CN201054361Y - 发光二极管 - Google Patents

发光二极管 Download PDF

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CN201054361Y
CN201054361Y CNU2007201432879U CN200720143287U CN201054361Y CN 201054361 Y CN201054361 Y CN 201054361Y CN U2007201432879 U CNU2007201432879 U CN U2007201432879U CN 200720143287 U CN200720143287 U CN 200720143287U CN 201054361 Y CN201054361 Y CN 201054361Y
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avris
light
side walls
holding part
emitting diode
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陈伟安
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Lextar Electronics Corp
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KAIDING SCIENCE-TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Abstract

本实用新型发光二极管至少包含有:一壳体、至少包含一支架、至少一发光芯片以及封装胶体,其壳体中设有支架,而壳体并形成至少有一凹坑状的容置部,其容置部并可使支架外露,该容置部边侧设有若干个不同倾斜角度的反射侧壁,其发光芯片则设于其中一支架上,发光芯片所发出的光线经由不同反射侧壁形成不同行进方向,可使大部分光线由容置部射出,进而提高发光二极管的亮度表现。

Description

发光二极管
技术领域
本实用新型涉及发光二极管,尤指一种可减少光源损失进而提高亮度表现的发光二极管。
背景技术
如图1所示即为一般习有SMD发光二极管的结构示意图,该发光二极管1具有一壳体11,其壳体11并设有由第一、二边侧111、112所围成容置空间113,发光芯片12则设置于该容置空间113底部,并有两分离的支架13、14设置于壳体11中,发光芯片12设置于其中一支架13上,该发光芯片12并藉由导线15分别与两支架13、14形成电性连接,最后再于容置空间113中设置封装胶体16,则完成发光二极管1的结构。
当发光芯片12所发出的光线射入封装胶体16与空气不同的两介质间时,会有部分的光线被空气所反射回到封装胶体16而无法进入空气中,并反射第一、二边侧111、112上,然而亦有光线会形成全反射而射入第一、二边侧111、112,然而,该第一、二边侧111、112倾斜角度较大,亦即与容置空间113底部所形成的夹角较大,此时射入第一、二边侧111、112的光线则容易将光线反射至容置空间113底部,而无法有效的离开容置空间113,故导致光线损失、降低光线的使用效率,进而使整体发光二极管的亮度表现不佳。
故有另种发光二极管的结构,其第一、二边侧倾斜角度较小,亦即与容置空间底部所形成的夹角较小以形成较为倾斜的状态,其第一、二边侧可将由封装胶体反射的光线朝容置空间上方射出,但其较为倾斜的第一、二边侧设置于容置空间时,会造成容置空间底部面积较小而容置空间开口处面积较大,易产生发光芯片设置位置以及导线设置位置不易配置等问题。
实用新型内容
有鉴于此,本实用新型的主要目的在于提供一种可减少光源损失进而提高亮度表现的发光二极管。
为达上述目的,本实用新型的发光二极管的技术方案为:至少包含有:一壳体、至少包含一支架、至少一发光芯片以及封装胶体,其壳体中设有支架,而壳体并形成至少有一凹坑状的容置部,其容置部并可使支架外露,该容置部边侧设有若干个不同倾斜角度的反射侧壁,其发光芯片则设于支架上。发光芯片所发出的光线经由不同反射侧壁形成不同行进方向,可使大部分光线由容置部射出,进而提高发光二极管的亮度表现。
本实用新型的有益效果为:
1、利用不同角度的反射侧壁,使封装胶体所反射的光线射入该反射侧壁时,得以控制光线行进方向,并将光线由容置部上方射出,可减少光线射向容置部底部而减少光线损失,进而提高亮度表现。
2、藉由不同角度反射侧壁的设置,使容置部底部的空间得以有较佳发光芯片以及导线的配置。
附图说明
图1为习有发光二极管的结构示意图;
图2为本实用新型中发光二极管的结构示意图;
图3为本实用新型中第一实施例发光二极管的结构立体图;
图4为本实用新型中各反射侧壁的结构放大示意图;
图5为本实用新型中发光二极管的另一结构示意图;
