CN201041569Y

CN201041569Y - Removable vertical adaptation card

Info

Publication number: CN201041569Y
Application number: CNU2007200054613U
Authority: CN
Inventors: 苏仁彬
Original assignee: LIANSHENG SCIENCE AND TECHNOLOGY Co Ltd
Current assignee: LIANSHENG SCIENCE AND TECHNOLOGY Co Ltd
Priority date: 2007-04-29
Filing date: 2007-04-29
Publication date: 2008-03-26
Anticipated expiration: 2017-04-29

Abstract

The utility model relates to a detachable type vertical adapter card structure, and comprises a base plate; the base plate is provided with a holding groove for containing a probe needle holder, the probe needle holder and the base plate adopt a movable combination as the mutual connection, the base plate is provided with a first surface and a second surface opposite to the first surface, a plurality of bonding pads are respectively distributed on the probe needle holder and the base plate, the bonding pads adopt a wire jumper way as the mutual connection, and the probe needle holder can be assembled on and under the base plate or in the middle of the base plate according to different requirements, to achieve the purpose of wafer test; the interfaces assembled in a movable type are expanded and applied to the connection operation to the probe needle holders of various types.

Description

The vertical adapter of detachable

Technical field

The utility model is relevant with the probe adapter of wafer sort, is meant a kind of Vertrical probe adapter that can tear group fast open especially.

Background technology

After the wafer manufacturing is finished, must be correct via test again to guarantee its characteristic.And the general test wafer is to utilize a probe, its probe is made of a substrate (can be pcb board or other card extender) and a probe base, rely on the electrical specification that the probe of probe base and solder joint on the substrate are contacted after making described each probe and wafer contacting to be transmitted on the described substrate, detected by described board transport to tester table again.

But, because substrate is mainly in order to as probe on the probe base and the electrical conductivity media between tester table, therefore described substrate must have the solder joint that can be linked with the probe on the described probe base, but the combination of substrate and probe base mainly is through the alloying pellet of reflow stove with stanniferous lead at present, tin cream or be connected as shown in Figure 1 as the some solder joints 20 that are laid on substrate 10 and the probe base 30 with elastic conduction glue, but, the substrate of making in the mode of reflow applying solder joint is easy to generate the electrical specification loss and makes highly to control when contacting separately situations such as not good with probe, add the difficult quality monitoring, not only will cause the formation of too much defective products thus, and cause its manufacturing cost more and significantly improve.

Summary of the invention

Fundamental purpose of the present utility model is to provide a kind of vertical adapter structure of detachable that can tear group fast open and effectively reduce electric consume, can expand with the probe base of different circuit specifications in the mode of activity combination and to be linked, increasing the scope of its use, and then reduce and make required cost.

For achieving the above object, the technical solution adopted in the utility model is:

The vertical adapter structure of a kind of detachable is characterized in that: include: a substrate has a storage tank and can supply to be installed with a probe base, and is as mutual binding between described probe base and substrate with a movable combination.

Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be: can increase the scope of its use, and then reduce and make required cost.

Description of drawings

Fig. 1: the synoptic diagram of existing probe interface plate;

Fig. 2: the structural representation that is the utility model one preferred embodiment;

Fig. 3: the user mode synoptic diagram that is preferred embodiment shown in Figure 2;

Fig. 4: another user mode synoptic diagram that is preferred embodiment shown in Figure 2.

Description of reference numerals: 10-substrate; The 20-solder joint; The 30-probe base; The 50-probe base; The 51-weld pad; The 60-probe; The 70-substrate; The 71-storage tank; The 80-fixed block; The 81-nut; The 82-pad; The 83-screw; The 84-screw.

Embodiment

For being described in more detail feature of the present utility model, lifting preferred embodiment of the present utility model and cooperation now and illustrate following; Wherein:

See also Fig. 2, be that the utility model provides a preferred embodiment detachable vertical adapter structure, it consists predominantly of a substrate 70, be a storage tank 71 in the middle of having and can be used for being installed with a probe base 50, and described

probe base

50 and 70 of substrates and with an activity array mode as mutual binding; Wherein:

Described substrate 70 can be a pcb board or the made card extender of other material, have one first with opposing second in first, described substrate 70 and probe base 50 are with default respectively screw 84, and in order to screw 83 and nut 81 with probe base 50 lockings substrate 70 times, be laid with the weld pad 51 of some predetermined quantities and preset space length on described substrate 70 and the probe base 50 respectively, and described weld pad 51 is the weld pads 51 that are connected to probe base 50 in the wire jumper mode, so will effectively solve the disappearance that the existing probe made from reflow stove applying solder joint easily has electric consume.

