CN201142328Y - Chip module - Google Patents
Chip module Download PDFInfo
- Publication number
- CN201142328Y CN201142328Y CNU2007203115252U CN200720311525U CN201142328Y CN 201142328 Y CN201142328 Y CN 201142328Y CN U2007203115252 U CNU2007203115252 U CN U2007203115252U CN 200720311525 U CN200720311525 U CN 200720311525U CN 201142328 Y CN201142328 Y CN 201142328Y
- Authority
- CN
- China
- Prior art keywords
- chip module
- circuit board
- terminal
- main part
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model provides a chip module comprising a main body part, a plurality of connecting conductors connected with external components are arranged on one surface of the main body part, the connecting conductors comprises terminals connected to the surface, and the terminals and the surface are arranged in a relatively tilting manner. By dint of the structure, the connecting conductors on the chip module enable the main body part of the chip module to be directly connected to the external components such as a circuit board, etc. without arranging an electrical connector between the chip module and the circuit board, thereby effectively reducing the cost, and further improving the industrial competitiveness.
Description
[technical field]
The utility model relates to a kind of chip module that is connected on the butt joint circuit board.
[background technology]
At present, the chip module that industry is used has two kinds: a kind of is to have and the orthogonal inserting terminal of chip module at chip module, and this chip module needs a kind of electric connector (as the described connector that is electrically connected of Chinese 01265356.X patent) to be connected on the circuit board; Another kind is that the contact mat that can directly compress contact is set in the bottom of chip module, this chip module need another kind of electric connector (as No. 02247101.4 patent of China electric connector) be connected on the circuit board.More than two kinds of chip modules all need specific electric connector to be connected on the circuit board, yet, the production cost of electric connector is than higher, and because electronic product constantly develops towards directions such as light Xiao Bao, in order to adapt to the developing direction of electronic product, electric connector also develops towards the densification direction day by day, so the spacing of electric connector upper terminal constantly reduces, this makes that the manufacturing cost of electric connector is higher, and manufacture difficulty is bigger.
Therefore, be necessary to invent a kind of new chip module, to overcome above-mentioned defective.
[summary of the invention]
The purpose of this utility model is to provide a kind of chip module, and it can not need electric connector to be connected directly on the circuit board, can effectively reduce cost.
To achieve these goals, the utility model chip module comprises: main part is provided with the body that connects of a plurality of connection outward elements on a surface of this main part, this connects body and comprises and be connected in described lip-deep terminal, this terminal and described surperficial relative tilt setting.
The utility model chip module is because above-mentioned structure, connecting body and the main part of chip module can be connected directly on the outward elements such as circuit board on it, needn't between chip module and circuit board, establish electric connector, can effectively reduce cost, and then improve industrial competitiveness.
[description of drawings]
Fig. 1 is the combination schematic diagram of the utility model chip module and circuit board and posting;
Fig. 2 is the three-dimensional exploded view of chip module shown in Figure 1 and circuit board and posting;
Fig. 3 is the other direction schematic diagram of Fig. 2;
Fig. 4 is the schematic diagram after after the combination of the utility model chip module and circuit board posting being hidden.
Symbol description
1 chip module, 2 circuit boards
10 main parts, 21 contact mats
11 junctions, 22 holes
12 terminals, 13 postings
121 contact sites, 131 reference columns
1210 contact planes, 132 holding blocks
101 lower surfaces
[embodiment]
Below in conjunction with accompanying drawing the utility model chip module is described further.
See also Fig. 1 to shown in Figure 3, the utility model chip module 1, comprise main part 10 and a plurality of body that connects that is arranged on main part 10 lower surfaces 101, this connects body and comprises that being matrix form is arranged in junction 11 and an end and this junction 11 interconnective terminals 12 on main part 10 lower surfaces 101, and this terminal 12 is with described main part 10 lower surfaces, 101 relative tilt settings and form 5 °~60 ° angle, this angle is 5 °~60 ° can make terminal 12 can guarantee not contact with each other each other when being compressed and cause that short circuit can make the terminal dense arrangement, this junction 11 is welded to each other with terminal 12 and combines in the present embodiment, certainly, junction and terminal also can mutually combine or terminal and junction are that an overall structure is that terminal is extended to form by junction by conductive adhesive.The other end of terminal 12 be provided with can with the contacted contact site 121 of external connected electronic element (an external connected electronic element circuitry plate 2 is provided in the present embodiment), contact site 121 is provided with a bigger contact plane 1210 (please refer to shown in Figure 4).Circuit board 2 upper surfaces are provided with contact mat 21, when being arranged on chip module 1 on the circuit board 2, contact plane 1210 on terminal 12 contact sites connects with the contact mat 21 on the described circuit board 2, because contact plane 1210 is bigger, and itself and contact mat 21 connect, can realize that between the two contact area is big or realize multiple spot contact between the two, compare, make and conduct electricity quality and obtain bigger improvement with used some contact of industry.
