CN201116799Y - Combined type refrigerating ice bag - Google Patents

Combined type refrigerating ice bag Download PDF

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Publication number
CN201116799Y
CN201116799Y CNU2007200582205U CN200720058220U CN201116799Y CN 201116799 Y CN201116799 Y CN 201116799Y CN U2007200582205 U CNU2007200582205 U CN U2007200582205U CN 200720058220 U CN200720058220 U CN 200720058220U CN 201116799 Y CN201116799 Y CN 201116799Y
Authority
CN
China
Prior art keywords
semiconductor refrigerating
inclusion
semiconductor
combined type
ice bag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200582205U
Other languages
Chinese (zh)
Inventor
王玮麟
仲杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Jingbo Electronic Technology Co.,Ltd.
Original Assignee
FENGGANG YIANTIAN JINGBO PLSTIC ELECTRONIC PRODUCT FACTORY DONGGUAN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FENGGANG YIANTIAN JINGBO PLSTIC ELECTRONIC PRODUCT FACTORY DONGGUAN filed Critical FENGGANG YIANTIAN JINGBO PLSTIC ELECTRONIC PRODUCT FACTORY DONGGUAN
Priority to CNU2007200582205U priority Critical patent/CN201116799Y/en
Application granted granted Critical
Publication of CN201116799Y publication Critical patent/CN201116799Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a combined type refrigeration ice pocket, which comprises a pocket body with heat insulation effect and a semiconductor refrigeration component, wherein a detachable structure is arranged between the pocket body and the semiconductor component, an insulation cover plate which can replace the semiconductor refrigeration component is provided instead of the traditional structure way of fixedly connecting the pocket body and the semiconductor component. When in use, firstly objects in the pocket body are refrigerated through using the semiconductor refrigeration component, then the insulating cover plate with lighter weight is changed, a window which is left after taking off the heavy semiconductor refrigeration components is plugged to keep the freezing effect, thereby lightening the weight of product, and being convenient for people to carry. The refrigeration ice pocket has the characteristics of flexible usage and convenient carrying, which can be extensively applied in clinics, camps, or outside tours or be applied by consumers who frequently undertake outside activities.