图6为本实用新型中各反射侧壁的另一结构放大示意图;
图7为本实用新型中发光二极管的另一结构立体图;
图8为本实用新型中第二实施例发光二极管的结构立体图;
图9为本实用新型中第三实施例发光二极管的结构立体图;
图10为本实用新型中第一、二边侧以及各反射侧壁的结构示意图;
图11为本实用新型中第一、二边侧以及各反射侧壁的另一结构示意图。
【图号说明】
1——发光二极管            11——壳体
111——第一边侧            112——第二边侧
113——容置空间            12——发光芯片
13、14——支架             15——导线
16——封装胶体             2——发光二极管
21——壳体                 211——容置部
2111-第一边侧              2112-第二边侧
221、222-支架              31——第一反射侧壁
32——第二反射侧壁         33——第三反射侧壁
23——发光芯片             24——导线
25——封装胶体             26——穿孔
具体实施方式
本实用新型发光二极管,其发光二极管2,如图2所示,至少包含有:
一壳体21,其壳体21中设有支架221、222,而壳体21并形成有一凹坑状的容置部211,其容置部211底部并可使支架221、222外露,该容置部211边侧设有若干个不同倾斜角度的反射侧壁,请同时参阅图3所示,该容置部211具有两两相对的第一、二边侧2111、2112,其第一边侧2111的长度小于第二边侧2112,而该第一边侧2111则设有若干个不同倾斜角度的反射侧壁,如图所示的实施例中,其第一边侧2111设有第一、二、三反射侧壁31、32、33,请同时参阅图3所示,该容置部211由底部向上设置的反射侧壁倾斜角度渐增,亦即第一、二、三反射侧壁31、32、33与水平面的倾斜角度分别为A1、A2、A3,而A1<A2<A3;当然,该第一、二、三反射侧壁31、32、33亦可设于第二边侧2112上,如图8所示。
支架221、222,其中一支架221可供置放发光芯片23。
至少一发光芯片23,设于其中一支架221上,并藉由导线24与各支架221、222形成电性连接。
封装胶体25,设置于容置部211中。
当发光芯片23所发出的光线射入封装胶体25与空气不同的两介质间时,会有部分的光线被空气所反射回到封装胶体25而无法进入空气中,并反射至第一、二、三反射侧壁31、32、33上,然而亦有光线会形成全反射而射入第一、二、三反射侧壁31、32、33,因第一、二反射侧壁31、32的倾斜角度较小,使射入的光线得以往容置部211上方射出,进而提高发光二极管的亮度表现;其中,若干个不同倾斜角度的反射侧壁可如图3的第一实施例中设于第一边侧2111上,亦可如图8的第二实施例中设于第二边侧2112上,当然,也可以如图9的第三实施例中,设于第一、二边侧2111、2112上,同样可以提高发光二极管的亮度表现,而设于第一、二边侧2111、2112的第一、二、三反射侧壁31、32、33可以形成相对应的倾斜角度,亦即第一边侧第一反射侧壁31的倾斜角度A1,与第二边侧第一反射侧壁31的倾斜角度a1相同,如图10所示,亦可如图11所示,该第一、二边侧2111、2112的第一、二、三反射侧壁31、32、33为不相同的倾斜角度,亦即第一边侧第一反射侧壁31的倾斜角度A1,与第二边侧第一反射侧壁31的倾斜角度a1不同。
如图4及图5所示为本实用新型的另一实施例,该容置部211边侧同样设有第一、二、三反射侧壁31、32、33,该容置部211由底部向上设置的反射侧壁倾斜角度渐减,亦即第一、二、三反射侧壁31、32、33与水平面的倾斜角度分别为A1、A2、A3,而A1>A2>A3。
当发光芯片23所发出的光线射入封装胶体25与空气不同的两介质间时,部分的光线反射至第一、二、三反射侧壁31、32、33上,或者形成全反射而射入第一、二、三反射侧壁31、32、33,因第二、三反射侧壁32、33的倾斜角度较小,使射入的光线得以往容置部211上方射出,进而提高发光二极管的亮度表现。
再者,该支架221、222露出于壳体21处可设置有穿孔26,如图7所示,该穿孔26的设置可以减少支架221、222折弯时的应力。
值得一提的是,本实用新型的发光二极管具有下列优点:
1、利用不同角度的反射侧壁,使封装胶体所反射的光线射入该反射侧壁时,得以控制光线行进方向,并将光线由容置部上方射出,可减少光线射向容置部底部而减少光线损失,进而提高亮度表现。
2、藉由不同角度反射侧壁的设置,使容置部底部的空间得以有较佳发光芯片以及导线的配置。
如上所述,本实用新型提供一种较佳可行发光二极管结构,爰依法提呈新型专利的申请;惟,以上的实施说明及图式所示,本实用新型较佳实施例者,并非以此局限本实用新型,是以,举凡与本实用新型的构造、装置、特征等近似或相雷同者,均应属本实用新型的创设目的及申请专利范围之内。