Please continue to consult shown in Figure 3, another array mode of the present utility model, be to utilize screw 83 and nut 81 that probe base 50 is installed in substrate 70 upper ends, described probe base 50 is fixed on substrate 70 upper ends except adopting aforesaid way, also can use with epoxy resin it is pasted at substrate 70, because the board height of test wafer is fixed, but when meeting the probe 60 of long dimensions, because of height-limited so that can't finish the test of wafer smoothly, for thoroughly solving this phenomenon, the utility model is on structural design, be according to different usable range probe base 50 peaces to be placed on the pad 82 that has buffering or do not cushion of also arranging in pairs or groups on the substrate 70 to be locked, can give its height of suitable adjustment with the increase and decrease of pad 82 quantity simultaneously, then described long size probe 60 can be worn the purpose that reaches the contact probe of wafer to storage tank 71 belows, and it is different and influence overall progress so will no longer to be subject to institute's use probe specification.

See also shown in Figure 4, the vertical adapter structure of the utility model detachable, except probe base 50 can be placed on substrate 70 on, down, it is interior or middle also probe base 50 can be locked in admittedly storage tank 71, link the combination that a probe base 50 is arranged in the substrate 70 according to forming, its mainly be utilize an outward appearance be hollow tabular or be the fixed block 80 of a blocks with substrate 70 clampings between two plates, rely on the corresponding design in screw 84 positions with described probe base 50 and described substrate 70, make described probe base be able to firm lock knot in storage tank 71, in addition also can be at substrate 70, the salient point and the groove figure that can engage are set respectively on probe base 50 and the fixed block 80 not to be shown, strengthen fixing with screw 83 again or finish in order to epoxy resin bonding mode, though therefore probe base 50 is fixed on substrate 70 on, following or middle, described weld pad 51 all can be by finishing in the wire jumper mode with being connected of 51 of weld pads, formation has excellent electric characteristics, therefore no matter probe 60, substrate 70 or probe base 50 are in the use as can change immediately when meeting abnormal failure, reach the purpose of quick maintenance, the utility model can adjust with the sensing range of different product again, only need that the circuit specification of probe base 50 is made to change separately the design standard substrate 70 of arranging in pairs or groups again and link to enlarge and be applicable to different test specifications, reach the effective reduction manufacturing and the cost of getting the raw materials ready.

More than explanation is just illustrative for the utility model, and it is nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited, can make many modifications, variation or equivalence, but but all will fall within the claim restricted portion of the present utility model.

Claims

1. vertical adapter structure of detachable is characterized in that: include:

One substrate has a storage tank and can supply to be installed with a probe base, and is as mutual binding between described probe base and substrate with a movable combination.

2. the vertical adapter of detachable according to claim 1 is characterized in that: described substrate is a pcb board.

3. the vertical adapter of detachable according to claim 1 is characterized in that: described substrate, have one first with opposing second in first.

4. the vertical adapter of detachable according to claim 1, it is characterized in that: described probe base and substrate are laid with some weld pads respectively, and are as mutual binding in the wire jumper mode between described weld pad.

5. the vertical adapter of detachable according to claim 1, it is characterized in that: described movable combination more includes members such as screw, nut, fixed block, and described fixed block is a hollow plate or is a blocks that the screwhole position of screw of presetting on it and probe base, substrate is symmetrical.

6. the vertical adapter of detachable according to claim 1 is characterized in that: described movable combination is to be spirally connected with screw.

7. the vertical adapter of detachable according to claim 1 is characterized in that: described movable combination is binded with epoxy resin.

8. the vertical adapter of detachable according to claim 1 is characterized in that: described probe base is organized respectively and is located at the upper and lower or middle of substrate.