CN201137896Y - Ultra- large power LED chip copper welding frame and aluminum retaining board structure for illumination - Google Patents
Ultra- large power LED chip copper welding frame and aluminum retaining board structure for illumination Download PDFInfo
- Publication number
- CN201137896Y CN201137896Y CNU2007200805203U CN200720080520U CN201137896Y CN 201137896 Y CN201137896 Y CN 201137896Y CN U2007200805203 U CNU2007200805203 U CN U2007200805203U CN 200720080520 U CN200720080520 U CN 200720080520U CN 201137896 Y CN201137896 Y CN 201137896Y
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- China
- Prior art keywords
- led chip
- copper
- electrode
- welded
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract
A copper welded frame of LED chips with extra-large power used for lighting and an aluminum bearing plate structure, which are characterized in that a copper frame 1, wherein the copper frame 1comprises a copper frame body 10, the copper frame body 10 is used as an electrode used for welding LED chips, a subsided lamp cup 11 used for installing the LED chips and an electrode 13 are arranged in the copper frame body 10, wherein the electrode 13 and the copper frame body 10 are separated into the other electrode 5 of the LED chips through cutting by the electrode 13 after the electrode 13 competes the welded sealing, a mounting hole 12 is arranged on the frame body 10, a round hole 21 on an aluminum bearing plate 2 is corresponding to the subsided lamp cup 11, and the aluminum bearing plate 2 clings to the lower surface of a frame 1. The copper welded frame not only is suitable for the automatic production of welding the LED chips with extra-large power used for lighting, but also the frame which is welded and sealed with LED chips with extra-large power can be conveniently connected with a heat dissipation device which satisfies requirements of the heat dissipation of the LED chips through screws, thereby the heat dissipation of LED lamps used for lighting is improved, and the lighting effect and the service life of the LED lamp are improved.
Description
Technical field
The utility model relates to illumination with the super-high-power LED chip structure that is welded.
Background technology
As substrate the super-high-power LED chip is installed with multiple film of ceramic substrate or PCB printed board abroad at present, its shortcoming is a weak heat-dissipating, makes the super-high-power LED chip be welded to dispel the heat after back and the can well and goes out the equation of light, and service life is short.
Summary of the invention
The purpose of this utility model is to provide a kind of illumination with copper framework and the aluminium backing structure of being welded of super-high-power LED chip.
Throw light on copper framework and the aluminium backing structure of being welded of super-high-power LED chip, its feature comprises: copper framework 1 and aluminium backing plate 2; Copper framework 1 comprises: copper frame body 10, copper frame body 10 is as an electrode of welding led chip, a Lamp cup 11 and an electrode 13 that is used to install the sinking of led chip is arranged in the copper frame body 10, electrode 13 is to finish the welding embedding after shear another electrode 5 that electrode 13 and frame body 10 is separated into led chip, installing hole 12 is arranged on the frame body 10; Circular hole 21 on the aluminium backing plate 2 is corresponding with Lamp cup 11 positions that sink, and aluminium backing plate 2 is close to framework 1 lower surface.
Described illumination is with copper framework and the aluminium backing structure of being welded of super-high-power LED chip; its feature comprises: have led chip 3 to be installed in the Lamp cup 11; spun gold 4 connects led chip 3 surface electrodes and external electrodes 5, is high transparent silica gel 6 of protection chip 3 and spun gold 4 and solder joint in copper framework 1 and led chip 3 outsides of being welded.
Described illumination is with copper framework and the aluminium backing structure of being welded of super-high-power LED chip, and its feature comprises: adopt the syndeton of serial or parallel connection to assemble street lamp, projecting lamp and the special lamp of using of tens of w and even hundreds of w.
The utility model aims at the be welded structure of illumination with the super-high-power LED chip design that be welded, the frame relations that is welded the super-high-power LED chip arrives the heat radiation bright dipping and the service life of the good illuminating LED lamp of can, copper be welded framework 1 and the aluminium backing plate 2 that adopts the utility model design is not only applicable to the automated production of throwing light on and being welded with the super-high-power LED chip, and the framework of the good super-high-power LED chip of embedding that is welded can link together with screw with the radiator that satisfies led chip heat radiation requirement easily, improve the heat radiation of illuminating LED lamp, improve the light efficiency and the life-span of LED lamp.
