CN201070856Y - Copper and aluminum agglutinating composite board - Google Patents

Copper and aluminum agglutinating composite board Download PDF

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Publication number
CN201070856Y
CN201070856Y CNU2007200722520U CN200720072252U CN201070856Y CN 201070856 Y CN201070856 Y CN 201070856Y CN U2007200722520 U CNU2007200722520 U CN U2007200722520U CN 200720072252 U CN200720072252 U CN 200720072252U CN 201070856 Y CN201070856 Y CN 201070856Y
Authority
CN
China
Prior art keywords
copper
aluminum
utility
composite plate
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200722520U
Other languages
Chinese (zh)
Inventor
郭鹿
李裕权
曹继明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI HUAYUAN COMPOSITE MATERIAL CO Ltd
Shanghai Huayuan New Composite Materials Co Ltd
Original Assignee
SHANGHAI HUAYUAN COMPOSITE MATERIAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI HUAYUAN COMPOSITE MATERIAL CO Ltd filed Critical SHANGHAI HUAYUAN COMPOSITE MATERIAL CO Ltd
Priority to CNU2007200722520U priority Critical patent/CN201070856Y/en
Application granted granted Critical
Publication of CN201070856Y publication Critical patent/CN201070856Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a copper and aluminum adhesive composite plate used for the decoration and fitment of architecture materials and formed by the complex pressing of an upper-layer copper plate and a lower-layer aluminum plate via an adhesive membrane with high intensity. The utility model has the advantages that the weight of the materials is greatly reduced, and a large amount of precious copper materials is saved under the situation of insuring the same intensity of the copper and aluminum adhesive composite plate. Because of the unique metal color and luster of the surface of the copper plate, the surface of decoration and fitment is much more elegance.

Description

Copper aluminium bonding composite plate
Technical field
The utility model relates to building and ornament materials, particularly a kind of copper aluminium bonding composite plate.
Background technology
Since the aluminum composite plate invention sixties in 20th century, in building material industry, obtained extensive use.But aluminum composite plate relies on top finishing to paint often fights and gets color, still lacks the colorful and luxurious property that is shown decoration by the metal true qualities.The domestic and international just people of copper coin are necessary its research and development always in order to the common used material of decoration.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of copper aluminium bonding composite plate, adopt the copper volume and the aluminium volume of suitable thickness, be composited, make product have the copper coin true qualities with the high strength bonding material membrane, be rich in ornamental and durability, make that the surface of decorating, fitting up is graceful more.
The technical scheme in the invention for solving the above technical problem is that copper aluminium bonding composite plate of the present utility model is compositely suppressed to form with splicing membrance strong intensity by upper strata copper coin and lower floor's aluminium sheet.
The utility model has the advantages that: compare with single copper coin, copper aluminium bonding composite plate is guaranteeing to have saved the copper material of a large amount of preciousnesses under the situation of same intensity, makes that again processing and fabricating became extremely simple and convenient when product used at the scene.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Label declaration in the accompanying drawing
The bonding film of 1-copper coin 2-
The 3-aluminium sheet
The specific embodiment
Below in conjunction with accompanying drawing structure of the present utility model is described further.
See also shown in Figure 1ly, copper roll of material (being copper coin 1) and lower floor's aluminium roll of material (being aluminium sheet 3) by suitable thickness, hardness are composited with splicing membrance strong intensity 2.Use the copper volume can realize continuous production, cut into various different sizes more as required, reduce production costs.

Claims (1)

1. copper aluminium bonding composite plate is characterized in that:
Be compositely suppressed to form with splicing membrance strong intensity by upper strata copper coin and lower floor's aluminium sheet.
CNU2007200722520U 2007-07-06 2007-07-06 Copper and aluminum agglutinating composite board Expired - Fee Related CN201070856Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200722520U CN201070856Y (en) 2007-07-06 2007-07-06 Copper and aluminum agglutinating composite board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200722520U CN201070856Y (en) 2007-07-06 2007-07-06 Copper and aluminum agglutinating composite board

Publications (1)

Publication Number Publication Date
CN201070856Y true CN201070856Y (en) 2008-06-11

Family

ID=39549414

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200722520U Expired - Fee Related CN201070856Y (en) 2007-07-06 2007-07-06 Copper and aluminum agglutinating composite board

Country Status (1)

Country Link
CN (1) CN201070856Y (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080611

Termination date: 20120706