Description

Combined type refrigeration ice bag
Technical field
The utility model relates to refrigeration ice bag art, refers in particular to a kind of combined type refrigeration ice bag.
Background technology
Semiconductor refrigerating ice bag claims semiconductor electronic refrigeration bag again, and it is used for chilled food, beverage, fruit, vegetables, drinks etc., also can be used to storage transportation cosmetics, injection medicine etc.At present, semiconductor electronic refrigeration bag on the market generally comprises an inclusion and the semiconductor cooling assembly with heat insulation and preservation effect.Yet, the inclusion and the semiconductor refrigerating assembly of these prior art semiconductor electronic refrigeration bags are the one built-in structure, not removable, the semiconductor refrigerating assembly is made up of radiator fan, refrigeration heap and cold scattering piece usually, therefore have certain weight, so go out to carry and bring unnecessary burden to the user.
The utility model content
The utility model is at the defective of prior art existence, and main purpose provides a kind of light Modular, semiconductor refrigeration ice bag that uses flexibly, carries.
For achieving the above object, the utility model adopts following technical scheme:
A kind of combined type refrigeration ice bag comprises that one has the inclusion and the semiconductor cooling assembly of heat insulation and preservation effect, is dismantled and assembled structure between this inclusion and the semiconductor refrigerating assembly.
The opening part of described inclusion is connected with a connecting frame that can cooperate with the semiconductor refrigerating assembly.
Described connecting frame is provided with groove, and the opening periphery of the inclusion of correspondence is held in this groove.
Described connecting frame top is provided with at least one groove that colludes, and the connecting frame bottom is provided with at least one locating slot; Be provided with at least one elasticity on the top of semiconductor refrigerating assembly accordingly and buckle, the bottom of semiconductor refrigerating assembly is provided with at least one fixture block, and this elasticity padlock is buckled in aforementioned colluding in the groove, and this fixture block clip is in aforementioned locating slot.
The utility model also comprises the insulation cover plate of a replaceable semiconductor refrigerating assembly, is dismantled and assembled structure between this insulation cover plate and the inclusion.
The utility model compared with prior art, its beneficial effect is to be made as dismantled and assembled structure between the inclusion of semiconductor refrigerating ice bag and the semiconductor refrigerating assembly, and be equipped with the insulation cover plate of a replaceable semiconductor refrigerating assembly, replaced the inclusion of tradition and the frame mode that the semiconductor refrigerating assembly is fixed together.During use, use the semiconductor refrigerating assembly with the refrigeration of the article in the inclusion earlier, and then change the lighter insulation cover plate of weight, seal and take off the window that stays behind the heavier semiconductor refrigerating assembly, to keep freezing effect.By this, alleviated the weight of product, be convenient to people and carry.The utlity model has and use flexibly, carry light characteristics, can extensively be suitable for picnicing, camping, out on tours or the consumer group that often is engaged in outdoor activities use.
Description of drawings
Fig. 1 is the assembled state schematic perspective view of the utility model;
Fig. 2 is the three-dimensional exploded view of the utility model;
Fig. 3 is another three-dimensional exploded view of the utility model;
Fig. 4 is the exploded view of another user mode of the utility model.
The accompanying drawing identifier declaration:
10, inclusion 11, opening periphery
20, semiconductor refrigerating assembly 21, elasticity are buckled
22, fixture block
30, connecting frame 31, groove
32, locating slot 33, collude groove
34, window
40, insulation cover plate 41, elasticity are buckled
42, fixture block
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment:
Show the concrete structure of the utility model one embodiment referring to figs. 1 through Fig. 4, comprise that one has hollow inclusion 10, semiconductor cooling assembly 20 and an insulation cover plate 40 of heat insulation and preservation effect, wherein a side opening place of inclusion 10 is connected with a connecting frame 30, this connecting frame 30 is a frame structure, the centre has the window 34 inside and outside the connection inclusion 10, the outside around the connecting frame 30 is provided with a circle groove 31, and the opening periphery 11 of the inclusion 10 of correspondence is held in this groove 31.The middle inside on connecting frame 30 tops also is provided with one and colludes groove 33, and the inboard of connecting frame 30 bottoms is provided with three locating slots 32;
Semiconductor refrigerating assembly 20 is installed in the aforementioned window 34, and covers whole window 34 afterwards can hold article with inclusion 10 formation one closed cavity.The top of semiconductor refrigerating assembly 20 is provided with an elasticity and buckles 21, and the bottom is provided with three fixture blocks 22, and these elasticity button 21 snap closes collude in the groove 33 in aforementioned, and these fixture block 22 clips are in aforementioned locating slot 32.By this, the assembling mode of this kind elasticity button 21 and fixture block 22 combinations makes semiconductor refrigerating assembly 20 dismounting on inclusion 10 easily.
During assembling, locating slot 32 oblique cuttings that first fixture block 22 with semiconductor refrigerating assembly 20 bottoms aligns connecting frame 30 are gone into, then, upset semiconductor refrigerating assembly 20, make the elasticity on semiconductor refrigerating assembly 20 tops buckle 21 snap closes colluding in the groove 33 in connecting frame 30 tops, by this, finish the assembling of semiconductor refrigerating assembly 20 and inclusion 10.
During dismounting, stir the elasticity on semiconductor refrigerating assembly 20 tops and buckle 21, remove 21 pairs of snap action of colluding groove 33 of elasticity button, the semiconductor refrigerating assembly 20 that outwards overturns again just can take off semiconductor refrigerating assembly 20 from connecting frame 30.
Semiconductor refrigerating assembly 20 is made up of radiator fan, refrigeration heap and cold scattering piece usually, therefore has certain weight, and so carrying the utility model to the user brings unnecessary burden.
Insulation cover plate 40 just is used to replace aforesaid semiconductor cooling assembly 20, it is made by the material with heat insulation effect, weight is lighter, but does not have refrigeration, and has only insulation effect, therefore, the utility model needs to use earlier semiconductor refrigerating assembly 20 with the refrigeration of the article in the inclusion 10, and then changes this insulation cover plate 40, seals and takes off the window 34 that stays behind the semiconductor refrigerating assembly 20, alleviate weight of the present utility model simultaneously, be convenient to people and carry.
Insulation cover plate 40 is installed in the aforementioned window 34 equally, and it also is provided with elasticity button 41 on top, and is provided with three fixture blocks 42 in the bottom, and these elasticity button 41 snap closes collude in the groove 33 in aforementioned, and these fixture block 42 clips are in aforementioned locating slot 32.Its assembling process is the same with the assembling process of aforesaid semiconductor cooling assembly 20, does not repeat them here.
Be made as dismantled and assembled structure between the inclusion 10 that focuses on semiconductor refrigerating ice bag of the present utility model and the semiconductor refrigerating assembly 20, and be equipped with an insulation cover plate 40, replaced the inclusion 10 of tradition and the frame mode that semiconductor refrigerating assembly 20 is fixed together.During use, use semiconductor refrigerating assembly 20 with the refrigeration of the article in the inclusion 10 earlier, and then change the lighter insulation cover plate 40 of weight, seal and take off the window 34 that stays behind the heavier semiconductor refrigerating assembly 20, to keep freezing effect.By this, alleviated the weight of product, be convenient to people and carry.The utlity model has and use flexibly, convenient carrying can extensively be suitable for picnicing, camping, out on tours or the consumer group that often is engaged in outdoor activities use.
The above, it only is the preferred embodiment of a kind of combined type refrigeration of the utility model ice bag, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical conceive of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.