Description of drawings
Fig. 1 is the front view of the copper framework that is welded of super-high-power LED chip.
Fig. 2 is the front view of aluminium backing plate 2.
Fig. 3 adopts the utility model to be welded the illumination of the good super-high-power LED chip of embedding with super-high-power LED wick structure schematic diagram.
Fig. 4 is an A-A direction cutaway view among Fig. 1.
The specific embodiment
See Fig. 1, throw light on that its feature comprises: copper framework 1 and aluminium backing plate 2 with the copper framework that is welded of super-high-power LED chip; Copper framework 1 comprises: copper frame body 10, copper frame body 10 is as an electrode of welding led chip, a Lamp cup 11 and an electrode 13 that is used to install the sinking of led chip is arranged in the copper frame body 10, electrode 13 is to finish the welding embedding after shear another electrode 5 that electrode 13 and frame body 10 is separated into led chip, installing hole 12 is arranged on the frame body 10; Sinking Lamp cup 11 plays optically focused and reflection action, and on installing hole 12, available screw is connected and installed the good aluminium radiator of heat radiation;
See Fig. 2, the circular hole 21 on the aluminium backing plate 2 is corresponding with Lamp cup 11 positions that sink, and aluminium backing plate 2 is close to framework 1 lower surface.Aluminium backing plate 2 is used when led chip is welded with framework 1, guarantees framework and work top plane contact, after being welded, takes away aluminium backing plate 2.
See among Fig. 3 that chip 3 is arranged in the Lamp cup 11, spun gold 4 connects led chip 3 surface electrodes and external electrodes 5, is high transparent silica gel 6 of protection chip 3 and spun gold 4 and solder joint in copper framework 1 and led chip 3 outsides of being welded.
Claims (3)
1, throws light on copper framework and the aluminium backing structure of being welded of super-high-power LED chip, its feature comprises: copper framework (1), copper framework (1) comprising: copper frame body (10), copper frame body (10) is as an electrode of welding led chip, a Lamp cup (11) and an electrode (13) that is used to install the sinking of led chip is arranged in the copper frame body (10), electrode (13) is to finish the welding embedding after shear another electrode (5) that electrode (13) and frame body (10) is separated into led chip, installing hole (12) is arranged on the frame body (10); Circular hole (21) on the aluminium backing plate (2) is corresponding with Lamp cup (11) position that sinks, and aluminium backing plate (2) is close to framework (1) lower surface.
2, illumination according to claim 1 is with copper framework and the aluminium backing structure of being welded of super-high-power LED chip; its feature comprises: have led chip (3) to be installed in the Lamp cup (11); spun gold (4) connects led chip (3) surface electrode and external electrode (5), is the high transparent silica gel (6) of protection chip (3) and spun gold (4) and solder joint at copper framework that is welded (1) and led chip (3) outside.
3, illumination according to claim 2 is with copper framework and the aluminium backing structure of being welded of super-high-power LED chip, and its feature comprises: adopt the syndeton of serial or parallel connection to assemble lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200805203U CN201137896Y (en) | 2007-08-02 | 2007-08-02 | Ultra- large power LED chip copper welding frame and aluminum retaining board structure for illumination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200805203U CN201137896Y (en) | 2007-08-02 | 2007-08-02 | Ultra- large power LED chip copper welding frame and aluminum retaining board structure for illumination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201137896Y true CN201137896Y (en) | 2008-10-22 |
Family
ID=40038583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200805203U Expired - Fee Related CN201137896Y (en) | 2007-08-02 | 2007-08-02 | Ultra- large power LED chip copper welding frame and aluminum retaining board structure for illumination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201137896Y (en) |
-
2007
- 2007-08-02 CN CNU2007200805203U patent/CN201137896Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081022 |