the utlity model has simple in structurely, rationally distributed, design characteristics such as ingenious.
Description of drawings
Fig. 1 is a kind of structural representation of the present utility model;
Fig. 2 is a kind of decomposition texture schematic diagram of the present utility model.
The specific embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: referring to Fig. 1 and Fig. 2, the utility model constitutes by top plate 1 and lower floor's heat insulation layer 2 are bonding mutually, the thickness of top plate 1 is greater than the thickness of lower floor's heat insulation layer 2, vertically offer some tube seats 4 on the bonding plane of top plate 1, put the heating pipe in it, lower floor's heat insulation layer 2 bonds together by adhesive with the top plate that places heating pipe 3, and heating pipe 3 is installed in and departs from the downward side of heating floor thickness center line, can not reduce the intensity of heating floor like this, be beneficial to the decoration construction on floor.In the fitment process, heating pipe 3 is ganged up into a loop, an import and an outlet are set in position, be connected with the caliduct or the air-conditioning duct of heating.Small-bore heating pipe 3 is that good nonmetals of thermal conductivity (as macromolecular material etc.) or metal material all can.Top plate can be wood flooring, nonmetals (as macromolecular material etc.), stone material etc.
At last, should be pointed out that above embodiment only is the more representational example of the utility model.Obviously, the utility model is not limited to the foregoing description, and many distortion can also be arranged, and as small-bore heating pipe is placed in the ceiling, both can be used for the radiant panel of refrigeration in summer, also can be used for the radiant panel of winter heating.Every foundation technical spirit of the present utility model all should be thought to belong to protection domain of the present utility model to any simple modification, equivalent variations and modification that above embodiment did.

Claims (2)

1. novel heating floor, it is characterized in that described heating floor is by top plate (1) and the mutual bonding formation of lower floor's heat insulation layer (2), vertically offer some tube seats (4) on the bonding plane of top plate (1), put heating pipe (3) in the tube seat of top plate (4), lower floor's heat insulation layer (2) bonds together by adhesive with the top plate (1) of having put heating pipe (3).
2. novel heating floor according to claim 1 is characterized in that the thickness of the thickness of described top plate (1) greater than lower floor's heat insulation layer (2), and heating pipe (3) is installed in and departs from the downward side of heating floor thickness center line.
CNU200720187091XU 2007-12-28 2007-12-28 Novel heating floor Expired - Lifetime CN201144503Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU200720187091XU CN201144503Y (en) 2007-12-28 2007-12-28 Novel heating floor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU200720187091XU CN201144503Y (en) 2007-12-28 2007-12-28 Novel heating floor

Publications (1)

Publication Number Publication Date
CN201144503Y true CN201144503Y (en) 2008-11-05

Family

ID=40081376

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU200720187091XU Expired - Lifetime CN201144503Y (en) 2007-12-28 2007-12-28 Novel heating floor

Country Status (1)

Country Link
CN (1) CN201144503Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2600546A (en) * 2020-09-21 2022-05-04 Peter Morrish Mark Structural insulated panel for use in buildings

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2600546A (en) * 2020-09-21 2022-05-04 Peter Morrish Mark Structural insulated panel for use in buildings
GB2600546B (en) * 2020-09-21 2023-04-19 Peter Morrish Mark Structural insulated panel for use in buildings

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: ZHEJIANG GLOBE ENERGY AND ENVIRONMENT CO., LTD.

Free format text: FORMER NAME: HANGZHOU GLOBE ENERGY AIR-CONDITIONING INSTITUTE LIMITED

CP03 Change of name, title or address

Address after: 5 building, B building, No. 130, Xueyuan Road, Zhejiang, Hangzhou 310012, China

Patentee after: Zhejiang Diyuan Energy Environment Co., Ltd.

Address before: 310003 No. two, No. 218, Wen Wen Road, Zhejiang, Xihu District, 2-305, Hangzhou

Patentee before: Hangzhou Ground Source Air-conditioning Research Institute Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20081105