Claims (5)

1, a kind of combined type refrigeration ice bag comprises that one has the inclusion and the semiconductor cooling assembly of heat insulation and preservation effect, it is characterized in that: be dismantled and assembled structure between this inclusion and the semiconductor refrigerating assembly.
2, combined type refrigeration ice bag according to claim 1, it is characterized in that: the opening part of described inclusion is connected with a connecting frame that can cooperate with the semiconductor refrigerating assembly.
3, combined type refrigeration ice bag according to claim 2, it is characterized in that: described connecting frame is provided with groove, and the opening periphery of the inclusion of correspondence is held in this groove.
4, combined type refrigeration ice bag according to claim 3, it is characterized in that: described connecting frame top is provided with at least one groove that colludes, and the connecting frame bottom is provided with at least one locating slot; Be provided with at least one elasticity on the top of semiconductor refrigerating assembly accordingly and buckle, the bottom of semiconductor refrigerating assembly is provided with at least one fixture block, and this elasticity padlock is buckled in aforementioned colluding in the groove, and this fixture block clip is in aforementioned locating slot.
5, combined type refrigeration ice bag according to claim 4, it is characterized in that: also comprising the insulation cover plate of a replaceable semiconductor refrigerating assembly, is dismantled and assembled structure between this insulation cover plate and the inclusion.
CNU2007200582205U 2007-10-12 2007-10-12 Combined type refrigerating ice bag Expired - Fee Related CN201116799Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200582205U CN201116799Y (en) 2007-10-12 2007-10-12 Combined type refrigerating ice bag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200582205U CN201116799Y (en) 2007-10-12 2007-10-12 Combined type refrigerating ice bag

Publications (1)

Publication Number Publication Date
CN201116799Y true CN201116799Y (en) 2008-09-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200582205U Expired - Fee Related CN201116799Y (en) 2007-10-12 2007-10-12 Combined type refrigerating ice bag

Country Status (1)

Country Link
CN (1) CN201116799Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103017437A (en) * 2012-12-06 2013-04-03 慈溪市佐奈丹箱包有限公司 Foldable automobile refrigerator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103017437A (en) * 2012-12-06 2013-04-03 慈溪市佐奈丹箱包有限公司 Foldable automobile refrigerator

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: DONGGUAN JINGBO ELECTRONIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: FENGGANG YIANTIAN JINGBO PLSTIC ELECTRONIC PRODUCT FACTORY, DONGGUAN

Effective date: 20120420

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 523690 DONGGUAN, GUANGDONG PROVINCE TO: 523681 DONGGUAN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20120420

Address after: Fenggang Zhen Yan Tian Zhen Tian Bu Xin Industrial Zone West Road 523681 Guangdong city of Dongguan Province

Patentee after: Dongguan Jingbo Electronic Technology Co.,Ltd.

Address before: 523690 Guangdong Province, Dongguan City West Fenggang Zhen Yan Tian Bu Xin Zhen Tian Dongguan Industrial Zone Fenggang Yantian Jingbo plastic electronic products factory

Patentee before: Fenggang Yiantian Jingbo Plstic Electronic Product Factory, Dongguan

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080917

Termination date: 20141012

EXPY Termination of patent right or utility model