Claims (9)

1.一种发光二极管,其特征在于,其至少包含有:
一壳体,其壳体中设有支架,而壳体并形成至少有一凹坑状的容置部,其容置部并可使支架外露,该容置部边侧设有若干个不同倾斜角度的反射侧壁;
至少包含一支架可供置放发光芯片;
至少一发光芯片,设于支架上;
封装胶体,设置于容置部中。
2.如权利要求1所述的发光二极管,其特征在于,该容置部由底部向上设置的反射侧壁倾斜角度渐增。
3.如权利要求1所述的发光二极管,其特征在于,该容置部由底部向上设置的反射侧壁倾斜角度渐减。
4.如权利要求1所述的发光二极管,其特征在于,该容置部具有两两相对的第一、二边侧,该第一边侧的长度小于第二边侧,其反射侧壁则设置于第一边侧上。
5.如权利要求1所述的发光二极管,其特征在于,该容置部具有两两相对的第一、二边侧,该第一边侧的长度小于第二边侧,其反射侧壁则设置于第二边侧上。
6.如权利要求1所述的发光二极管,其特征在于,该容置部具有两两相对的第一、二边侧,该第一边侧的长度小于第二边侧,其反射侧壁则设置于第一、二边侧上。
7.如权利要求6所述的发光二极管,其特征在于,该第一、二边侧的若干反射侧壁形成相对应的倾斜角度。
8.如权利要求6所述的发光二极管,其特征在于,该第一、二边侧的若干反射侧壁形成不同的倾斜角度。
9.如权利要求1所述的发光二极管,其特征在于,该支架露出于壳体处设置有穿孔。
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US20110193110A1 (en) * 2008-07-01 2011-08-11 Advanced Optoelectronic Technology, Inc. Light emitting diode illuminating apparatus with same-type light emitting diodes
CN102460751A (zh) * 2009-06-05 2012-05-16 科锐公司 固态照明设备
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
CN106415864A (zh) * 2014-01-29 2017-02-15 皇家飞利浦有限公司 填充有密封剂的用于磷光体转换led的浅反射器杯
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US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
CN108028298A (zh) * 2015-09-24 2018-05-11 首尔伟傲世有限公司 发光元件及包括此的发光装置
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

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US20110193110A1 (en) * 2008-07-01 2011-08-11 Advanced Optoelectronic Technology, Inc. Light emitting diode illuminating apparatus with same-type light emitting diodes
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
CN102460751A (zh) * 2009-06-05 2012-05-16 科锐公司 固态照明设备
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
CN102460751B (zh) * 2009-06-05 2015-07-08 科锐公司 固态照明设备
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US10062819B2 (en) 2014-01-29 2018-08-28 Lumileds Llc Shallow reflector cup for phosphor-converted LED filled with encapsulant
CN106415864B (zh) * 2014-01-29 2019-06-14 亮锐控股有限公司 填充有密封剂的用于磷光体转换led的浅反射器杯
CN110265530A (zh) * 2014-01-29 2019-09-20 亮锐控股有限公司 填充有密封剂的用于磷光体转换led的浅反射器杯
CN106415864A (zh) * 2014-01-29 2017-02-15 皇家飞利浦有限公司 填充有密封剂的用于磷光体转换led的浅反射器杯
CN107431116A (zh) * 2015-03-18 2017-12-01 Lg伊诺特有限公司 发光器件和具有发光器件的相机模块
CN107431116B (zh) * 2015-03-18 2020-02-11 Lg伊诺特有限公司 发光器件和具有发光器件的相机模块
CN108028298A (zh) * 2015-09-24 2018-05-11 首尔伟傲世有限公司 发光元件及包括此的发光装置
CN108028298B (zh) * 2015-09-24 2020-01-17 首尔伟傲世有限公司 发光元件及包括此的发光装置
CN111129241A (zh) * 2015-09-24 2020-05-08 首尔伟傲世有限公司 发光元件及包括此的发光装置
CN107167986A (zh) * 2017-07-21 2017-09-15 深圳市泰衡诺科技有限公司上海分公司 闪光灯及电子设备

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