CN201039481Y - A remote infrared heating chip - Google Patents
A remote infrared heating chip Download PDFInfo
- Publication number
- CN201039481Y CN201039481Y CNU2006200678966U CN200620067896U CN201039481Y CN 201039481 Y CN201039481 Y CN 201039481Y CN U2006200678966 U CNU2006200678966 U CN U2006200678966U CN 200620067896 U CN200620067896 U CN 200620067896U CN 201039481 Y CN201039481 Y CN 201039481Y
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- China
- Prior art keywords
- cover plate
- heating
- upper cover
- lower cover
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a far infrared heating chip, comprising an upper cover plate, a lower cover plate and a heating unit, wherein, the heating unit is arranged between the upper cover plate and the lower cover plate; the upper cover plate, the heating unit and the lower cover plate are fixed together, and the heating unit is connected with a power supply lead. The utility model has good performances of heat emitting and heat storage, and effectively enhances the temperature radiation intensity of the heating material, thus providing better temperature feeling; furthermore, the utility model has the advantages of waterproof, oxidation resistance, pressure resistance, acid and alkali resistance, easy molding and long service life; the utility model is not only applicable to the electrical shoes which integrate drying, sterilizing and warming into a whole, but also applicable to various warm clothes as well as the instantaneous heating electric water heaters and other electric heating products.
Description
Technical field
The utility model relates to a kind of euthermic chip, particularly relates to a kind of far infrared heating chip.
Background technology
At present, various electronics footwear, warm-up is decorated with and electric heating series products such as immediate heating type electric heater, great majority adopt exothermic materials such as Electric radiant Heating Film, thermistor, heating wire, but these materials only play the effect of heating up, their thermal storage performance is poor, and the self-temperature radiation intensity is low, and non-watertight and anti-oxidation, withstand voltage and acid-proof alkaline is poor, useful life is short.
The utility model content
The purpose of this utility model provides the far infrared heating chip that a kind of thermal storage performance well, effectively promotes exothermic material self-temperature radiation intensity and long service life.
The purpose of this utility model realizes by following technical measures: a kind of far infrared heating chip, comprise upper cover plate, lower cover slip and heater, described heater is arranged between upper cover plate and the lower cover slip, upper cover plate, heater and lower cover slip are fixed together, and heater is connected with power lead.
Described upper cover plate, heater and lower cover slip are fixed together by injection moulding or bonding mode.
Described power lead is connected with plug.
Described upper cover plate and lower cover slip are film.Described film is formed by rubber, silica gel or other various flexible glues and far-infrared material fusion.
Described heater is sheet-shaped heating element or linear heating element.Described sheet-shaped heating element is thermistor or metal heating sheet; Described linear heating element is carbon fiber or metal heating wire.
Of the present utility model have a good heating thermal storage performance, effectively promotes exothermic material self-temperature radiation intensity, makes temperature sensation better, and have waterproof, anti-oxidation, withstand voltage, acid and alkali-resistance; Body is cast easily, long service life; Both can be used for oven dry, sterilization, heating integrated electric footwear, also can various warming dress ornaments, and electric heating series products such as immediate heating type electric heater.
Description of drawings
Fig. 1 is the overall schematic of the utility model embodiment one;
Fig. 2 be embodiment one decomposing schematic representation;
Fig. 3 is the overall schematic of the utility model embodiment two;
Fig. 4 is the decomposing schematic representation of embodiment two.
Embodiment
Embodiment one:
Far infrared heating chip as shown in Figure 1, 2, be an embodiment of the present utility model, comprise upper cover plate 1, lower cover slip 2 and heater 3, described heater 3 is arranged between upper cover plate 1 and the lower cover slip 2, upper cover plate 1, heater 3 and lower cover slip 2 are fixed together by the injection moulding mode, and heater 3 is connected with power lead 4.Described upper cover plate 1 and lower cover slip 2 are the oval film of class, all outwards protrude at the edge of identical position, corresponding one side of two films to form a projection 6.The hole 7 that two parallel distributions are arranged on upper cover plate 1 projection 6.Described heater 3 is the heating wire, described wire coiled " H " shape, and the two ends of metal are welded with two joints 8 respectively, and are connected on the plug 5 by lead 4, and described joint 8 matches with hole 7, and joint 8 is installed in 7 li in hole.
Embodiment two:
Far infrared heating chip shown in Fig. 3,4 is another embodiment of the present utility model.Different with embodiment one is described upper cover plate 1, heater 3 and lower cover slip 2 are fixed together by bonding mode; Described heater 3 is a sheet, and it can be thermistor or metal heating sheet.
Claims (7)
1. far infrared heating chip, it is characterized in that: comprise upper cover plate (1), lower cover slip (2) and heater (3), described heater (3) is arranged between upper cover plate (1) and the lower cover slip (2), upper cover plate (1), heater (3) and lower cover slip (2) are fixed together, and heater (3) is connected with power lead (4).
2. euthermic chip according to claim 1 is characterized in that: described upper cover plate (1), heater (3) and lower cover slip (2) are fixed together by injection moulding or bonding mode.
3. euthermic chip according to claim 2 is characterized in that: described power lead (4) is connected with plug (5).
4. euthermic chip according to claim 1 is characterized in that: described upper cover plate (1) and lower cover slip (2) are film.
5. euthermic chip according to claim 1 is characterized in that: described heater (3) is sheet-shaped heating element or linear heating element.
6. euthermic chip according to claim 5 is characterized in that: described sheet-shaped heating element (3) is thermistor or metal heating sheet.
7. euthermic chip according to claim 5 is characterized in that: described linear heating element (3) is carbon fiber or metal heating wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200678966U CN201039481Y (en) | 2006-11-21 | 2006-11-21 | A remote infrared heating chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200678966U CN201039481Y (en) | 2006-11-21 | 2006-11-21 | A remote infrared heating chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201039481Y true CN201039481Y (en) | 2008-03-19 |
Family
ID=39212010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006200678966U Expired - Fee Related CN201039481Y (en) | 2006-11-21 | 2006-11-21 | A remote infrared heating chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201039481Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103347315A (en) * | 2013-06-29 | 2013-10-09 | 周琳 | Heating silicon sheet and manufacturing method thereof |
| CN103476157A (en) * | 2013-09-18 | 2013-12-25 | 苏州赛斯德工程设备有限公司 | Heat-emitting chip |
| CN104219800A (en) * | 2014-09-27 | 2014-12-17 | 戴国群 | Flexible butterfly waterproof carbon fiber heating sheet and preparation method thereof |
| CN106535368A (en) * | 2016-11-26 | 2017-03-22 | 顾凯 | Heating plate |
-
2006
- 2006-11-21 CN CNU2006200678966U patent/CN201039481Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103347315A (en) * | 2013-06-29 | 2013-10-09 | 周琳 | Heating silicon sheet and manufacturing method thereof |
| CN103476157A (en) * | 2013-09-18 | 2013-12-25 | 苏州赛斯德工程设备有限公司 | Heat-emitting chip |
| CN104219800A (en) * | 2014-09-27 | 2014-12-17 | 戴国群 | Flexible butterfly waterproof carbon fiber heating sheet and preparation method thereof |
| CN104219800B (en) * | 2014-09-27 | 2015-12-02 | 戴国群 | A kind of flexible dish-shaped water repellent carbon fiber heating sheet and preparation method thereof |
| CN106535368A (en) * | 2016-11-26 | 2017-03-22 | 顾凯 | Heating plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080319 Termination date: 20101121 |