Above institute's circuit board 2, be provided with the positioner of the main part 10 of the described chip module in location, this positioner make on the main part 10 connect body can be accurately and the contact mat on the circuit board 2 21 be in contact with one another, and main part 10 transition of limited chip module press down and avoid terminal 12 by excessive pressurized, but this positioner is the main part 10 square posting 13 all around of positioning chip module in the present embodiment, this posting 13 is arranged on the periphery of circuit board 2 the above contact mat 21 region, the bottom extension of posting 13 is provided with reference column 131, circuit board 2 is provided with and matches with reference column 131 and make posting 13 be positioned hole 22 on the circuit board 2, and the inboard of a frame of posting 13 is provided with the holding block 132 of main part 10 sides that can flexibly support described chip module, and the frame at these holding block 132 places be with the corresponding frame of the incline direction of terminal on, when being arranged on chip module on the circuit board, the active force of chip module is bigger on the incline direction of terminal, and the main part 10 stressed bigger sides that holding block 132 can effectively support chip module make firm being installed in the posting of chip module.
The utility model chip module directly is connected terminal with main part be an overall structure, and this terminal and described main part lower surface relative tilt are provided with, the terminal that connects body on the main part of this chip module can be connected directly to chip module on the circuit board, needn't between chip module and circuit board, establish electric connector, can effectively reduce cost, and then improve industrial competitiveness.The angle that terminal and the formation of described main part lower surface are 5 °~60 ° can guarantee not contact with each other each other and cause that short circuit can make the terminal dense arrangement, and because contact plane is bigger, and itself and contact mat connect, can realize that between the two contact area is big or realize multiple spot contact between the two, compare with used a bit the contacting of industry, make the conduction quality obtain bigger improvement.
Claims (10)
1. a chip module is characterized in that, comprises:
Main part is provided with the body that connects of a plurality of connection outward elements on a surface of this main part, this connects body and comprises and be connected in described lip-deep terminal, this terminal and described surperficial relative tilt setting.
2. chip module as claimed in claim 1 is characterized in that: described terminal and described surface form 5 °~60 ° angle.
3. chip module as claimed in claim 1 is characterized in that: the described body that connects comprises the junction that is arranged at described surface, and an end and this junction of described terminal interconnect.
4. chip module as claimed in claim 3 is characterized in that: described terminal is welded to each other with described junction and combines.
5. chip module as claimed in claim 3 is characterized in that: the other end of described terminal is provided with and the contacted contact site of external connected electronic element.
6. chip module as claimed in claim 5 is characterized in that: described contact site is provided with a contact plane.
7. chip module as claimed in claim 5 is characterized in that: described external connected electronic element is a circuit board, and this circuit board is provided with contact mat, and described contact site is provided with a contact plane, and this contact plane and contact mat connect.
8. chip module as claimed in claim 5 is characterized in that: described external connected electronic element is a circuit board, and described circuit board is provided with the positioner of the described main part in location.
9. chip module as claimed in claim 8 is characterized in that: described positioner is the posting around the described main part in location.
10. chip module as claimed in claim 9 is characterized in that: described posting is provided with the holding block that can flexibly support described main part one side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007203115252U CN201142328Y (en) | 2007-06-18 | 2007-12-08 | Chip module |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200720052903 | 2007-06-18 | ||
CN200720052903.X | 2007-06-18 | ||
CNU2007203115252U CN201142328Y (en) | 2007-06-18 | 2007-12-08 | Chip module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201142328Y true CN201142328Y (en) | 2008-10-29 |
Family
ID=40070038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007203115252U Expired - Fee Related CN201142328Y (en) | 2007-06-18 | 2007-12-08 | Chip module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201142328Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021052143A1 (en) * | 2019-09-18 | 2021-03-25 | 深圳市中光工业技术研究院 | Substrate for soldering electronic component, manufacturing method therefor, and semiconductor device |
-
2007
- 2007-12-08 CN CNU2007203115252U patent/CN201142328Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021052143A1 (en) * | 2019-09-18 | 2021-03-25 | 深圳市中光工业技术研究院 | Substrate for soldering electronic component, manufacturing method therefor, and semiconductor device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081029 Termination date: 20141208 |
|
EXPY | Termination of patent right or utility model |